Abstract: A coil device includes a coil and a chip capacitor. A coil wire is wound around the coil. The chip capacitor has an electrode surface. The electrode surface is electrically connected to the coil. A connecting portion is a partial length region of the coil wire extracted from the coil. The connecting portion is directly connected to the electrode surface.

Abstract: A method for manufacturing an antenna device comprises melting a brazing material and a removing a part of an insulating film. The antenna device includes an antenna portion formed by winding a coil wire having a coil core covered with the insulating film, and a base having a pad portion to which a part of the coil wire is brazed with the brazing material. In melting the brazing material, the brazing material supplied onto the pad portion is irradiated with a laser beam so that the brazing material melts. In removing a part of the insulating film, the coil wire is immersed in the molten brazing material so that a part of the insulating film is removed from the coil wire, and the coil wire and the pad portion are joined with the brazing material.

Abstract: A coil component, in which the axial direction length including a gap and a coupling part of two coil elements is shortened for size reduction, and deterioration in characteristics and the risk of heat generation that could occur when the leakage magnetic flux comes into contact with a twisted portion can be reduced; a coil device; and a method for producing the coil component. The component includes: first and second coil elements formed from a coil winding body obtained by rectangularly stacking one rectangular wire in an edge-wise manner, which is divided into two and folded back, and in which the opposing side surfaces of the are disposed to be parallel and in close contact; and a coupling part that couples the coil elements, which straddles the upper surfaces of both coil elements. The coupling part includes, at one portion, a twisted section where the rectangular wire is twisted 180°.

Abstract: An electronic component evaluation method of evaluating a state of an electronic component includes acquiring reference point information, with respect to at least one terminal, reference point information including at least one of position information and first height information of a plurality of corresponding reference points on the terminal from imaging data obtained by image-capturing the electronic component including a component body and a plurality of terminals attached to the component body, and determining a state according to a shape of the electronic component based on a plurality of pieces of the reference point information.

Abstract: An electronic component inspection apparatus includes: a holding unit that holds an electronic component having a component body and terminals; light sources and reflection plates that irradiate reflected light at least on the terminals of the electronic component held by the holding unit, from the side of a back face opposite to a mounting face of the electronic component; a camera that captures an image of the electronic component under irradiation of the reflected light, from the side of the mounting face; and a control unit that controls processing related to inspection of the electronic component, on the basis of the image of the electronic component captured by the camera.

Abstract: An electronic component evaluation method is provided for evaluating an electronic component. The electronic component has a lower surface facing a mounting substrate, an upper surface having a flat main surface, and a plurality of mounting terminals configured to be mounted on the mounting substrate. The method includes the steps of: obtaining terminal position information of the plurality of mounting terminals; generating a reference plane including at least three of the plurality of mounting terminals in response to the terminal position information; and detecting a height of at least one of the upper surface or the lower surface relative to the reference plane.

Abstract: An electronic component inspection apparatus includes: a holding unit that holds an electronic component having a component body and terminals; light sources and reflection plates that irradiate reflected light at least on the terminals of the electronic component held by the holding unit, from the side of a back face opposite to a mounting face of the electronic component; a camera that captures an image of the electronic component under irradiation of the reflected light, from the side of the mounting face; and a control unit that controls processing related to inspection of the electronic component, on the basis of the image of the electronic component captured by the camera.

Abstract: An electronic component evaluation method of evaluating a state of an electronic component includes acquiring reference point information, with respect to at least one terminal, reference point information including at least one of position information and first height information of a plurality of corresponding reference points on the terminal from imaging data obtained by image-capturing the electronic component including a component body and a plurality of terminals attached to the component body, and determining a state according to a shape of the electronic component based on a plurality of pieces of the reference point information.

Abstract: An electronic component evaluation method is provided for evaluating an electronic component. The electronic component has a lower surface facing a mounting substrate, an upper surface having a flat main surface, and a plurality of mounting terminals configured to be mounted on the mounting substrate. The method includes the steps of: obtaining terminal position information of the plurality of mounting terminals; generating a reference plane including at least three of the plurality of mounting terminals in response to the terminal position information; and detecting a height of at least one of the upper surface or the lower surface relative to the reference plane.

Abstract: A flatness detection method is provided for detecting component tilt regardless of measurement conditions. The flatness detection method is based on data of an electronic component captured by a 3D camera and is realized by acquiring position information and height information of a plurality of reference points of the electronic component, creating a virtual plane based on the position and the height information of at least three of the plurality of reference points, determining, based on the height information that takes, as a reference, the virtual plane of the reference points excluding selected points from the reference points, whether the virtual plane is a valid plane or an invalid plane, and detecting flatness of the component by taking the valid plane as a reference.

Abstract: A flatness detection method is provided for detecting component tilt regardless of measurement conditions. The flatness detection method is based on data of an electronic component captured by a 3D camera and is realized by acquiring position information and height information of a plurality of reference points of the electronic component, creating a virtual plane based on the position and the height information of at least three of the plurality of reference points, determining, based on the height information that takes, as a reference, the virtual plane of the reference points excluding selected points from the reference points, whether the virtual plane is a valid plane or an invalid plane, and detecting flatness of the component by taking the valid plane as a reference.