Abstract: A thermosetting urethane resin composition having excellent self-healing properties, antifouling properties, and elongation, a film including a curable coating of the thermosetting urethane resin composition, and a product including the film are provided. The thermosetting urethane resin composition contains a main agent containing a urethane prepolymer and an organic solvent and a curing agent. The urethane prepolymer contains a composition containing a polyol, a polyisocyanate, and a chain extender and has a hydroxy group at an end. The polyol contains a polyol having no aromatic ring. The polyol having no aromatic ring contains liquid and solid polycarbonate polyols. The polyisocyanate contains a polyisocyanate having no aromatic ring. The chain extender contains a low molecular weight triol. The curing agent contains triisocyanate. The percentage of the total amount of the low molecular weight triol and the triisocyanate is 10 mass % or higher and 35 mass % or lower.

Abstract: A thermosetting urethane resin composition having excellent self-healing properties, antifouling properties, and elongation, a film including a curable coating of the thermosetting urethane resin composition, and a product including the film are provided. The thermosetting urethane resin composition contains a main agent containing a urethane prepolymer and an organic solvent and a curing agent. The urethane prepolymer contains a composition containing a polyol, a polyisocyanate, and a chain extender and has a hydroxy group at an end. The polyol contains a polyol having no aromatic ring. The polyol having no aromatic ring contains liquid and solid polycarbonate polyols. The polyisocyanate contains a polyisocyanate having no aromatic ring. The chain extender contains a low molecular weight triol. The curing agent contains triisocyanate. The percentage of the total amount of the low molecular weight triol and the triisocyanate is 10 mass % or higher and 35 mass % or lower.

Abstract: An active-energy-ray-curable hot-melt urethane resin composition contains a hot-melt urethane and an active energy ray polymerization initiator, the hot-melt urethane being obtained by converting more than 50% and 100% or less of the total number of isocyanate groups in an isocyanate group-terminated urethane prepolymer into terminal (meth)acryloyl groups by a reaction with hydroxyl groups in a reactive functional group-containing (meth)acrylic compound, the isocyanate group-terminated urethane prepolymer being obtained by reacting a polyisocyanate component with a polyol component that contains an aromatic polyester polyol containing a 2,2-dimethyl-1,3-propylene structure in its molecule in an amount of 90% by mole or more of a glycol component and a polyol other than the aromatic polyester polyol.

Abstract: A radical-curable hot-melt urethane resin composition includes 100 parts by mass of a hot-melt urethane (X) having a (meth)acryloyl group and 0.5 to 5.0 parts by mass of a radical polymerization initiator (Y), wherein the hot-melt urethane (X) is obtained by introducing, using a (meth)acrylate compound (D) having an active-hydrogen-containing group, a (meth)acryloyl group into a hot-melt urethane prepolymer (C) that has isocyanate groups at its terminals and is obtained by a reaction of a polyol (A) and an alicyclic polyisocyanate (B), the polyol (A) containing an aliphatic polycarbonate polyol (a1), an alicyclic polycarbonate polyol (a2), or an aliphatic polyether polyol (a3), in an amount of more than 50 mol % and 100 mol % or less of the total number of isocyanate groups of the urethane prepolymer (C).

Abstract: A radical-curable hot-melt urethane resin composition includes 100 parts by mass of a hot-melt urethane (X) having a (meth)acryloyl group and 0.5 to 5.0 parts by mass of a radical polymerization initiator (Y), wherein the hot-melt urethane (X) is obtained by introducing, using a (meth)acrylate compound (D) having an active-hydrogen-containing group, a (meth)acryloyl group into a hot-melt urethane prepolymer (C) that has isocyanate groups at its terminals and is obtained by a reaction of a polyol (A) and an alicyclic polyisocyanate (B), the polyol (A) containing an aliphatic polycarbonate polyol (a1), an alicyclic polycarbonate polyol (a2), or an aliphatic polyether polyol (a3), in an amount of more than 50 mol % and 100 mol % or less of the total number of isocyanate groups of the urethane prepolymer (C).

Abstract: An active-energy-ray-curable hot-melt urethane resin composition contains a hot-melt urethane and an active energy ray polymerization initiator, the hot-melt urethane being obtained by converting more than 50% and 100% or less of the total number of isocyanate groups in an isocyanate group-terminated urethane prepolymer into terminal (meth)acryloyl groups by a reaction with hydroxyl groups in a reactive functional group-containing (meth)acrylic compound, the isocyanate group-terminated urethane prepolymer being obtained by reacting a polyisocyanate component with a polyol component that contains an aromatic polyester polyol containing a 2,2-dimethyl-1,3-propylene structure in its molecule in an amount of 90% by mole or more of a glycol component and a polyol other than the aromatic polyester polyol.

Abstract: A wafer polishing method, in which the outer circumferential edge of a polishing member is first cut by a cutting tool fixed to a table base, thereby forming the polishing member into a completely round shape and also positioning the polishing member in a Y direction at a Y-directional reference position of the table base. Thereafter, a polishing unit is once lifted in the condition where the table base remains still at the reference position. Thereafter, the table base is horizontally moved toward a column in the Y direction to thereby position the polishing member in the Y direction so that only a peripheral portion of the wafer is polished by the polishing member. At this time, the horizontal travel of the table base is preliminarily obtained from the Y-directional positional relation between the cutting tool and the wafer held on a chuck table and from the width of the peripheral portion to be polished.

Abstract: A wafer polishing method, in which the outer circumferential edge of a polishing member is first cut by a cutting tool fixed to a table base, thereby forming the polishing member into a completely round shape and also positioning the polishing member in a Y direction at a Y-directional reference position of the table base. Thereafter, a polishing unit is once lifted in the condition where the table base remains still at the reference position. Thereafter, the table base is horizontally moved toward a column in the Y direction to thereby position the polishing member in the Y direction so that only a peripheral portion of the wafer is polished by the polishing member. At this time, the horizontal travel of the table base is preliminarily obtained from the Y-directional positional relation between the cutting tool and the wafer held on a chuck table and from the width of the peripheral portion to be polished.