Patents by Inventor Daichi Himeno

Daichi Himeno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device in a single package with high wiring density and a heat sink
    Patent number: 5434449
    Abstract: There is disclosed a semiconductor device wherein an insulating layer (10) is formed on the reverse face of a lead frame (1), and a heat sink (200) is formed on the reverse face of the insulating layer (10). Transfer molding is carried out such that the reverse face of the heat sink (200) is exposed. The lead frame (1) is insulated from the heat sink (200) by the insulating layer (10). When the semiconductor device is mounted on a conductive external mounting base plate, it is unnecessary to insulate the semiconductor device from the external mounting base plate. This simplifies the process of mounting the semiconductor device on the external mounting base plate.
    Type: Grant
    Filed: August 4, 1994
    Date of Patent: July 18, 1995
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Daichi Himeno, Hazime Kato