Patents by Inventor Daichi KIKUCHI

Daichi KIKUCHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Layered solder material for bonding different species of electrodes and method of bonding the different species of electrodes in an electronic component
    Patent number: 9669493
    Abstract: When soldering a package having an electrode on which Ni/Au or Ag—Pd alloy is plated, to a printed circuit board having a Cu electrode or an electrode on which Cu is plated, a solid-phase diffusion layer is formed within a layered solder material for bonding different species of electrodes. The layered solder material is composed of a solder material of Sn—Ag—Cu series or Sn—Sb series and a solder material of Sn—Ag—Cu—Ni series or Sn—Pb series. The electrode on which Ni/Au or Ag—Pd alloy is plated and the Cu electrode or the electrode on which Cu is plated are soldered with the solder material of Sn—Ag—Cu series or Sn—Sb series being attached to the Cu electrode and the solder material of Sn—Ag—Cu—Ni series or Sn—Cu series being attached to the electrode on which Ni/Au or Ag—Pd alloy is plated. This restrains formation of intermetallic compounds and provides high bonding reliability.
    Type: Grant
    Filed: November 18, 2013
    Date of Patent: June 6, 2017
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Koji Watanabe, Minoru Toyoda, Satoshi Tomita, Tsutomu Sugino, Daichi Kikuchi, Hiroki Oshima
  • LAYERED SOLDER MATERIAL FOR BONDING DISSIMILAR ELECTRODES, AND METHOD FOR BONDING DISSIMILAR ELECTRODES TO ELECTRONIC COMPONENTS
    Publication number: 20150314396
    Abstract: When soldering a package having an electrode on which Ni/Au or Ag—Pd alloy is plated, to a printed circuit board having a Cu electrode or an electrode on which Cu is plated, a solid-phase diffusion layer is formed within a layered solder material for bonding different species of electrodes. The layered solder material is composed of a solder material of Sn—Ag—Cu series or Sn—Sb series and a solder material of Sn—Ag—Cu—Ni series or Sn—Pb series. The electrode on which Ni/Au or Ag—Pd alloy is plated and the Cu electrode or the electrode on which Cu is plated are soldered with the solder material of Sn—Ag—Cu series or Sn—Sb series being attached to the Cu electrode and the solder material of Sn—Ag—Cu—Ni series or Sn—Cu series being attached to the electrode on which Ni/Au or Ag—Pd alloy is plated. This restrains formation of intermetallic compounds and provides high bonding reliability.
    Type: Application
    Filed: November 18, 2013
    Publication date: November 5, 2015
    Inventors: Koji WATANABE, Minoru TOYODA, Satoshi TOMITA, Tsutomu SUGINO, Daichi KIKUCHI, Hiroki OSHIMA