Abstract: A vehicle control apparatus for performing autonomous driving of a host vehicle. The vehicle control apparatus includes an operating section information acquisition unit configured to acquire operating section information that is information of an operating section in which vehicle stability control by brake control has been operated in a vehicle in autonomous driving in the past; an operation plan generation unit configured to generate an operation plan of autonomous driving of the host vehicle based on a preset target route and map information; and a vehicle controller configured to perform autonomous driving along the operation plan, wherein the operation plan generation unit generates the operation plan so that the host vehicle does not stop in the operating section.

Abstract: A distal end unit of an endoscope includes: a distal end frame body that is constituted by a resin molded article configuring a molded interconnect device, that is provided with an image pickup unit containing room, and that is provided with an observation opening portion that opens the image pickup unit containing room on a distal end surface exposed to an exterior; a metal layer that is provided along a flat surface of the observation opening portion; a cover glass that closes the observation opening portion; a solder layer that is bonded to the metal layer and that holds the cover glass on the distal end frame body; and an adhesive layer that covers the solder layer, the metal layer is provided at a position corresponding to a groove provided on the flat surface, and the solder layer is disposed in an interior of the groove.

Abstract: An endoscope includes an imager unit loading region provided at a distal end portion of an insertion portion, a cable connection surface, a wall provided to connect an opening of the imager unit loading region and an opening of the cable connection surface to each other, a contact pattern formed on a wall surface of the imager unit loading region, a wiring pattern formed on a front surface of the cable connection surface from the wall, a connection pattern formed on the cable connection surface, and a through-electrode formed in the wall so that the imager unit loading region and the cable connection surface communicate with each other, configured to cause the contact pattern and the wiring pattern to electrically continue to each other, and formed at a predetermined angle with respect to a center axis of the distal end barrel member.

Abstract: A distal end frame includes: a first distal end frame member that includes a resin molded product which constitutes a molded interconnect device; a housing chamber that is provided on a distal end side of the first distal end frame member, and is formed of a recessed portion a distal end and one side of which are opened; a second distal end frame member that is composed of the resin molded product constituting the molded interconnect device, and is configured to close the one side of the housing chamber; a signal pattern that is the metal pattern formed in a region including a first joining surface which is a joining surface with the second distal end frame member, on a surface of the first distal end frame member; and a solder material which is configured to join the first distal end frame member and the second distal end frame member.

Abstract: A distal end frame includes: a distal end frame body including a resin molded product; an image pickup unit housing chamber formed of a bottomed hole with an opening which is formed on a distal end surface of the distal end frame body; a through hole penetrating from a bottom face of the image pickup unit housing chamber to a proximal end side of the distal end frame body; a mounting face formed on the bottom face of the image pickup unit housing chamber; an inclined face that is formed in a region containing a part of an inner wall face of the through hole to be adjacent to the mounting face, and is visible through the opening; and a wiring pattern that is formed of the metal pattern constituting the molded interconnect device, and is continuously formed in a region containing the mounting face and the inclined face.

Abstract: An electronic module includes: a mount table including a first electrode mounting surface on which an electronic component is mounted; a plurality of electrode mount parts that are formed in the mount table and at which lands corresponding to a plurality of respective electrodes of the electronic component are formed on the first electrode mounting surface; a step part located between the plurality of electrode mount parts and including a predetermined step relative to the first electrode mounting surface of the mount table; and a solder withdrawing part at which an end part of a corresponding one of the lands is extended to the step part or a side surface of the mount table.

Abstract: An endoscope includes an imager unit loading region provided on a distal end side of a distal end barrel member provided at a distal end portion of an insertion portion and formed of a resin material, a cable connection surface provided on a proximal end side, a wall provided to connect an opening of the imager unit loading region and an opening of the cable connection surface, a contact pattern formed on a wall surface, a wiring pattern formed on a front surface of the cable connection surface from the wall, and configured to electrically continue to the contact pattern, and a connection pattern formed on the cable connection surface, and configured to electrically continue to the wiring pattern, with a core wire of a cable being electrically connected to the connection pattern, in a space formed in the distal end portion by the cable connection surface.

Abstract: An endoscope includes an imager unit loading region provided at a distal end portion of an insertion portion, a cable connection surface, a wall provided to connect an opening of the imager unit loading region and an opening of the cable connection surface to each other, a contact pattern formed on a wall surface of the imager unit loading region, a wiring pattern formed on a front surface of the cable connection surface from the wall, a connection pattern formed on the cable connection surface, and a through-electrode formed in the wall so that the imager unit loading region and the cable connection surface communicate with each other, configured to cause the contact pattern and the wiring pattern to electrically continue to each other, and formed at a predetermined angle with respect to a center axis of the distal end barrel member.

Abstract: A distal end frame includes: a first distal end frame member that includes a resin molded product which constitutes a molded interconnect device; a housing chamber that is provided on a distal end side of the first distal end frame member, and is formed of a recessed portion a distal end and one side of which are opened; a second distal end frame member that is composed of the resin molded product constituting the molded interconnect device, and is configured to close the one side of the housing chamber; a signal pattern that is the metal pattern formed in a region including a first joining surface which is a joining surface with the second distal end frame member, on a surface of the first distal end frame member; and a solder material which is configured to join the first distal end frame member and the second distal end frame member.

Abstract: A distal end frame includes: a distal end frame body including a resin molded product; an image pickup unit housing chamber formed of a bottomed hole with an opening which is formed on a distal end surface of the distal end frame body; a through hole penetrating from a bottom face of the image pickup unit housing chamber to a proximal end side of the distal end frame body; a mounting face formed on the bottom face of the image pickup unit housing chamber; an inclined face that is formed in a region containing a part of an inner wall face of the through hole to be adjacent to the mounting face, and is visible through the opening; and a wiring pattern that is formed of the metal pattern constituting the molded interconnect device, and is continuously formed in a region containing the mounting face and the inclined face.

Abstract: A distal end unit includes: an image pickup unit made using a wafer level optics technique; a distal end frame forming an external shape of an insertion portion, the distal end frame being constituted by a resin molded article; an image pickup unit containing room containing the image pickup unit in an interior of the distal end frame, the image pickup unit containing room including a first opening portion and a second opening portion that are continuously formed, the first opening portion being positioned on the distal end surface of the distal end frame, the second opening portion being positioned on a side surface of the distal end frame; and a filler having light blocking property, the image pickup unit containing room being filled with the filler, the filler forming the external shape of a distal end portion with the distal end frame.

Abstract: A distal end unit of an endoscope includes: a distal end frame body that is constituted by a resin molded article configuring a molded interconnect device, that is provided with an image pickup unit containing room, and that is provided with an observation opening portion that opens the image pickup unit containing room on a distal end surface exposed to an exterior; a metal layer that is provided along a flat surface of the observation opening portion; a cover glass that closes the observation opening portion; a solder layer that is bonded to the metal layer and that holds the cover glass on the distal end frame body; and an adhesive layer that covers the solder layer, the metal layer is provided at a position corresponding to a groove provided on the flat surface, and the solder layer is disposed in an interior of the groove.

Abstract: An image processing device includes a main memory, a parameter register, an image processor, and a parameter transfer unit. The main memory stores therein a parameter used in image processing. The parameter register temporarily stores therein the parameter. The image processor executes the image processing on image data by using the parameter stored in the parameter register. The parameter transfer unit transfers the parameter stored in the main memory to the parameter register during a period in which the image processing is not executed.

Abstract: An image processing device includes a main memory, a parameter register, an image processor, and a parameter transfer unit. The main memory stores therein a parameter used in image processing. The parameter register temporarily stores therein the parameter. The image processor executes the image processing on image data by using the parameter stored in the parameter register. The parameter transfer unit transfers the parameter stored in the main memory to the parameter register during a period in which the image processing is not executed.