Abstract: A photosensitive polyimide resin composition containing: a ring-closed polyimide resin (A) having a structure represented by Formula (1) and a weight average molecular weight of 70000 or less; and a polyfunctional radically polymerizable compound (B) having 4 or more and 100 or less radically polymerizable functional groups.

Abstract: A method for producing a patterned substrate, including: step (a) of forming a film composed of a photosensitive polyimide resin composition on a substrate; step (b) of exposing the film; and step (c) of developing the exposed film using a developer to form a pattern formed of the film on the substrate, wherein a relative energy difference (RED) between the developer and the film before exposure is 0.50 or greater and 1.4 or less.

Abstract: A photosensitive polyimide resin composition containing: a ring-closed polyimide resin (A) having a structure represented by Formula (1); and a polyfunctional radically polymerizable compound (B) having radically polymerizable functional groups and oxyalkylene groups, wherein a number of the radically polymerizable functional groups in the polyfunctional radically polymerizable compound (B) is 3 or greater and 100 or less, and wherein a total number of moles of the oxyalkylene groups added in the polyfunctional radically polymerizable compound (B) is 5 or greater and 100 or less.

Abstract: A modified polyimide resin containing a structure represented by general formula (I) below. A polyimide resin containing: a structural unit A derived from a tetracarboxylic dianhydride; and a structural unit B derived from a diamine compound, wherein the structural unit A contains a structural unit derived from a compound having a specific structure in a proportion of 60 mol % or greater.

Abstract: A photosensitive resin composition including a polyimide resin (A) having a specific structure and a weight average molecular weight of 70000 or less is provided.