Patents by Inventor Daichi Miyazaki

Daichi Miyazaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12060457
    Abstract: A resin composition for display substrates includes the following: the resin (a): a resin containing, as a main component, a repeating unit represented by the chemical formula (1), wherein the resin contains the total of 95 mass % or more of a tetracarboxylic acid residue A, having 2 or more carbon atoms and an SP value of 15 or more and 17 or less and a diamine residue having an SP value of 11 or more and 13 or less with respect to the total of 100 mass % of A and B contained in the resin; the solvent (b): a solvent having an SP value of 7.5 or more and less than 9.5; and the solvent (c): a solvent having an SP value of 9.5 or more and 14.0 or less; wherein R1 and R2 independently represent a hydrogen atom, hydrocarbon group having 1 to 10 carbon atoms, alkylsilyl group having 1 to 10 carbon atoms, alkali metal ion, ammonium ion, imidazolium ion, or pyridinium ion.
    Type: Grant
    Filed: January 9, 2019
    Date of Patent: August 13, 2024
    Assignee: Toray Industries, Inc.
    Inventors: Tomoki Ashibe, Daichi Miyazaki
  • Publication number: 20230167252
    Abstract: The present invention provides a resin film that is less likely to suffer peeling or creasing of a layer formed on the resin film in a high temperature process for producing a device and that can be used suitably to produce a product that requires transparency, where the resin film comprises a resin that has a repeating unit as represented by the chemical formula (1) and has a light transmittance of 68% or more at a wavelength of 400 nm, a glass transition temperature of 370° C. or more, and a weight loss starting temperature of 440° C. or more, where in the chemical formula (1), A denotes a tetravalent tetracarboxylic acid residue containing 2 or more carbon atoms and B denotes a divalent diamine residue containing 2 or more carbon atoms.
    Type: Application
    Filed: March 22, 2021
    Publication date: June 1, 2023
    Applicant: Toray Industries, Inc.
    Inventors: Tomoki Ashibe, Daichi Miyazaki, Mitsuhito Suwa
  • Patent number: 11652220
    Abstract: The present embodiment is a fuel cell including a stacked body of single cells each of which includes a power generating unit and separators disposed on both surfaces of the power generating unit, in which the separators each include a metal base material, a carbon layer made of carbon and formed on a first surface of the metal base material on a power generating unit side, and a titanium nitride layer made of titanium nitride and formed on a second surface of the metal base material opposite to the first surface.
    Type: Grant
    Filed: August 23, 2021
    Date of Patent: May 16, 2023
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Daichi Miyazaki, Masaki Hirano, Hitoshi Tanino, Tomonari Kogure
  • Publication number: 20230137230
    Abstract: A device substrate is provided with an increased light transmittance that is a resin film resistant to thermal decomposition in high temperature processes, along with a production method for a device substrate, a device, and a production method for a device, where a resin composition designed to produce a resin film to be used as a substrate for a display device or light receiving device, comprises (a) a resin that has a repeating unit as represented by the chemical formula (1) or (2) as a primary component and (b) a chemical compound as represented by the chemical formula (3) and/or a condensation product thereof, wherein in the chemical formulae (1) and (2), X, Y, R1 and R2 are defined, and Si(OR11)n(R12)4-n??(3) wherein in the chemical formula (3), R11 and R12 are as defined.
    Type: Application
    Filed: March 22, 2021
    Publication date: May 4, 2023
    Applicant: Toray Industries, Inc.
    Inventors: Daichi Miyazaki, Tomoki Ashibe
  • Publication number: 20220336761
    Abstract: A resin film according to one aspect of the present invention contains polyimide, and satisfies the condition “the electric charge change in film after irradiation with a light having a wavelength of 470 nm and an intensity of 4.0 ?W/cm2 for 30 minutes relative to before irradiation with the light is 1.0×1016 cm?3 or less.” Such a resin film can be used as a substrate for a semiconductor element to form an electronic device including the resin film, and a semiconductor element formed on the resin film.
    Type: Application
    Filed: September 14, 2020
    Publication date: October 20, 2022
    Applicant: Toray Industries, Inc.
    Inventors: Tomoki Ashibe, Daichi Miyazaki, Takuya Miyauchi
  • Publication number: 20220109163
    Abstract: The present embodiment is a fuel cell including a stacked body of single cells each of which includes a power generating unit and separators disposed on both surfaces of the power generating unit, in which the separators each include a metal base material, a carbon layer made of carbon and formed on a first surface of the metal base material on a power generating unit side, and a titanium nitride layer made of titanium nitride and formed on a second surface of the metal base material opposite to the first surface.
    Type: Application
    Filed: August 23, 2021
    Publication date: April 7, 2022
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Daichi MIYAZAKI, Masaki HIRANO, Hitoshi TANINO, Tomonari KOGURE
  • Publication number: 20210005636
    Abstract: A resin film used as a support substrate of a thin film transistor is described where the resin film contains a heat-resistant resin and a predetermined face of the resin film has a sheet resistance of more than 1×1012? and less than 1×1016?. The resin film is less likely to have foreign substances stuck thereto, and thus, can inhibit damage caused to a TFT element by gas emitted from foreign substances in high-temperature processes. The resin film can also be provided as a support substrate of a thin film transistor in a display.
    Type: Application
    Filed: March 22, 2019
    Publication date: January 7, 2021
    Applicant: Toray Industries, Inc.
    Inventors: Tomoki Ashibe, Daichi Miyazaki
  • Publication number: 20200339754
    Abstract: A resin composition for display substrates includes the following: the resin (a): a resin containing, as a main component, a repeating unit represented by the chemical formula (1), wherein the resin contains the total of 95 mass % or more of a tetracarboxylic acid residue A, having 2 or more carbon atoms and an SP value of 15 or more and 17 or less and a diamine residue having an SP value of 11 or more and 13 or less with respect to the total of 100 mass % of A and B contained in the resin; the solvent (b): a solvent having an SP value of 7.5 or more and less than 9.5; and the solvent (c): a solvent having an SP value of 9.5 or more and 14.0 or less; wherein R1 and R2 independently represent a hydrogen atom, hydrocarbon group having 1 to 10 carbon atoms, alkylsilyl group having 1 to 10 carbon atoms, alkali metal ion, ammonium ion, imidazolium ion, or pyridinium ion.
    Type: Application
    Filed: January 9, 2019
    Publication date: October 29, 2020
    Applicant: Toray Industries, Inc.
    Inventors: Tomoki Ashibe, Daichi Miyazaki
  • Patent number: 10590306
    Abstract: A resin composition for a display substrate, the resin composition including a solvent and a heat-resistant resin or a precursor thereof, wherein the solvent has as a main component an amide compound having a surface tension of 35 mN/m or less at 25° C. Provided is a resin composition for a display substrate, whereby pinholing of a thin film is not prone to occur.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: March 17, 2020
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Tomoki Ashibe, Daichi Miyazaki, Koji Ueoka, Akinori Saeki, Masahito Nishiyama
  • Publication number: 20190055428
    Abstract: A resin composition for a display substrate, the resin composition including a solvent and a heat-resistant resin or a precursor thereof, wherein the solvent has as a main component an amide compound having a surface tension of 35 mN/m or less at 25° C. Provided is a resin composition for a display substrate, whereby pinholing of a thin film is not prone to occur.
    Type: Application
    Filed: September 30, 2016
    Publication date: February 21, 2019
    Applicant: Toray Industries, Inc.
    Inventors: Tomoki Ashibe, Daichi Miyazaki, Koji Ueoka, Akinori Saeki, Masahito Nishiyama
  • Publication number: 20180362763
    Abstract: A resin composition includes an (a) resin having a structure represented by Chemical Formula (1); and a (b) solvent. The resin composition also includes an amount of a compound represented by Chemical Formula (3) which is 0.1 ppm by mass or more and 40 ppm by mass or less.
    Type: Application
    Filed: December 8, 2016
    Publication date: December 20, 2018
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Daichi Miyazaki, Junji Wakita, Takashi Tokuda, Yasuko Tachibana, Koji Ueoka, Tomoki Ashibe
  • Patent number: 9850347
    Abstract: An object is to provide a polyamic acid resin composition that can form a varnish with a low viscosity and serves to produce, through curing, coat film with good mechanical characteristics. Another object is to provide a polyamic acid resin composition in which the acid anhydride terminal group is low in reactivity with diamine and which can give a varnish that does not suffer significant precipitation of diamine. These objects can be met by a polyamic acid resin composition that contains: (a) polyamic acid and (b) a compound as represented by chemical formula (1). (In Chemical formula (1), Z is a di- or higher-valent organic group containing 2 or more carbon atoms, V is a structure as represented by chemical formula (2), and k is an integer of 2 or more.) (In In Chemical formula (2), ? represents oxygen or sulfur atom and W represents an electron-withdrawing group, and R11 and R12 represent independently a hydrogen atom or a hydrocarbon group containing 1 to 10 carbon atoms.
    Type: Grant
    Filed: July 30, 2013
    Date of Patent: December 26, 2017
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Daichi Miyazaki, Masao Tomikawa
  • Patent number: 9822281
    Abstract: A polyamic acid useful for forming a protective or insulative layer for semiconductor elements has a structure represented by chemical formula (1): wherein ? represents an oxygen or sulfur atom; W represents an electron-withdrawing group; and R11 and R12 represent independently a hydrogen atom or a hydrocarbon group having 1 to 10 carbon atoms.
    Type: Grant
    Filed: August 1, 2016
    Date of Patent: November 21, 2017
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Daichi Miyazaki, Masao Tomikawa
  • Publication number: 20160340547
    Abstract: A polyamic acid useful for forming a protective or insulative layer for semiconductor elements has a structure represented by chemical formula (1): wherein ? represents an oxygen or sulfur atom; W represents an electron-withdrawing group; and R11 and R12 represent independently a hydrogen atom or a hydrocarbon group having 1 to 10 carbon atoms.
    Type: Application
    Filed: August 1, 2016
    Publication date: November 24, 2016
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Daichi MIYAZAKI, Masao TOMIKAWA
  • Publication number: 20150203631
    Abstract: An object is to provide a polyamic acid resin composition that can form a varnish with a low viscosity and serves to produce, through curing, coat film with good mechanical characteristics. Another object is to provide a polyamic acid resin composition in which the acid anhydride terminal group is low in reactivity with diamine and which can give a varnish that does not suffer significant precipitation of diamine. These objects can be met by a polyamic acid resin composition that contains: (a) polyamic acid and (b) a compound as represented by chemical formula (1). (In Chemical formula (1), Z is a di- or higher-valent organic group containing 2 or more carbon atoms, V is a structure as represented by chemical formula (2), and k is an integer of 2 or more.) (In In Chemical formula (2), ? represents oxygen or sulfur atom and W represents an electron-withdrawing group, and R11 and R12 represent independently a hydrogen atom or a hydrocarbon group containing 1 to 10 carbon atoms.
    Type: Application
    Filed: July 30, 2013
    Publication date: July 23, 2015
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Daichi Miyazaki, Masao Tomikawa
  • Publication number: 20150045502
    Abstract: The invention aims to provide polyamic acid that can form a varnish with a low viscosity and serves to produce, through curing, coat film with good mechanical characteristics and further aims to produce cured coat film with good mechanical characteristics regardless of whether the molar concentration of the acid anhydride group in the acid dianhydride monomer and that of the amino group in the multivalent amine compound or diamine compound are identical to or different from each other. This objective is met by polyamic acid including a structure as represented by chemical formula (1) given below: (In chemical formula (1), ? represents an oxygen or sulfur atom and W represents an electron-withdrawing group, and R11 and R12 represent independently a hydrogen atom or a hydrocarbon group having 1 to 10 carbon atoms.
    Type: Application
    Filed: March 28, 2013
    Publication date: February 12, 2015
    Applicant: TORAY Industries, Inc.
    Inventors: Daichi Miyazaki, Masao Tomikawa
  • Publication number: 20130289202
    Abstract: The disclosed polyamic acid resin composition contains (a) a polyamic acid represented by general formula (1) or (2), and (b) a solvent. (A, A?, C, C? are end-capped polyamic acid blocks comprising diaminobenzanilide and pyromellitic dianhydride or benzophenone tetracarboxylic dianhydride, and B, or D, is a polyamic acid block comprising a repeating unit other than A, A?, or C, C?.
    Type: Application
    Filed: December 21, 2011
    Publication date: October 31, 2013
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Daichi Miyazaki, Kazuto Miyoshi, Masao Tomikawa
  • Publication number: 20130184406
    Abstract: A polyamic acid resin composition includes (a) a polyamic acid having structures represented by general formula (1) in an amount of at least 80% of all the repeating units and (b) a solvent. In formula (1), A is a polyamic acid block represented by general formula (2); B is a polyamic acid block represented by general formula (3); and k is a positive integer. In formula (2), Ws are divalent organic groups having two or more carbon atoms, mainly composed of divalent organic groups represented by general formula (4); Xs are tetravalent organic groups having two or more carbon atoms. In formula (3), Ys are divalent organic groups having two or more carbon atoms, exclusive of the groups represented by formula (4); Zs are tetravalent organic groups each having two or more carbon atoms, and are mainly composed of tetravalent organic groups represented by general formula (5) or (6).
    Type: Application
    Filed: September 8, 2011
    Publication date: July 18, 2013
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Daichi Miyazaki, Kazuto Miyoshi, Masao Tomikawa