Abstract: A thermosetting adhesive sheet capable of reducing semiconductor wafer warping and chipping and a method for manufacturing a semiconductor device includes a thermosetting adhesive layer formed from a resin composition containing a resin component and a filler, the resin component containing an epoxy compound and a curing agent, a total value obtained by multiplying the reciprocal of epoxy equivalent of the epoxy compound by content of the epoxy compound in the resin component being 1.15E?04 or more, and blending amount of the filler being 50 pts. mass or more with respect to 100 pts. mass of the resin component; the thermosetting adhesive sheet is applied to a ground surface of a semiconductor and cured before dicing.

Abstract: An antenna is provided in one device from among a power transmission device and a power reception device. A transmission circuit drives the antenna. A plurality of antennas is provided in the other device from among the power transmission device and the power reception device. A radio wave detection circuit detects intensity of a radio wave received by the plurality of antennas. A position detector detects a relative position between the power transmission coil and the power reception coil, based on the intensity detected by the radio wave detection circuit. A transmission circuit drives at least one antenna. The radio wave detection circuit detects intensity of a radio wave being transmitted from an antenna driven by the transmission circuit and being received by an antenna other than the antenna driven by the transmission circuit.

Abstract: Provided is a position detection system capable of detecting a position with high accuracy when position detection is performed using an antenna on a transmission side and an antenna on a reception side. In the position detection system, at least one of a transmission antenna and a reception antenna is a multi-axis antenna including a first winding portion formed by winding a first conducting wire and a second winding portion formed by winding a second conducting wire. An axial direction of a first winding axis of the first winding portion and an axial direction of a second winding axis of the second winding portion are two directions different from each other. The first winding portion and the second winding portion are electrically connected to each other.

Abstract: Provided are a thermosetting adhesive sheet and a method for manufacturing a semiconductor device capable of reducing semiconductor wafer warping and chipping. The thermosetting adhesive sheet includes a thermosetting adhesive layer containing a resin component and a filler, the resin component containing a (meth)acrylate and a polymerization initiator, the (meth)acrylate containing a solid (meth)acrylate and a trifunctional or higher functional (meth)acrylate, content of the solid (meth)acrylate in the resin component being 55 wt % or more; a total value obtained by multiplying the number of functional groups per unit molecular weight of the (meth)acrylate by content of the (meth)acrylate in the resin component being 2.7E-03 or more, and blending amount of the filler being 80 to 220 pts. mass with respect to 100 pts. mass of the resin component.

Abstract: A thermosetting adhesive sheet and a method for manufacturing a semiconductor device capable of reducing warping of a semiconductor wafer are provided. The thermosetting adhesive sheet is to be applied to a grinding-side surface of a semiconductor wafer and cured before dicing and includes a polymer containing an elastomer, a (meth) acrylate containing more than 95% wt of a polyfunctional (meth) acrylate with respect to total (meth)acrylate content, an organic peroxide having a one-minute half-life temperature of 130° C. or lower, and a transparent filler. Thereby, the thermosetting adhesive sheet significantly shrinks and generates a stress opposing a warp direction of the semiconductor wafer, enabling the semiconductor wafer to be maintained in a flat state.

Abstract: A thermosetting adhesive sheet capable of reducing semiconductor wafer warping and chipping and a method for manufacturing a semiconductor device includes a thermosetting adhesive layer formed from a resin composition containing a resin component and a filler, the resin component containing an epoxy compound and a curing agent, a total value obtained by multiplying the reciprocal of epoxy equivalent of the epoxy compound by content of the epoxy compound in the resin component being 1.15E-04 or more, and blending amount of the filler being 50 pts. mass or more with respect to 100 pts. mass of the resin component; the thermosetting adhesive sheet is applied to a ground surface of a semiconductor and cured before dicing.

Abstract: Provided are a thermosetting adhesive sheet and a method for manufacturing a semiconductor device capable of reducing semiconductor wafer warping and chipping. The thermosetting adhesive sheet includes a thermosetting adhesive layer containing a resin component and a filler, the resin component containing a (meth)acrylate and a polymerization initiator, the (meth)acrylate containing a solid (meth)acrylate and a trifunctional or higher functional (meth)acrylate, content of the solid (meth)acrylate in the resin component being 55 wt % or more; a total value obtained by multiplying the number of functional groups per unit molecular weight of the (meth)acrylate by content of the (meth)acrylate in the resin component being 2.7E-03 or more, and blending amount of the filler being 80 to 220 pts. mass with respect to 100 pts. mass of the resin component.

Abstract: A thermosetting adhesive sheet and a method for manufacturing a semiconductor device capable of reducing warping of a semiconductor wafer are provided. The thermosetting adhesive sheet is to be applied to a grinding-side surface of a semiconductor wafer and cured before dicing and includes a polymer containing an elastomer, a (meth) acrylate containing more than 95% wt of a polyfunctional (meth) acrylate with respect to total (meth)acrylate content, an organic peroxide having a one-minute half-life temperature of 130° C. or lower, and a transparent filler. Thereby, the thermosetting adhesive sheet significantly shrinks and generates a stress opposing a warp direction of the semiconductor wafer, enabling the semiconductor wafer to be maintained in a flat state.

Abstract: A thermosetting adhesive sheet comprises a thermosetting binder, a transparent filler having an average primary particle diameter from 1 nm to 1000 nm and a colorant; wherein content of the transparent filler is from 30 to 100 pts. mass with respect to 80 pts. mass of the thermosetting binder and content of the colorant is from 0.5 to 3.0 pts. mass with respect to 80 pts. mass of the thermosetting binder; this thermosetting adhesive sheet is applied to a grinding-side surface of a semiconductor wafer and before dicing the semiconductor wafer. Printing using laser marking is thus made clear enabling excellent laser mark visibility and accurate alignment using infrared light.

Abstract: A thermosetting adhesive sheet comprises a thermosetting binder, a transparent filler having an average primary particle diameter from 1 nm to 1000 nm and a colorant; wherein content of the transparent filler is from 30 to 100 pts. mass with respect to 80 pts. mass of the thermosetting binder and content of the colorant is from 0.5 to 3.0 pts. mass with respect to 80 pts. mass of the thermosetting binder; this thermosetting adhesive sheet is applied to a grinding-side surface of a semiconductor wafer and before dicing the semiconductor wafer. Printing using laser marking is thus made clear enabling excellent laser mark visibility and accurate alignment using infrared light.

Abstract: A method for producing a solar battery module, which contains: arranging tab wire on an electrode of a solar cell via an adhesive; connecting the tab wire with a measuring device for measuring electrical characteristics of the solar cell, to measure electrical characteristics of the solar cell; judging a grade of the solar cell based on a result of the measurement; and modularizing the solar cells of the same grade.

Abstract: Disclosed is a terminal box with improved tab wire connection strength with limited warping and breakage of a translucent insulation substrate. A solar cell module is provided with: a solar cell with a cathode and an anode positioned on one surface thereof; a pair of power extraction tab wires which are connected onto the cathode and anode of the solar cell with a conductive adhesive layer interposed therebetween; and a pair of terminal box tab wires which are disposed on one surface of the solar cell with an insulating adhesive layer interposed therebetween, one end thereof being positioned on the cathode and the anode and which connect a terminal box with the pair of power extraction tab wires. The power extraction tab wires on the cathode and the anode are connected to the one end of the terminal box tab wires with the conductive adhesive layer interposed therebetween.

Abstract: A thin-film solar cell module, including: a thin-film solar cell including an electrode; a tab line; and an adhesive layer, wherein the tab line includes convex portions only on one surface thereof, wherein the adhesive layer is disposed only on the one surface of the tab line including the convex portions, and wherein the electrode and the one surface of the tab line including the convex portions are adhered and electrically connected via the adhesive layer.