Abstract: An operating method of a vacuum processing apparatus for processing multiple wafers sequentially in a vacuum processing apparatus comprising multiple vacuum transfer containers, adjacent two of which are interlinked, a lock chamber inside which a wafer is housed. The multiple processing units are each subjected to of cleaning the interior thereof upon elapse of a predetermined period. In advance of processing multiple wafers, the operating method configures multiple sets of processing units to process each of the wafers from among the multiple processing units and starts processing of the wafers, delayed by a predetermined time in descending order of the number of processing units included in each of the multiple sets of processing units and in descending order of distance of the processing units included from the lock chamber.