Patents by Inventor Daichi NISHIKAWA
Daichi NISHIKAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240098981Abstract: According to one embodiment, a semiconductor device includes a pillar of an oxide semiconductor material and a gate insulating layer that surrounds a side surface of the pillar. The gate insulating layer includes a lower portion, an upper portion, and an intermediate portion. A gate electrode surrounds the intermediate portion of the gate insulating layer. A lower electrode is provided that includes a first oxide conductor portion that is connected to a lower surface of the pillar. An upper electrode is provided connected to an upper surface of the pillar. The gate electrode includes a metal portion containing a metallic element and a first nitrogen-containing portion between the metal portion and the gate insulating layer. The first oxide conductor portion includes a second nitrogen-containing at an interface between the first oxide conductor portion and the gate insulating layer.Type: ApplicationFiled: August 29, 2023Publication date: March 21, 2024Inventors: Daichi NISHIKAWA, Daisuke IKENO, Atsuko SAKATA
-
Patent number: 11548284Abstract: Isolation between electrodes is ensured to enhance resistance to a liquid. A conductive film is provided to a surface of a piezoelectric substrate, and laser processing is performed in a groove extending direction on the conductive film between a first groove and a second groove provided to the piezoelectric substrate to thereby form a laser processing area where the conductive film is removed to the surface of the piezoelectric substrate between the first groove and the second groove. In forming the laser processing area, an irradiation operation with a laser is performed along a plurality of laser processing lines extending in the groove extending direction.Type: GrantFiled: December 16, 2020Date of Patent: January 10, 2023Assignee: SII PRINTEK INC.Inventors: Suguru Munakata, Daichi Nishikawa, Yuzuru Kubota, Yuki Yamamura, Yuji Nakamura
-
Publication number: 20220406710Abstract: A semiconductor device includes a conductive layer extending in a first direction, including a first surface, a second surface facing the first surface in a second direction intersecting the first direction, a third surface, and a fourth surface facing the third surface in a third direction intersecting the first direction and the second direction, and containing a first element which is at least one element of tungsten (W) or molybdenum (Mo); a first region disposed on a first surface side of the conductive layer, containing a second element which is at least one element of tungsten (W) or molybdenum (Mo), and a third element which is at least one element of sulfur (S), selenium (Se), or tellurium (Te), and including a first crystal; and a second region disposed on a second surface side of the conductive layer, containing the second element and the third element, and including a second crystal.Type: ApplicationFiled: February 28, 2022Publication date: December 22, 2022Applicant: Kioxia CorporationInventors: Tatsuya NOMURA, Daichi NISHIKAWA, Daisuke IKENO, Akihiro KAJITA
-
Publication number: 20210187950Abstract: Isolation between electrodes is ensured to enhance resistance to a liquid. A conductive film is provided to a surface of a piezoelectric substrate, and laser processing is performed in a groove extending direction on the conductive film between a first groove and a second groove provided to the piezoelectric substrate to thereby form a laser processing area where the conductive film is removed to the surface of the piezoelectric substrate between the first groove and the second groove. In forming the laser processing area, an irradiation operation with a laser is performed along a plurality of laser processing lines extending in the groove extending direction.Type: ApplicationFiled: December 16, 2020Publication date: June 24, 2021Inventors: Suguru Munakata, Daichi Nishikawa, Yuzuru Kubota, Yuki Yamamura, Yuji Nakamura
-
Patent number: 10807364Abstract: There are provided a head chip, a liquid jet head, and a liquid jet recording device capable of enhancing the reliability. The head chip according to an embodiment of the disclosure is a head chip adapted to jet liquid including an actuator plate having a plurality of ejection grooves arranged side by side along a first direction, and extending in a second direction crossing the first direction, a plurality of common electrodes formed on respective inner surfaces of the plurality of ejection grooves, and a commonalization interconnection adapted to electrically connect the plurality of common electrodes to each other, and a nozzle plate having a plurality of nozzle holes individually communicated with the plurality of ejection grooves.Type: GrantFiled: November 12, 2018Date of Patent: October 20, 2020Assignee: SII PRINTEK INC.Inventors: Daichi Nishikawa, Misaki Kobayashi, Tomoki Kameyama, Hitoshi Nakayama
-
Patent number: 10717280Abstract: There are provided a head chip, a liquid jet head, and a liquid jet recording device capable of enhancing the reliability. The head chip according to an embodiment of the disclosure is a head chip adapted to jet liquid including an actuator plate having a plurality of ejection grooves and a plurality of non-ejection grooves alternately arranged in parallel to each other along a first direction and each extending in a second direction crossing the first direction, and a nozzle plate having a plurality of nozzle holes individually communicated with the plurality of ejection grooves, and to be bonded to the actuator plate. The non-ejection grooves each partially open in a bonding surface of the actuator plate with the nozzle plate.Type: GrantFiled: November 12, 2018Date of Patent: July 21, 2020Assignee: SII Printek Inc.Inventors: Daichi Nishikawa, Misaki Kobayashi, Tomoki Kameyama
-
Patent number: 10675869Abstract: A head chip, a liquid jet head, and a liquid jet recording device capable of achieving the miniaturization while enhancing the reliability are provided. The head chip according to an embodiment of the disclosure includes an actuator plate having a plurality of ejection grooves arranged side by side in a first direction, a plurality of non-ejection grooves arranged side by side along the first direction, and individual electrodes respectively formed in the plurality of non-ejection grooves, a nozzle plate having a plurality of nozzle holes individually communicated with the plurality of ejection grooves, and a cover plate adapted to cover the actuator plate. The cover plate has interconnection connecting sections respectively disposed in end part areas along a second direction perpendicular to the first direction, and adapted to electrically connect a plurality of individual interconnections electrically connected to the individual electrodes to an interconnection board outside the head chip.Type: GrantFiled: November 9, 2018Date of Patent: June 9, 2020Assignee: SII PRINTEK INC.Inventors: Tomoki Kameyama, Yuki Yamamura, Daichi Nishikawa, Misaki Kobayashi
-
Patent number: 10654271Abstract: There are provided a head chip, a liquid jet head, and a liquid jet recording device capable of improving the ejection stability. The head chip according to an embodiment of the disclosure includes an actuator plate having a plurality of ejection grooves each filled with liquid, a nozzle plate having a plurality of nozzle holes individually communicated with the plurality of ejection grooves, and a cover plate having a through hole through which the liquid flows into and/or from the ejection groove, and a wall part adapted to cover the ejection groove. A flow channel of the liquid in a part adapted to communicate the through hole and the ejection groove with each other includes a principal flow channel section, and an expanded flow channel section provided to the wall part, and adapted to increase a cross-sectional area of the flow channel.Type: GrantFiled: November 9, 2018Date of Patent: May 19, 2020Assignee: SII PRINTEK INC.Inventors: Yuki Yamamura, Daichi Nishikawa, Tomoki Kameyama, Misaki Kobayashi
-
Patent number: 10593267Abstract: In a current measurement period set in a pause period, a display device of the present invention applies measurement voltages to data lines (S1 to Sm) and measures currents outputted to monitoring lines (M1 to Mm) from m pixel circuits (18), and then applies data voltages generated corresponding to video signals to the data lines (S1 to Sm).Type: GrantFiled: August 2, 2018Date of Patent: March 17, 2020Assignee: SHARP KABUSHIKI KAISHAInventors: Daichi Nishikawa, Yasuyuki Ogawa, Kaoru Yamamoto, Noritaka Kishi, Shigetsugu Yamanaka, Masanori Ohara, Noboru Noguchi
-
Patent number: 10513116Abstract: According to an embodiment, an ink jet head includes a pair of actuator plates, a return plate, and a flow passage plate. The pair of actuator plates are disposed to face each other in a Y-direction. In the actuator plate, a plurality of channels which extend in a Z-direction are arranged at a distance in an X-direction. The return plate is disposed on an opening end side of the channels in the pair of actuator plates. A circulation passage which communicates with the channels is formed in the return plate. The flow passage plate is disposed between the pair of actuator plates. An inlet flow passage into which an ink flows and an outlet flow passage which communicates with the circulation passage are arranged in the Z-direction.Type: GrantFiled: January 30, 2018Date of Patent: December 24, 2019Assignee: SII PRINTEK INC.Inventors: Yuzuru Kubota, Daichi Nishikawa, Daiki Irokawa, Eriko Maeda, Yutaka Hongo
-
Patent number: 10513117Abstract: According to an embodiment, an ink jet head (liquid ejecting head) includes an actuator plate and a cover plate (see FIG. 8). As illustrated in FIG. 1, channel grooves for a discharge channel (ejection channel) and a non-discharge channel (non-ejection channel) in a Z-direction are formed on a front surface of the actuator plate, so as to be alternately arranged in an X-direction, by cutting with a dicing blade or the like. The discharge channel and the non-discharge channel are formed to have a groove width W of smaller than 70 ?m, in order to correspond to high density of nozzles. In the embodiment, the discharge channel and the non-discharge channel are formed to have a groove width of 55 ?m, 50 ?m, or 40 ?m, for example.Type: GrantFiled: March 19, 2018Date of Patent: December 24, 2019Assignee: SII PRINTEK INC.Inventors: Hitoshi Nakayama, Takeshi Sugiyama, Daichi Nishikawa, Eriko Maeda
-
Patent number: 10427404Abstract: According to an embodiment, a liquid ejecting head chip includes an actuator plate, a cover plate, a common electrode, and a connection wiring. In the actuator plate, a plurality of discharge channels and a plurality of non-discharge channels which extend in a Z-direction are alternately arranged at a distance in an X-direction. The cover plate is stacked on an AP-side-Y-direction inner side surface, so as to close the plurality of discharge channels and the plurality of non-discharge channels. The common electrode is formed on an inner surface of each of the discharge channels. The connection wiring is divided so as to be formed in at least 3 or more places in the X-direction on the cover plate, and the common electrode connects the connection wiring to the flexible substrate.Type: GrantFiled: January 30, 2018Date of Patent: October 1, 2019Assignee: SII PRINTEK INC.Inventors: Yuzuru Kubota, Daichi Nishikawa
-
Patent number: 10410855Abstract: The present invention provides a cleaning method by which it is possible to prevent deformation of a film formation mask (31). While the film formation mask (31) disposed between a shower head (4) and a susceptor (3) within a chamber (2) is cooled, a cleaning gas made into plasma, which cleaning gas reacts with a reaction product (32) deposited on a surface of the film formation mask (31), is blown on the film formation mask (31).Type: GrantFiled: March 15, 2016Date of Patent: September 10, 2019Assignee: SHARP KABUSHIKI KAISHAInventors: Daichi Nishikawa, Takeshi Hirase, Tetsuya Okamoto, Tohru Senoo, Tohru Sonoda, Seiji Fujiwara, Mamoru Ishida
-
Patent number: 10388904Abstract: Provided is an organic EL display device that includes: a substrate; a first electrode provided on the substrate; an organic EL layer provided on the first electrode; a second electrode provided on the organic EL layer; and a sealing film layer provided so as to cover the second electrode. The sealing film layer has protruding portions and recessed portions.Type: GrantFiled: November 4, 2015Date of Patent: August 20, 2019Assignee: SHARP KABUSHIKI KAISHAInventors: Seiji Fujiwara, Takeshi Hirase, Tetsuya Okamoto, Tohru Senoo, Tohru Sonoda, Daichi Nishikawa, Mamoru Ishida
-
Patent number: 10355244Abstract: A the organic EL display 1 includes: a first substrate 10; an organic EL element 4 provided above the first substrate 10; and a multilayer sealing film 2 provided above the first substrate 10 to cover the organic EL element 4, and including a barrier layer and a buffer layer lower in hardness than the barrier layer. The organic EL element covered with the multi layer sealing film includes a protrusion, and a relationship (d/h)<2 holds where h is a height of the protrusion directly below the buffer layer and d is a thickness of the buffer layer.Type: GrantFiled: July 31, 2018Date of Patent: July 16, 2019Assignee: SHARP KABUSHIKI KAISHAInventors: Tohru Sonoda, Takeshi Hirase, Tetsuya Okamoto, Tohru Senoo, Daichi Nishikawa, Mamoru Ishida
-
Patent number: 10333103Abstract: In an organic EL display device that includes a TFT substrate (substrate) and an organic EL element (electroluminescent element) provided on the TFT substrate, a sealing film is provided that seals the organic EL element. The sealing film includes one or more layers of inorganic film. The thickness of a peripheral portion of at least one layer of inorganic film among the one or more layers of inorganic film is made thick. Further, a liquid repellent layer is provided covering the sealing film.Type: GrantFiled: November 4, 2015Date of Patent: June 25, 2019Assignee: SHARP KABUSHIKI KAISHAInventors: Takeshi Hirase, Tetsuya Okamoto, Tohru Senoo, Tohru Sonoda, Daichi Nishikawa, Seiji Fujiwara
-
Publication number: 20190143682Abstract: There are provided a head chip, a liquid jet head, and a liquid jet recording device capable of enhancing the reliability. The head chip according to an embodiment of the disclosure is a head chip adapted to jet liquid including an actuator plate having a plurality of ejection grooves arranged side by side along a first direction, and extending in a second direction crossing the first direction, a plurality of common electrodes formed on respective inner surfaces of the plurality of ejection grooves, and a commonalization interconnection adapted to electrically connect the plurality of common electrodes to each other, and a nozzle plate having a plurality of nozzle holes individually communicated with the plurality of ejection grooves.Type: ApplicationFiled: November 12, 2018Publication date: May 16, 2019Inventors: Daichi NISHIKAWA, Misaki KOBAYASHI, Tomoki KAMEYAMA, Hitoshi NAKAYAMA
-
Publication number: 20190143683Abstract: There are provided a head chip, a liquid jet head, and a liquid jet recording device capable of enhancing the reliability. The head chip according to an embodiment of the disclosure is a head chip adapted to jet liquid including an actuator plate having a plurality of ejection grooves and a plurality of non-ejection grooves alternately arranged in parallel to each other along a first direction and each extending in a second direction crossing the first direction, and a nozzle plate having a plurality of nozzle holes individually communicated with the plurality of ejection grooves, and to be bonded to the actuator plate. The non-ejection grooves each partially open in a bonding surface of the actuator plate with the nozzle plate.Type: ApplicationFiled: November 12, 2018Publication date: May 16, 2019Inventors: Daichi NISHIKAWA, Misaki KOBAYASHI, Tomoki KAMEYAMA
-
Publication number: 20190143697Abstract: There are provided a head chip, a liquid jet head, and a liquid jet recording device capable of enhancing the reliability. The head chip according to an embodiment of the disclosure includes an actuator plate having a plurality of ejection grooves arranged side by side along a first direction, and first common electrodes respectively formed in the ejection grooves, a nozzle plate having a plurality of nozzle holes individually communicated with the plurality of ejection grooves, and a cover plate adapted to cover the actuator plate. The cover plate has a wall part adapted to cover the plurality of ejection grooves.Type: ApplicationFiled: November 9, 2018Publication date: May 16, 2019Inventors: Tomoki KAMEYAMA, Yuki YAMAMURA, Daichi NISHIKAWA, Misaki KOBAYASHI
-
Publication number: 20190143684Abstract: There are provided a liquid jet head and a liquid jet recording device capable of enhancing the reliability. A liquid jet head according to an embodiment of the disclosure is a liquid jet head adapted to jet a liquid including an actuator plate having a plurality of ejection grooves each filled with the liquid, and a nozzle plate having a plurality of nozzle holes individually communicated with the respective ejection grooves, formed so as to have a profile smaller than a profile of the actuator plate, and bonded to the actuator plate so as to cover the plurality of ejection grooves, wherein a predetermined mark with which a position of the nozzle plate with respect to the actuator plate is checked is formed in an area outside a part corresponding to an outer periphery of the nozzle plate on a bonding surface of the actuator plate with the nozzle plate.Type: ApplicationFiled: November 12, 2018Publication date: May 16, 2019Inventors: Shutaro YAMAMOTO, Daichi NISHIKAWA, Emiko OSAKA