Patents by Inventor Daichi OHMAE

Daichi OHMAE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MULTI-PIECE WIRING BOARD AND METHOD FOR PRODUCING THE SAME
    Publication number: 20150342049
    Abstract: The multi-piece, wiring board according to the embodiment of the present invention includes a supporting board including a frame portion formed on an upper surface of a bottom plate, the frame portion configured to divide the upper surface of the bottom plate into a plurality of product forming regions, and a wiring board formed on the upper surface of the bottom plate in. each of the product forming regions, the: wiring board including an insulating layer formed so as to expose an upper surface of the frame portion, and a wiring conductor formed on the insulating layer.
    Type: Application
    Filed: May 21, 2015
    Publication date: November 26, 2015
    Applicant: KYOCERA CIRCUIT SOLUTIONS, INC.
    Inventors: Tomoharu TSUCHIDA, Kazuki OKA, Daichi OHMAE
  • WIRING BOARD
    Publication number: 20140001637
    Abstract: A wiring board in which a semiconductor element connection pad formed on a strip-shaped wiring conductor and an electrode of a semiconductor element are firmly connected together, the wiring board having excellent electrical insulation between the semiconductor element connection pads which are adjacent to each other.
    Type: Application
    Filed: June 27, 2013
    Publication date: January 2, 2014
    Inventors: Kohichi OHSUMI, Yoshitaka SHIGA, Daichi OHMAE