Patents by Inventor Daichi Sakai

Daichi Sakai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8818147
    Abstract: According to a manufacturing method of an optical waveguide substrate including a core (12) and clads (11) (13) and provided with an optical axis conversion mirror (14) in the core and an alignment recess for the optical axis conversion mirror with respect to a light receiving and emitting element, the recess is obtained by obtaining an outline of the core by synthesizing at least an image captured by focusing a microscope (20) to a highest position (14a) of the core in an optical axis conversion mirror portion and an image captured by focusing the microscope to a lowest position (14d), and by determining a position of the alignment recess in reference to a center of gravity of the outline, and according to an optical waveguide substrate obtained by this manufacturing method, it becomes possible to provide an optical waveguide substrate in which the optical axis conversion mirror in the optical waveguide substrate and the light receiving and emitting element are aligned with respect to each other at an extrem
    Type: Grant
    Filed: October 12, 2010
    Date of Patent: August 26, 2014
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Toshihiro Kuroda, Daichi Sakai, Shigeyuki Yagi, Tomoaki Shibata
  • Publication number: 20130287354
    Abstract: There are provided an optical waveguide including: a substrate 1; a lower clad layer 2; a core pattern 3 with a taper in thickness direction; and an upper clad layer 4, the lower clad layer, the core pattern, and the upper clad layer being sequentially laminated on the substrate 1, in which the lower clad layer 2 has a cutting part 5. There also provided with an optical waveguide including: a substrate 1; a lower clad layer 2; a core pattern 3 with a taper in thickness direction; and an upper clad layer 4, the lower clad layer, the core pattern, and the upper clad layer being sequentially laminated on the substrate 1, in which the lower clad layer 2 has a dummy part on the top. These optical waveguides can secure alignment tolerance when connected with an optical element.
    Type: Application
    Filed: November 11, 2011
    Publication date: October 31, 2013
    Inventors: Daichi Sakai, Toshihiro Kuroda, Hiromichi Aoki
  • Publication number: 20120219251
    Abstract: According to a manufacturing method of an optical waveguide substrate including a core (12) and clads (11) (13) and provided with an optical axis conversion mirror (14) in the core and an alignment recess for the optical axis conversion mirror with respect to a light receiving and emitting element, the recess is obtained by obtaining an outline of the core by synthesizing at least an image captured by focusing a microscope (20) to a highest position (14a) of the core in an optical axis conversion mirror portion and an image captured by focusing the microscope to a lowest position (14d), and by determining a position of the alignment recess in reference to a center of gravity of the outline, and according to an optical waveguide substrate obtained by this manufacturing method, it becomes possible to provide an optical waveguide substrate in which the optical axis conversion mirror in the optical waveguide substrate and the light receiving and emitting element are aligned with respect to each other at an extrem
    Type: Application
    Filed: October 12, 2010
    Publication date: August 30, 2012
    Inventors: Toshihiro Kuroda, Daichi Sakai, Shigeyuki Yagi, Tomoaki Shibata
  • Publication number: 20110013865
    Abstract: A method for producing a circuit board, contains, in this order, a step A of forming a circuit on a first substrate; a step B of laminating a first support on a surface of the first substrate having the circuit formed, through a first releasing layer; and a step C of forming a second substrate or circuit on a surface of the first substrate opposite to the surface having the circuit formed, and a method for producing an optoelectronic composite member, contains, in this order, a step of laminating an electric circuit board on a second support; a step of laminating a first support; a step of releasing the second support; and a step of forming an optical waveguide on a surface where the second support is released.
    Type: Application
    Filed: March 30, 2009
    Publication date: January 20, 2011
    Inventors: Tomoaki Shibata, Daichi Sakai, Toshihiro Kuroda, Shigeyuki Yagi, Atsushi Takahashi