Abstract: The purpose of the present invention is to provide an assembly method for manufacturing with which deformation caused by heating during joining is inhibited, peeling apart of the assembly is facilitated, protein adsorption is suppressed, and low haze is achieved. An assembly [3] includes one or more types of shaped products [1] that are joined via a joining layer [2] having a material constitution different from the shaped products; and a method for manufacturing the same. The joining layer [2] contains: 100 parts by weight of a cycloolefin resin [4]; and a softening agent [5]. The content of the softening agent [5] in the joining layer [2] is 6 parts by weight to 99 parts by weight of the softening agent [5] relative to 100 parts by weight of the cycloolefin resin [4]. The joining layer [2] has a haze of 1.0 or less.

Abstract: A method of producing an adhesive resin includes: a heating and kneading step of kneading a mixture containing a ring structure-containing hydrocarbon resin, an adhesive functional group-containing compound, and a peroxide while heating the mixture to obtain a heated and kneaded product; and a cooling and kneading step, performed in succession to the heating and kneading step, of kneading the heated and kneaded product while cooling the heated and kneaded product to obtain a cooled and kneaded product. The adhesive resin has a yellowness index (Yi) of 3.0 or less when 0.8 parts by mass of 2-(5-chloro-2-benzotriazolyl)-6-tert-butyl-p-cresol is added to 100 parts by mass of the adhesive resin.

Abstract: Disclosed is method of manufacturing a microchannel chip by joining together a resin channel substrate having microchannels formed on at least one side thereof and a resin lid substrate, the method including: a step (A) wherein surface modification treatment is applied on joining surfaces of the channel substrate and the lid substrate; and a step (B) wherein, after the step (A), the joining surfaces of the channel substrate and the lid substrate are mated and the channel substrate and the lid substrate are pressurized under heating via a fluid or an elastic body having a durometer hardness of E20 or less.

Abstract: Disclosed is a laminate which includes one or more soft layers and an electronic device enclosed by the one or more soft layers, wherein the one or more soft layers have a flexural modulus of 80 MPa or more and 1,000 MPa or less and a water vapor permeability at 40° C. and 90% RH of 15 [g/(m2·24 h)·100 ?m] or less.

Abstract: A method of producing an adhesive resin includes: a heating and kneading step of kneading a mixture containing a ring structure-containing hydrocarbon resin, an adhesive functional group-containing compound, and a peroxide while heating the mixture to obtain a heated and kneaded product; and a cooling and kneading step, performed in succession to the heating and kneading step, of kneading the heated and kneaded product while cooling the heated and kneaded product to obtain a cooled and kneaded product. The adhesive resin has a yellowness index (Yi) of 3.0 or less when 0.8 parts by mass of 2-(5-chloro-2-benzotriazolyl)-6-tert-butyl-p-cresol is added to 100 parts by mass of the adhesive resin.

Abstract: Disclosed is a laminate which includes one or more soft layers and an electronic device enclosed by the one or more soft layers, wherein the one or more soft layers have a flexural modulus of 80 MPa or more and 1,000 MPa or less and a water vapor permeability at 40° C. and 90% RH of 15 [g/(m2·24 h)·100 ?m] or less.

Abstract: Disclosed is method of manufacturing a microchannel chip by joining together a resin channel substrate having microchannels formed on at least one side thereof and a resin lid substrate, the method including: a step (A) wherein surface modification treatment is applied on joining surfaces of the channel substrate and the lid substrate; and a step (B) wherein, after the step (A), the joining surfaces of the channel substrate and the lid substrate are mated and the channel substrate and the lid substrate are pressurized under heating via a fluid or an elastic body having a durometer hardness of E20 or less.

Abstract: The invention is a method for manufacturing an organic electronic device sealing body, adhesively integrating an organic electronic device with a sheet-like sealant made of a modified hydrocarbon-based soft resin having an alkoxysilyl group, the method comprising steps of: step [1]: laminating the organic electronic device and the sheet-like sealant to obtain a laminate; step [2]: putting the resulting laminate into a resin bag, degassing the bag, and then sealing the bag containing the laminate; and step [3]: placing the sealed bag under a pressure of 0.1 MPa or higher to adhesively integrate the laminate. One aspect of the invention provides a method for manufacturing an organic electronic device sealing body which allows industrially-advantageous sealing of the organic electronic device including organic functional elements such as an organic EL element and an organic semiconductor element.

Abstract: Disclosed is a thermoplastic resin composition obtainable by melt-kneading an alicyclic structure-containing polymer, an aqueous dispersion of a metal oxide, and a polyglycerin fatty acid ester. Thus, a thermoplastic resin composition is provided which has low haze and excellent transparency as well as sufficient heat ray shielding property and is suitable for windows and window parts for general buildings or vehicles.

Abstract: Provided is a laminated glass including, in order: a first glass sheet; a first interlayer film; a transparent film laminated with a heat reflection film; a second interlayer film; and a second glass sheet, wherein the first interlayer film and the second interlayer film are formed of a modified hydrogenated block copolymer [E], the modified hydrogenated block copolymer [E] is a hydrogenated block copolymer [D] in which an alkoxysilyl group is incorporated, the hydrogenated block copolymer [D] being a block copolymer [C] in which 90% or more of all unsaturated bonds is hydrogenated, the block copolymer [C] is composed of at least two polymer blocks [A] including a repeat unit derived from an aromatic vinyl compound, and at least one polymer block [B] including a repeat unit derived from a linear conjugated diene compound, and the ratio of weight fraction [A]:[B] is 30:70 to 60:40.

Abstract: The present invention pertains to a laminated glass obtained by: interposing, between glass plates, a resin sheet comprising a resin composition obtained by blending 100 parts by weight of a specific modified hydrogenated block-copolymer having an introduced acid anhydride group, and a total of 0.001 to 2.0 parts by weight of a near infrared ray-absorbing pigment and/or a metal oxide particulate having a function of shielding infrared ray, to obtain a laminate; and integrally bonding the laminate including the glass plates and the resin sheet. The aspects of the invention provide a novel hydrogenated block copolymer having an acid anhydride group; a resin composition that includes the hydrogenated block copolymer, has excellent heat insulating function, and is suitable as a laminated glass intermediate film-forming material excellent in moisture resistance and durability; a resin sheet made of the resin composition; and a laminated glass.

Abstract: Provided is a laminated glass including, in order: a first glass sheet; a first interlayer film; a transparent film laminated with a heat reflection film; a second interlayer film; and a second glass sheet, wherein the first interlayer film and the second interlayer film are formed of a modified hydrogenated block copolymer [E], the modified hydrogenated block copolymer [E] is a hydrogenated block copolymer [D] in which an alkoxysilyl group is incorporated, the hydrogenated block copolymer [D] being a block copolymer [C] in which 90% or more of all unsaturated bonds is hydrogenated, the block copolymer [C] is composed of at least two polymer blocks [A] including a repeat unit derived from an aromatic vinyl compound, and at least one polymer block [B] including a repeat unit derived from a linear conjugated diene compound, and the ratio of weight fraction [A]:[B] is 30:70 to 60:40.

Abstract: The invention is a method for manufacturing an organic electronic device sealing body, adhesively integrating an organic electronic device with a sheet-like sealant made of a modified hydrocarbon-based soft resin having an alkoxysilyl group, the method comprising steps of: step [1]: laminating the organic electronic device and the sheet-like sealant to obtain a laminate; step [2]: putting the resulting laminate into a resin bag, degassing the bag, and then sealing the bag containing the laminate; and step [3]: placing the sealed bag under a pressure of 0.1 MPa or higher to adhesively integrate the laminate. One aspect of the invention provides a method for manufacturing an organic electronic device sealing body which allows industrially-advantageous sealing of the organic electronic device including organic functional elements such as an organic EL element and an organic semiconductor element.

Abstract: The present invention provides: an assembly obtained by bonding a sheet made of a modified hydrogenated block copolymer having an alkoxysilyl group introduced therein with a thermoplastic resin sheet, wherein a peel strength of the adherend surface is 4 N/cm or higher; a method for producing an assembly by bonding a sheet made of a modified hydrogenated block copolymer having an alkoxysilyl group introduced therein with a thermoplastic resin sheet, the method comprising steps of: (1) activating an adherend surface of the thermoplastic resin sheet with at least one selected from plasma exposure, excimer UV exposure and corona discharge; and (2) superposing the sheet made of the modified hydrogenated block copolymer having the alkoxysilyl group introduced therein with the adherend surface of the thermoplastic resin sheet to be subjected to thermally press-bonding; and a sheet made of a modified hydrogenated block copolymer, comprising at least one surface activated.

Abstract: The present invention is a resin composition comprising a specific modified hydrogenated block copolymer [E] prepared by introducing an alkoxysilyl group and a crosslinking aid; a resin laminate prepared by laminating a layer including the resin composition on at least one side of a polyimide-based resin film; and a resin laminated metallic foil prepared by laminating a metallic foil on at least one side of the polyimide-based resin film through the layer including the resin composition. The present invention provides: a resin composition excellent in adhesiveness to a polyimide-based resin film and a metallic foil with low surface roughness and excellent in electrical insulation; a resin laminate prepared by laminating the resin composition and a polyimide-based resin film; and a resin laminated metallic foil in which the polyimide-based resin film and a metallic foil with a low surface roughness are laminated by using the resin composition as an adhesive.

Abstract: The present invention is a laminated glass [H] which uses, as an intermediate film, a sheet [G] that is formed from a resin composition [F] that is prepared by blending a total amount of 0.001 to 2.0 parts by weight of a metal oxide particulate and/or a near infrared-absorbing pigment having a function of shielding infrared ray, into 100 parts by weight of a specific hydrogenated block copolymer [D] and/or a modified hydrogenated block copolymer [E]. The present invention provides a laminated glass which has excellent infrared shielding function, moisture resistance and heat resistance.

Abstract: Provided is a laminated glass including, in order: a first glass sheet; a first interlayer film; a transparent film laminated with a heat reflection film; a second interlayer film; and a second glass sheet, wherein the first interlayer film and the second interlayer film are formed of a modified hydrogenated block copolymer [E], the modified hydrogenated block copolymer [E] is a hydrogenated block copolymer [D] in which an alkoxysilyl group is incorporated, the hydrogenated block copolymer [D] being a block copolymer [C] in which 90% or more of all unsaturated bonds is hydrogenated, the block copolymer [C] is composed of at least two polymer blocks [A] including a repeat unit derived from an aromatic vinyl compound, and at least one polymer block [B] including a repeat unit derived from a linear conjugated diene compound, and the ratio of weight fraction [A]:[B] is 30:70 to 60:40.

Abstract: A resin composition including an alkoxysilyl group-containing hydrogenated block copolymer [3], and a hydrocarbon-based polymer [4] having a number average molecular weight of 300 to 5000, the resin composition including the hydrocarbon-based polymer [4] in an amount of 1 to 50 parts by weight based on 100 parts by weight of the alkoxysilyl group-containing hydrogenated block copolymer [3], the alkoxysilyl group-containing hydrogenated block copolymer [3] being obtained by introducing an alkoxysilyl group into a hydrogenated block copolymer [2] that is obtained by hydrogenating 90% or more of unsaturated bonds of a block copolymer [1] that includes at least two polymer blocks [A] and at least one polymer block [B], and a ratio (wA:wB) of a weight fraction wA of the polymer block [A] in the block copolymer [1] to a weight fraction wB of the polymer block [B] in the block copolymer [1] being 30:70 to 65:35.

Abstract: A solar cell module including at least a front-side transparent glass, a sealing material layer that includes an ethylene-vinyl acetate copolymer having a vinyl acetate content of 20 to 35 wt % as a main component, a crystalline silicon solar cell element that is embedded in the sealing material, and a back-side protective layer that is formed of a resin sheet or glass, the front-side transparent glass, the sealing material layer, the crystalline silicon solar cell element, and the back-side protective layer being stacked sequentially from a light-receiving side, a layer that is formed of a transparent resin and bonded to the front-side transparent glass being formed between the front-side transparent glass and the sealing material layer. This solar cell module is capable of suppressing the occurrence of PID using a sealing material formed of a general-purpose ethylene-vinyl acetate copolymer.

Abstract: A resin composition including an alkoxysilyl group-containing hydrogenated block copolymer [3], and a hydrocarbon-based polymer [4] having a number average molecular weight of 300 to 5000, the resin composition including the hydrocarbon-based polymer [4] in an amount of 1 to 50 parts by weight based on 100 parts by weight of the alkoxysilyl group-containing hydrogenated block copolymer [3], the alkoxysilyl group-containing hydrogenated block copolymer [3] being obtained by introducing an alkoxysilyl group into a hydrogenated block copolymer [2] that is obtained by hydrogenating 90% or more of unsaturated bonds of a block copolymer [1] that includes at least two polymer blocks [A] and at least one polymer block [B], and a ratio (wA:wB) of a weight fraction wA of the polymer block [A] in the block copolymer [1] to a weight fraction wB of the polymer block [B] in the block copolymer [1] being 30:70 to 65:35.