Abstract: A semiconductor package includes an IC chip having a rectangular (or square) semiconductor substrate, and an integrated circuit formed on a main surface of the semiconductor substrate. The semiconductor package also includes a support substrate on which the IC chip is mounted. A power source line is disposed on the main surface of the semiconductor substrate along the edge of the semiconductor substrate in the shape of a rectangle to supply a power source voltage to the integrated circuit. A main relay pad is provided on the semiconductor substrate and connected to one corner of the power source line. A secondary relay pad is provided on the semiconductor substrate and connected to another corner of the power source line. The semiconductor package also includes a support part to support the IC chip, an external power source supply terminal, and a relay line to connect both the main relay pad and the secondary relay pad to the external power source supply terminal.

Abstract: A semiconductor device according to the present invention comprises, on a first semiconductor chip, a first circuit element region in which a first electrode group is arranged along an outer periphery of the first semiconductor chip in such a manner as to surround a second semiconductor chip, a second electrode group is arranged along the outer periphery of the first semiconductor chip in such a manner as to surround the first electrode group, and the first semiconductor chip is surrounded by the first electrode group, and a second circuit element region which surrounds the first electrode group and is surrounded by the second electrode group.

Abstract: A semiconductor device according to the present invention comprises, on a first semiconductor chip, a first circuit element region in which a first electrode group is arranged along an outer periphery of the first semiconductor chip in such a manner as to surround a second semiconductor chip, a second electrode group is arranged along the outer periphery of the first semiconductor chip in such a manner as to surround the first electrode group, and the first semiconductor chip is surrounded by the first electrode group, and a second circuit element region which surrounds the first electrode group and is surrounded by the second electrode group.