Patents by Inventor Daigo HAMAJIMA

Daigo HAMAJIMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10964480
    Abstract: A capacitor module is provided which includes a plurality of capacitors, a capacitor case, and a sealing resin with which the capacitor case is filled to seal the capacitors in the capacitor case. The capacitor case includes inward-facing portions of an outer wall thereof each of which bulges or protrudes between every adjacent two of the capacitors. As viewed in a height-wise direction perpendicular both to a direction in which the inward-facing portions protrude and to a direction in which two of the capacitors adjacent each other across one of the inward-facing portions are aligned, the intervening inward-facing portion traverses a line segment passing through centers of the two adjacent capacitors. This structure minimizes thermal interference between the capacitors.
    Type: Grant
    Filed: December 26, 2018
    Date of Patent: March 30, 2021
    Assignee: DENSO CORPORATION
    Inventors: Takayuki Kanda, Daigo Hamajima
  • Publication number: 20190198246
    Abstract: A capacitor module is provided which includes a plurality of capacitors, a capacitor case, and a sealing resin with which the capacitor case is filled to seal the capacitors in the capacitor case. The capacitor case includes inward-facing portions of an outer wall thereof each of which bulges or protrudes between every adjacent two of the capacitors. As viewed in a height-wise direction perpendicular both to a direction in which the inward-facing portions protrude and to a direction in which two of the capacitors adjacent each other across one of the inward-facing portions are aligned, the intervening inward-facing portion traverses a line segment passing through centers of the two adjacent capacitors. This structure minimizes thermal interference between the capacitors.
    Type: Application
    Filed: December 26, 2018
    Publication date: June 27, 2019
    Applicant: DENSO CORPORATION
    Inventors: Takayuki KANDA, Daigo HAMAJIMA