Patents by Inventor Daigo HIRAKAWA

Daigo HIRAKAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11739245
    Abstract: A thermally conductive polysiloxane composition includes (A) a thermally conductive filler, (B) a polyorganosiloxane resin including at least one polysiloxane having one curable functional group in the molecule thereof, and (C) a siloxane compound having an alkoxysilyl group and a linear siloxane structure.
    Type: Grant
    Filed: July 20, 2017
    Date of Patent: August 29, 2023
    Assignee: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
    Inventors: Masanori Takanashi, Isao Iida, Daigo Hirakawa, Kenji Takenaka, Eiji Tanigawa
  • Patent number: 11286349
    Abstract: A siloxane compound represented by the general formula (1): where R1 is a group having an alkoxysilyl group having 1 to 4 carbon atoms, R2 is a linear organosiloxy group represented by the general formula (2): where each R4 is independently a monovalent hydrocarbon group having 1 to 12 carbon atoms, Y is a monovalent hydrocarbon group having 1 to 6 carbon atoms, and d is an integer of 10 to 50, each X is independently a divalent hydrocarbon group having 2 to 10 carbon atoms, each of a and b is independently an integer of 1 or more, c is an integer of 0 or more, a+b+c is an integer of 4 or more, and each R3 is independently a monovalent hydrocarbon group having 1 to 6 carbon atoms.
    Type: Grant
    Filed: July 20, 2017
    Date of Patent: March 29, 2022
    Assignee: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
    Inventors: Eiji Tanigawa, Masanori Takanashi, Isao Iida, Daigo Hirakawa, Kenji Takenaka
  • Patent number: 11254849
    Abstract: A method for producing a polyorganosiloxane resin composition including: (a) mixing a thermally-conductive filler having a particle size distribution having a single peak, with a surface treatment agent containing a siloxane to form a mixture, and (b) mixing the mixture from step (a) with a polysiloxane resin.
    Type: Grant
    Filed: November 2, 2016
    Date of Patent: February 22, 2022
    Assignee: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
    Inventors: Eiji Tanigawa, Masanori Takanashi, Isao Iida, Daigo Hirakawa, Kenji Takenaka
  • Patent number: 11142644
    Abstract: The present invention relates to a thermally conductive polysiloxane composition that provides a cured product having excellent tackiness and flexibility in which the composition contains (A) a thermally conductive filler, (B) a siloxane compound having an alkoxysilyl group and a linear siloxane structure, (C) a polyorganosiloxane having at least two alkenyl groups bonded to silicon atoms per molecule, (D1) a linear polyorganohydrogensiloxane represented by the general formula (4), (D2) a polyorganohydrogensiloxane having per molecule at least three units represented by the general formula (5), and (E) a platinum catalyst.
    Type: Grant
    Filed: January 25, 2018
    Date of Patent: October 12, 2021
    Assignee: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
    Inventors: Daigo Hirakawa, Masanori Takanashi, Atsushi Sakamoto
  • Patent number: 11118056
    Abstract: A thermally conductive polysiloxane composition includes (A) a thermally conductive filler, and (B) at least one member selected from the group consisting of an alkoxysilyl group-containing compound and a dimethylpolysiloxane. The component (A) includes at least two thermally conductive fillers having different average particle diameters, and (A-1) indefinite-shaped aluminum nitride particles having an average particle diameter of 30 ?m to 150 ?m in an amount of at least 20% by mass, based on the mass of a total of the component (A).
    Type: Grant
    Filed: July 20, 2017
    Date of Patent: September 14, 2021
    Assignee: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
    Inventors: Daigo Hirakawa, Masanori Takanashi, Isao Iida, Kenji Takenaka, Eiji Tanigawa
  • Patent number: 11084927
    Abstract: A thermally conductive polysiloxane composition includes (A) a thermally conductive filler, and (B) at least one member selected from the group consisting of an alkoxysilyl group-containing compound and a dimethylpolysiloxane. The component (A) includes at least two thermally conductive fillers having different average particle diameters, and (A-1) indefinite-shaped aluminum nitride particles having an average particle diameter of 30 ?m to 150 ?m in an amount of at least 20% by mass, based on the mass of a total of the component (A).
    Type: Grant
    Filed: July 20, 2017
    Date of Patent: August 10, 2021
    Assignee: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
    Inventors: Daigo Hirakawa, Masanori Takanashi, Isao Iida, Kenji Takenaka, Eiji Tanigawa
  • Publication number: 20210147681
    Abstract: A thermally conductive polysiloxane composition includes (A) a thermally conductive filler, and (B) at least one member selected from the group consisting of an alkoxysilyl group-containing compound and a dimethylpolysiloxane. The component (A) includes at least two thermally conductive fillers having different average particle diameters, and (A-1) indefinite-shaped aluminum nitride particles having an average particle diameter of 30 ?m to 150 ?m in an amount of at least 20% by mass, based on the mass of a total of the component (A).
    Type: Application
    Filed: July 20, 2017
    Publication date: May 20, 2021
    Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
    Inventors: Daigo HIRAKAWA, Masanori TAKANASHI, Isao IIDA, Kenji TAKENAKA, Eiji TANIGAWA
  • Publication number: 20210147738
    Abstract: A thermally conductive polysiloxane composition includes (A) a thermally conductive filler, (B) a polyorganosiloxane resin including at least one polysiloxane having one curable functional group in the molecule thereof, and (C) a siloxane compound having an alkoxysilyl group and a linear siloxane structure
    Type: Application
    Filed: July 20, 2017
    Publication date: May 20, 2021
    Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
    Inventors: Masanori TAKANASHI, Isao IIDA, Daigo HIRAKAWA, Kenji TAKENAKA, Eiji TANIGAWA
  • Publication number: 20210147633
    Abstract: A siloxane compound represented by the general formula (1): where R1 is a group having an alkoxysilyl group having 1 to 4 carbon atoms, R2 is a linear organosiloxy group represented by the general formula (2): where each R4 is independently a monovalent hydrocarbon group having 1 to 12 carbon atoms, Y is a monovalent hydrocarbon group having 1 to 6 carbon atoms, and d is an integer of 10 to 50, each X is independently a divalent hydrocarbon group having 2 to 10 carbon atoms, each of a and b is independently an integer of 1 or more, c is an integer of 0 or more, a+b+c is an integer of 4 or more, and each R3 is independently a monovalent hydrocarbon group having 1 to 6 carbon atoms.
    Type: Application
    Filed: July 20, 2017
    Publication date: May 20, 2021
    Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
    Inventors: Eiji TANIGAWA, Masanori TAKANASHI, Isao IIDA, Daigo HIRAKAWA, Kenji TAKENAKA
  • Publication number: 20210130615
    Abstract: The present invention relates to a thermally conductive polysiloxane composition that provides a cured product having excellent tackiness and flexibility in which the composition contains (A) a thermally conductive filler, (B) a siloxane compound having an alkoxysilyl group and a linear siloxane structure, (C) a polyorganosiloxane having at least two alkenyl groups bonded to silicon atoms per molecule, (D1) a linear polyorganohydrogensiloxane represented by the general formula (4), (D2) a polyorganohydrogensiloxane having per molecule at least three units represented by the general formula (5), and (E) a platinum catalyst.
    Type: Application
    Filed: January 25, 2018
    Publication date: May 6, 2021
    Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
    Inventors: Daigo HIRAKAWA, Masanori TAKANASHI, Atsushi SAKAMOTO
  • Patent number: 10683444
    Abstract: A thermally conductive composition is a thermally conductive composition including (A) a spherical thermally conductive filler, (B) an alkoxysilane compound or dimethylpolysiloxane, and (C) a polyorganosiloxane (not inclusive of the dimethylpolysiloxane of component (B)), wherein component (A) is a mixture formulated with specific ratios of fillers having different average particle sizes, the mixture being formulated with a filler having an average particle size of 50 ?m or more in an amount of 30% by mass or more; component (B) and component (C) are included in a total amount of 1.5 to 35 parts by mass relative to 100 parts by mass of component (A); and a content ratio of component (C) in the total amount of component (B) and component (C) is 15 to 98% by mass.
    Type: Grant
    Filed: May 18, 2016
    Date of Patent: June 16, 2020
    Assignee: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
    Inventors: Masanori Takanashi, Daigo Hirakawa
  • Patent number: 10556849
    Abstract: A method for producing methanol allows the temperature of the catalyst layer to fall within an appropriate temperature range, reduces energy used, and achieves higher carbon yield. In a synthesis loop including at least two synthesis steps and two separation steps, a first mixed gas is obtained by mixing the final unreacted gas with a fraction of the make-up gas, methanol is synthesized from the first mixed gas after preheating, a first unreacted gas is separated from the obtained first reaction mixture, a final mixed gas is obtained by finally mixing the unreacted gas and a fraction of the make-up gas, the final mixed gas after preheating is further increased in pressure and then methanol is synthesized, a final unreacted gas is separated from the obtained final reaction mixture, and the reaction temperature of the catalyst layer is controlled by the indirect heat exchange with pressurized boiling water.
    Type: Grant
    Filed: April 4, 2017
    Date of Patent: February 11, 2020
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Yasuaki Kambe, Kohei Uchida, Takuya Okamura, Daigo Hirakawa
  • Publication number: 20190161666
    Abstract: A method for producing a polyorganosiloxane resin composition including: (a) mixing a thermally-conductive filler having a particle size distribution having a single peak, with a surface treatment agent containing a siloxane to form a mixture, and (b) mixing the mixture from step (a) with a polysiloxane resin.
    Type: Application
    Filed: November 2, 2016
    Publication date: May 30, 2019
    Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
    Inventors: Eiji TANIGAWA, Masanori TAKANASHI, Isao IIDA, Daigo HIRAKAWA, Kenji TAKENAKA
  • Publication number: 20190152885
    Abstract: A method for producing methanol allows the temperature of the catalyst layer to fall within an appropriate temperature range, reduces energy used, and achieves higher carbon yield. In a synthesis loop including at least two synthesis steps and two separation steps, a first mixed gas is obtained by mixing the final unreacted gas with a fraction of the make-up gas, methanol is synthesized from the first mixed gas after preheating, a first unreacted gas is separated from the obtained first reaction mixture, a final mixed gas is obtained by finally mixing the unreacted gas and a fraction of the make-up gas, the final mixed gas after preheating is further increased in pressure and then methanol is synthesized, a final unreacted gas is separated from the obtained final reaction mixture, and the reaction temperature of the catalyst layer is controlled by the indirect heat exchange with pressurized boiling water.
    Type: Application
    Filed: April 4, 2017
    Publication date: May 23, 2019
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Yasuaki KAMBE, Kohei UCHIDA, Takuya OKAMURA, Daigo HIRAKAWA
  • Patent number: 10252963
    Abstract: Synthesizing methanol from a synthesis gas and separating an unreacted gas from a reaction mixture obtained by passing through the synthesis step, the method including a synthesis loop having at least two synthesis steps and at least two separation steps; obtaining a first mixed gas by increasing through a circulator a pressure of a residual gas, obtained by removing a purge gas from the final unreacted gas separated from the final reaction mixture subsequent to the final synthesis step, and by mixing the residual gas with a fraction of a make-up gas; synthesizing methanol; separating a first unreacted gas from the first reaction mixture obtained in the synthesizing step; obtaining a second mixed gas by mixing the first unreacted gas and a fraction of the make-up gas; finally synthesizing methanol; and separating the final unreacted gas from the final reaction mixture obtained in the final synthesis step.
    Type: Grant
    Filed: October 20, 2015
    Date of Patent: April 9, 2019
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Yasuaki Kambe, Kohei Uchida, Hiroshi Watanabe, Daigo Hirakawa, Tatsuya Hasegawa
  • Publication number: 20180134938
    Abstract: The present invention provides a thermally conductive composition good in thermal conductivity, low in viscosity and easy in application. The thermally conductive composition is a thermally conductive composition including (A) a spherical thermally conductive filler and (B) an alkoxysilane compound or dimethylpolysiloxane, wherein the spherical thermally conductive filler of component (A) is a mixture formulated with specific ratios of fillers having different average particle sizes, the mixture being formulated with a spherical thermally conductive filler made of a nitride and having an average particle size of 50 ?m or more in an amount of 30% by mass or more.
    Type: Application
    Filed: May 18, 2016
    Publication date: May 17, 2018
    Inventors: Daigo HIRAKAWA, Masanori TAKANASHI
  • Publication number: 20180127629
    Abstract: The present invention provides a thermally conductive composition good in thermal conductivity, low in viscosity and easy in application. The thermally conductive composition is a thermally conductive composition including (A) a spherical thermally conductive filler, (B) an alkoxysilane compound or dimethylpolysiloxane, and (C) a polyorganosiloxane (not inclusive of the dimethylpolysiloxane of component (B)), wherein component (A) is a mixture formulated with specific ratios of fillers having different average particle sizes, the mixture being formulated with a filler having an average particle size of 50 ?m or more in an amount of 30% by mass or more; component (B) and component (C) are included in a total amount of 1.5 to 35 parts by mass relative to 100 parts by mass of component (A); and a content ratio of component (C) in the total amount of component (B) and component (C) is 15 to 98% by mass.
    Type: Application
    Filed: May 18, 2016
    Publication date: May 10, 2018
    Inventors: Masanori TAKANASHI, Daigo HIRAKAWA
  • Publication number: 20170240492
    Abstract: Synthesizing methanol from a synthesis gas and separating an unreacted gas from a reaction mixture obtained by passing through the synthesis step, the method including a synthesis loop having at least two synthesis steps and at least two separation steps; obtaining a first mixed gas by increasing through a circulator a pressure of a residual gas, obtained by removing a purge gas from the final unreacted gas separated from the final reaction mixture subsequent to the final synthesis step, and by mixing the residual gas with a fraction of a make-up gas; synthesizing methanol; separating a first unreacted gas from the first reaction mixture obtained in the synthesizing step; obtaining a second mixed gas by mixing the first unreacted gas and a fraction of the make-up gas; finally synthesizing methanol; and separating the final unreacted gas from the final reaction mixture obtained in the final synthesis step.
    Type: Application
    Filed: October 20, 2015
    Publication date: August 24, 2017
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Yasuaki KAMBE, Kohei UCHIDA, Hiroshi WATANABE, Daigo HIRAKAWA, Tatsuya HASEGAWA