Abstract: Provided is an information processing device that includes at least one processor, wherein the at least one processor is configured to: acquire a satellite image of the ground, which is captured by an artificial satellite, for a target area based on disaster information; based on the satellite image, detect an obstruction on a road which relates to passage of a vehicle; and output a road for which no obstruction is detected as a traversable road.

Abstract: A solder composition of the invention contains: a flux composition containing (A) a rosin resin, (B) an activator, (C) an imidazoline compound having a phenyl group, and (D) an antioxidant; and (E) solder powder, in which the (B) component contains (B1) an organic acid, the (B1) component contains at least one selected from the group consisting of (B11) 1-hydroxy-2-naphthoic acid, 3-hydroxy-2-naphthoic acid, and 1,4-dihydroxy-2-naphthoic acid, and the (C) component is at least one selected from the group consisting of 2-phenylimidazoline and 2-benzylimidazoline.

Abstract: A solder composition contains: a flux composition containing an (A) rosin resin, a (B) activator, a (C) thixotropic agent, and a (D) solvent; and (E) solder powder, in which the (B) component contains a (B1) dicarboxylic acid having 3 to 8 carbon atoms, the (C) component contains at least one selected from the group consisting of a (C1) amide thixotropic agent having a hydroxy group in one molecule and a (C2) glycerol thixotropic agent having a hydroxy group in one molecule, and the solder composition satisfies a condition represented by Numerical Formula (F1) below provided that a total of contents of the (C1) component and the (C2) component is defined as X and a content of the (B1) component is defined as Y, X ? / ? 2 ? Y ? 5 X

Abstract: A solder composition of the invention contains: a flux composition containing (A) a rosin resin, (B) an activator, (C) an imidazoline compound having a phenyl group, and (D) an antioxidant; and (E) solder powder, in which the (B) component contains (B1) an organic acid, the (B1) component contains at least one selected from the group consisting of (B11) 1-hydroxy-2-naphthoic acid, 3-hydroxy-2-naphthoic acid, and 1,4-dihydroxy-2-naphthoic acid, and the (C) component is at least one selected from the group consisting of 2-phenylimidazoline and 2-benzylimidazoline.

Abstract: A solder composition of the invention includes: a flux composition containing a component (A) in a form of a rosin-based resin, a component (B) in a form of an activator, a component (C) in a form of a solvent and a component (D) in a form of a thixotropic agent; and a component (E) in a form of a solder powder. The component (C) in a form of the solvent contains a component (C1) in a form of a isobornyl cyclohexanol and a component (C2) in a form of a solvent whose viscosity at 20 degrees C. is 10 mPa·s or less and whose boiling point ranges from 220 degrees C. to 245 degrees C.

Abstract: A solder composition of the invention includes: a flux composition containing a component (A) in a form of a rosin-based resin, a component (B) in a form of an activator, a component (C) in a form of a solvent and a component (D) in a form of a thixotropic agent; and a component (E) in a form of a solder powder. The component (C) in a form of the solvent contains a component (C1) in a form of a isobornyl cyclohexanol and a component (C2) in a form of a solvent whose viscosity at 20 degrees C. is 10 mPa·s or less and whose boiling point ranges from 220 degrees C. to 245 degrees C.