Abstract: An antenna element includes a multilayer body and a coil conductor. The multilayer body includes a first non-magnetic portion and a first magnetic portion laminated together. The first magnetic portion is closer to a first principal surface than is the first non-magnetic portion. The coil conductor includes a first conductor pattern portion and a first insulating pattern portion. The first conductor pattern portion is disposed between the first non-magnetic portion and the first magnetic portion. The first insulating pattern portion is provided on the first conductor pattern portion at a side facing the second principal surface, and has a line width less than a line width of the first conductor pattern portion. The first insulating pattern portion overlaps the first conductor pattern portion in plan view as viewed in a lamination direction of the multilayer body.

Abstract: A ceramic multilayer body includes an outer layer including a first ceramic base material, a hollow portion provided in an inner side of the outer layer, an intermediate layer including a second ceramic base material and provided inside the hollow portion, and a pair of coupling portions each coupling one of both principal surfaces of the intermediate layer to the outer layer, wherein a void is provided by the hollow portion between the outer layer and the intermediate layer except for regions occupied by the coupling portions, and wherein, when observed through the ceramic multilayer body in the lamination direction, the pair of coupling portions at least partially overlap with each other, and areas of the pair of coupling portions are each smaller than an area of the intermediate layer. The first ceramic base material and the second ceramic base material have different material compositions from each other.

Abstract: Provided is a mother ceramic substrate that, when divided into individual substrates (ceramic substrates), can be divided to cause divided end surfaces to be perpendicular to principal surfaces of the individual substrates, and that can provide ceramic substrates with high form accuracy; an individual ceramic substrate obtained from the mother ceramic substrate; a module component including the ceramic substrate; and a method of manufacturing a mother ceramic substrate. In a mother ceramic substrate that can be divided at a predetermined position and separated into a plurality of individual substrates, a dividing groove that defines a division position is formed in a principal surface on one side, and a protruding thread is formed on a principal surface on another side at a position corresponding to a position of the dividing groove formed in the principal surface on the one side in view in a thickness direction of the mother ceramic substrate.

Abstract: Provided is a mother ceramic substrate that, when divided into individual substrates (ceramic substrates), can be divided to cause divided end surfaces to be perpendicular to principal surfaces of the individual substrates, and that can provide ceramic substrates with high form accuracy; an individual ceramic substrate obtained from the mother ceramic substrate; a module component including the ceramic substrate; and a method of manufacturing a mother ceramic substrate. In a mother ceramic substrate that can be divided at a predetermined position and separated into a plurality of individual substrates, a dividing groove that defines a division position is formed in a principal surface on one side, and a protruding thread is formed on a principal surface on another side at a position corresponding to a position of the dividing groove formed in the principal surface on the one side in view in a thickness direction of the mother ceramic substrate.

Abstract: A wiring board with a columnar conductor includes a wiring board defined by a multilayer ceramic board, a columnar conductor on an upper surface of the wiring board, and an insulating support portion arranged to support a side of the columnar conductor and having an external shape that expands from a tip of the columnar conductor toward the wiring board.

Abstract: A ceramic electronic component achieves a sufficient drop resistance strength even when terminal electrodes are formed with a higher density. The ceramic electronic component includes a ceramic laminate including ceramic laminates which are laminated to each other, first terminal electrodes disposed in a peripheral portion of a bottom surface of the ceramic laminate, catch pad electrodes arranged in the ceramic laminate so as to face the respective first terminal electrodes, and sets each including at least two first via hole conductors, which electrically connect the first terminal electrodes and the respective catch pad electrodes.

Abstract: A wiring board with a columnar conductor includes a wiring board defined by a multilayer ceramic board, a columnar conductor on an upper surface of the wiring board, and an insulating support portion arranged to support a side of the columnar conductor and having an external shape that expands from a tip of the columnar conductor toward the wiring board.

Abstract: A ceramic electronic component achieves a sufficient drop resistance strength even when terminal electrodes are formed with a higher density. The ceramic electronic component includes a ceramic laminate including ceramic laminates which are laminated to each other, first terminal electrodes disposed in a peripheral portion of a bottom surface of the ceramic laminate, catch pad electrodes arranged in the ceramic laminate so as to face the respective first terminal electrodes, and sets each including at least two first via hole conductors, which electrically connect the first terminal electrodes and the respective catch pad electrodes.