Patents by Inventor Daigo MURAI

Daigo MURAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • BORON NITRIDE PARTICLES, COMPOSITION FOR FORMING THERMALLY CONDUCTIVE MATERIAL, THERMALLY CONDUCTIVE MATERIAL, THERMALLY CONDUCTIVE SHEET, AND DEVICE WITH THERMALLY CONDUCTIVE LAYER
    Publication number: 20220332921
    Abstract: The present invention provides boron nitride particles that can be used for preparation of a thermally conductive material having excellent thermally conductive properties and peel strength. In addition, the present invention provides a composition for forming a thermally conductive material, a thermally conductive material, a thermally conductive sheet, and a device with a thermally conductive layer, in relation to the boron nitride particles. In the boron nitride particles of the present invention, an atomic concentration ratio of oxygen atomic concentration to boron atomic concentration on a surface, detected by X-ray photoelectron spectroscopy, is 0.12 or greater, and a D value obtained by Equation (1) is 0.010 or less.
    Type: Application
    Filed: June 24, 2022
    Publication date: October 20, 2022
    Applicant: FUJIFILM Corporation
    Inventors: Aki NAKAMICHI, Takuya KITAMURA, Kengo SAITO, Daigo MURAI
  • METHOD FOR PRODUCING ELECTROCONDUCTIVE LAMINATE, LAMINATE, AND ELECTROCONDUCTIVE LAMINATE
    Publication number: 20190010608
    Abstract: An object of the present invention is to provide a method for producing an electroconductive laminate, which is capable of forming a metal layer having low resistance at a position corresponding to a patterned plated layer, a laminate, and an electroconductive laminate.
    Type: Application
    Filed: September 14, 2018
    Publication date: January 10, 2019
    Applicant: FUJIFILM Corporation
    Inventors: Kohei HIGASHI, Takehiro KASAHARA, Daigo MURAI