Abstract: A drop in image quality is suppressed while inspecting for misalignment in a semiconductor package in which a solid-state image sensor is connected to a substrate by wires. The semiconductor package includes a solid-state image sensor and a light-blocking film. In the semiconductor package, the solid-state image sensor, which is a rectangle, is provided with a pixel array unit. Additionally, in the semiconductor package, a light guide part and window parts are provided in the light-blocking film. The light guide part guides incident light to the pixel array unit. The window parts are provided in positions corresponding to each of a plurality of corners of the rectangle.