Abstract: A semiconductor storage device includes a housing, an interface substrate attached to the housing, an insulating substrate in the housing, a first flexible substrate connecting the insulating substrate and the interface substrate, a first integrated circuit on a first surface of the insulating substrate, and a first heat conductor arranged on a second surface of the insulating substrate that is opposite to the first surface, and contacting a first inner surface of the housing.

Abstract: A printed wiring board includes a first insulator, a second insulator, a first conductor, and a second conductor. The first conductor is between the first insulator and the second insulator. The first conductor contains a first conductive material. The second conductor includes a first portion. The first portion is between the first insulator and the first conductor. The first portion is in contact with the first conductor and extends along the first conductor. The second conductor contains a second conductive material. The second conductive material is lower in electrical resistivity than the first conductive material. The second insulator is closer to an outside of the printed wiring board than the first insulator is in a thickness direction of the printed wiring board.

Abstract: A printed wiring board includes a first insulator, a second insulator, a first conductor, and a second conductor. The first conductor is between the first insulator and the second insulator. The first conductor contains a first conductive material. The second conductor includes a first portion. The first portion is between the first insulator and the first conductor. The first portion is in contact with the first conductor and extends along the first conductor. The second conductor contains a second conductive material. The second conductive material is lower in electrical resistivity than the first conductive material. The second insulator is closer to an outside of the printed wiring board than the first insulator is in a thickness direction of the printed wiring board.

Abstract: A semiconductor storage device includes a housing, an interface substrate attached to the housing, an insulating substrate in the housing, a first flexible substrate connecting the insulating substrate and the interface substrate, a first integrated circuit on a first surface of the insulating substrate, and a first heat conductor arranged on a second surface of the insulating substrate that is opposite to the first surface, and contacting a first inner surface of the housing.

Abstract: Method for manufacturing an optical display device which allows for appropriately correcting a linear deformation generated on a pressure-sensitive adhesive layer in laminating an optical functional film with a panel member includes steps of peeling a sheet of optical functional film together with the pressure-sensitive adhesive layer from a carrier film up to a predetermined head-out length, stopping the conveyance of the carrier film for detecting the front edge, making the front edge of the sheet of optical functional film proceed to the laminating position, laminating from the front edge to a predetermined position upstream of the head-out length on the sheet of optical functional film with the panel member at a first lamination speed, and laminating at least a part from the predetermined position to a rear edge of the sheet of optical functional film with the panel member at a speed faster than the first lamination speed.

Abstract: A method for manufacturing an optical display device from a web of optical film laminate including a carrier film, a pressure-sensitive adhesive layer formed on one of opposite surfaces of the carrier film, and a plurality of sheets of optical functional film continuously supported on the carrier film via the pressure-sensitive adhesive layer, comprises folding the other of opposite surfaces of the carrier film inside via a tip end of a releasing body to wind the carrier film, peeling the sheet of optical functional film to a head-out state while exposing the pressure-sensitive adhesive layer, stopping winding of the carrier film, detecting a front end of the peeled sheet of optical functional film in the head-out state, and rewinding the carrier film integrally with the sheet of optical functional film in the head-out state to mend a deformation of a pressure-sensitive adhesive, at the tip end of the releasing body.

Abstract: A module includes a substrate, a first wiring, a second wiring, and an interlayer connection section. The substrate includes a first surface facing a first direction, a second surface facing a second direction opposite to the first direction, and an inner surface of a hole extending between the first surface and the second surface. The first wiring is provided on the first surface. The second wiring is provided on the second surface. The interlayer connection section includes a first conductor provided on the inner edge, connected to the first wiring and the second wiring, thinner than the first wiring, and thinner than the second wiring, and a second conductor disposed in the hole and electrically connected to the first conductor.

Abstract: A semiconductor device includes a substrate including, on a surface thereof, a first conductive pad and a first insulating layer formed around the first conductive pad, a semiconductor chip including, on a surface thereof, a second conductive pad and a second insulating layer around the second conductive pad, an intermediate layer formed between the substrate and the semiconductor chip, and including a conductive portion between the first and second conductive pads, and an insulating portion between the first and second insulating layers, and a molecular bonding layer formed between the substrate and the intermediate layer, and including at least one of a first molecular portion covalently bonded to a material of the first conductive pad and a material of the conductive portion, and a second molecular portion covalently bonded to a material of the first insulating layer and a material of the insulating portion.

Abstract: A fastener having threads includes a main body including a head portion and a thread portion having the threads, a sensor mounted on the main body and configured to detect orientation of the fastener, and a wireless module mounted on the main body and configured to transmit data indicating the detected orientation through a wireless signal.

Abstract: A fastener having threads includes a main body including a head portion and a thread portion having the threads, a sensor mounted on the main body and configured to detect orientation of the fastener, and a wireless module mounted on the main body and configured to transmit data indicating the detected orientation through a wireless signal.

Abstract: According to one embodiment, an electronic component includes a metal portion, a mold resin covering at least a part of the metal portion, and a molecular adhesion layer provided between a surface of the metal portion and the mold resin.

Abstract: An electronic device module includes a substrate, an imaging unit disposed on the substrate and electrically connected thereto, a resin member disposed on the substrate and covering an peripheral region of the imaging unit, a lens unit disposed above the imaging unit, and a frame having a portion that is disposed on a top surface of the resin member and supports the lens unit.

Abstract: According to one embodiment, a printed wiring board includes a circuit board, a ground pattern provided on the circuit board, a wiring pattern provided on the circuit board, a conductive reinforcing plate covering the ground pattern and the wiring pattern and electrically connected with the ground pattern, and an insulating portion provided between the conductive reinforcing plate and the wiring pattern.

Abstract: A power supply stabilizing circuit includes a diode having a cathode connected to an output terminal of a direct current power circuit configured to generate a direct current voltage and to supply the voltage therefrom to a load circuit, and a capacitor connected to an anode of the diode. The power supply stabilizing circuit may further include a transistor having a first terminal connected to the output terminal of the direct current power circuit, a second terminal connected to a connection node between the diode and the capacitor, and a switching electrode connected to the connection node.

Abstract: According to one embodiment, an electronic component includes a metal portion, a mold resin covering at least a part of the metal portion, and a molecular adhesion layer provided between a surface of the metal portion and the mold resin.

Abstract: An electronic apparatus includes a first substrate, an electronic component mounted on a first surface of the first substrate, a plurality of first lands on a second surface of the first substrate that is opposite the first surface, the first lands electrically connected to the electronic component and arranged at a first interval, and a plurality of second lands on the second surface of the first substrate and surrounding the first lands, the second lands arranged at a second interval that is smaller than the first interval.

Abstract: A camera module includes a metal plate including a recessed portion, a flexible printed board having a portion that is accommodated in the recessed portion, an image sensor arranged on the portion of the printed board accommodated in the recessed portion, and a case including a lens for guiding light to the image sensor.

Abstract: According to one embodiment, a printed wiring board includes a circuit board, a ground pattern provided on the circuit board, a wiring pattern provided on the circuit board, a conductive reinforcing plate covering the ground pattern and the wiring pattern and electrically connected with the ground pattern, and an insulating portion provided between the conductive reinforcing plate and the wiring pattern.

Abstract: A self-ballasted lamp includes a base body, a light source unit attached to one side of the base body, a lens attached to the light source unit, a cap provided on the other side of the base body and a lighting circuit arranged in the space provided by the base body and the cap. The light source unit includes a light source constituted by semiconductor light emitting elements. The lens has a lens body facing the light source and an attachment leg for attaching the lens body to the light source unit. A claw portion to be secured to the light source unit can be provided on the attachment leg.

Abstract: According to one embodiment, the illuminating device of the embodiment has a base part and multiple light emitting elements; the illuminating device includes a supporting part, which is arranged on one end of the base part, and which at least partially encloses an internal space. The supporting part also has an outer surface exposed to the ambient atmosphere. The multiple light emitting elements are disposed on the inner surface side of the supporting part so that at least light emitting surfaces of the light emitting elements are in contact with the supporting part.