Patents by Inventor Daigo TSUBAI

Daigo TSUBAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11910526
    Abstract: A wired circuit board includes a metal supporting layer, an insulating base layer and a conductor layer from bottom to top. A peripheral edge of the insulating base layer includes an extension part extending further outward relative to the metal supporting layer. The metal supporting layer has a thickness T1 of 50 ?m or more.
    Type: Grant
    Filed: June 11, 2020
    Date of Patent: February 20, 2024
    Assignee: NITTO DENKO CORPORATION
    Inventors: Hayato Takakura, Daigo Tsubai, Hiroaki Machitani
  • Publication number: 20230240007
    Abstract: A wiring circuit board includes a metal support substrate, an insulating layer, and a conductive layer in this order in a thickness direction, and has an edge portion extending in a first direction. The edge portion includes a main structure portion and partially includes a partial structure portion. In the main structure portion, the metal support substrate has a substrate extension portion extending outwardly with respect to the insulating layer in a second direction perpendicular to the first direction and the thickness direction. In the partial structure portion, the insulating layer has an insulating layer extension portion extending outwardly with respect to the metal support substrate in the second direction.
    Type: Application
    Filed: May 27, 2021
    Publication date: July 27, 2023
    Applicant: NITTO DENKO CORPORATION
    Inventors: Daigo TSUBAI, Naoki SHIBATA, Hiroaki MACHITANI
  • Publication number: 20220287177
    Abstract: A wired circuit board includes a metal supporting layer, an insulating base layer and a conductor layer from bottom to top. A peripheral edge of the insulating base layer includes an extension part extending further outward relative to the metal supporting layer. The metal supporting layer has a thickness T1 of 50 ?m or more.
    Type: Application
    Filed: June 11, 2020
    Publication date: September 8, 2022
    Applicant: NITTO DENKO CORPORATION
    Inventors: Hayato TAKAKURA, Daigo TSUBAI, Hiroaki MACHITANI
  • Patent number: 11171514
    Abstract: A wireless power transmission system includes a power-supplying device including an electronic oscillator that generates electric power having a frequency of 1 MHz or more and 5 MHz or less, and a power-supplying coil member in which the electric power flows; and a power-receiving device including a power-receiving coil member that is capable of generating electric power based on the magnetic field generating from the power-supplying coil member, wherein the power-receiving coil member is a sheet coil including an insulating layer and a first coil pattern disposed at one side of the insulating layer, the first coil pattern is composed of wires, and the wires are disposed in spaced apart relation from each other with a predetermined space provided therebetween in the radial direction of the first coil pattern.
    Type: Grant
    Filed: March 28, 2018
    Date of Patent: November 9, 2021
    Assignee: NITTO DENKO CORPORATION
    Inventors: Taiki Sueyoshi, Masami Inoue, Hisashi Tsuda, Takashi Oda, Kaoru Ito, Hideshi Yamakawa, Daigo Tsubai, Toru Mizutani, Yasuyuki Ota
  • Publication number: 20210152953
    Abstract: A battery pack includes a secondary battery, a coil member, a circuit board, a housing, and a metal member. The metal member has a plurality of strip portions extending along the direction orthogonal to the thickness direction of the housing from the inside of the housing toward the peripheral end edge, and connected to each other inside the housing. The plurality of strip portions each has an end edge positioned at the peripheral end edge of the housing, and each of the end edges of the plurality of strip portions is position defined at different positions at the peripheral end edge of the housing.
    Type: Application
    Filed: July 31, 2018
    Publication date: May 20, 2021
    Applicant: NITTO DENKO CORPORATION
    Inventors: Taiki SUEYOSHI, Masami INOUE, Hisashi TSUDA, Toru MIZUTANI, Kaoru ITO, Daigo TSUBAI, Hideshi YAMAKAWA
  • Publication number: 20210135300
    Abstract: A battery pack includes a secondary battery having a battery negative electrode terminal disposed at one side in thickness direction of the secondary battery and a battery positive electrode terminal disposed at the other side in thickness direction of the secondary battery; a coil member; a circuit board electrically connected with the battery negative electrode terminal, the battery positive electrode terminal, and the coil member; and a housing accommodating the secondary battery, the coil member, and the circuit board, wherein the battery negative electrode terminal is exposed to the outside of the housing.
    Type: Application
    Filed: March 28, 2018
    Publication date: May 6, 2021
    Applicant: NITTO DENKO CORPORATION
    Inventors: Taiki SUEYOSHI, Masami INOUE, Hisashi TSUDA, Takashi ODA, Kaoru ITO, Hideshi YAMAKAWA, Daigo TSUBAI, Toru MIZUTANI, Yasuyuki OTA
  • Publication number: 20200014246
    Abstract: A wireless power transmission system includes a power-supplying device including an electronic oscillator that generates electric power having a frequency of 1 MHz or more and 5 MHz or less, and a power-supplying coil member in which the electric power flows; and a power-receiving device including a power-receiving coil member that is capable of generating electric power based on the magnetic field generating from the power-supplying coil member, wherein the power-receiving coil member is a sheet coil including an insulating layer and a first coil pattern disposed at one side of the insulating layer, the first coil pattern is composed of wires, and the wires are disposed in spaced apart relation from each other with a predetermined space provided therebetween in the radial direction of the first coil pattern.
    Type: Application
    Filed: March 28, 2018
    Publication date: January 9, 2020
    Applicant: NITTO DENKO CORPORATION
    Inventors: Taiki SUEYOSHI, Masami INOUE, Hisashi TSUDA, Takashi ODA, Kaoru ITO, Hideshi YAMAKAWA, Daigo TSUBAI, Toru MIZUTANI, Yasuyuki OTA