Abstract: A semiconductor device includes first and second semiconductor chips formed with electrodes on front and reverse sides, a first bus bar on which the first semiconductor chip is mounted so as the reverse side electrode to be connected thereto, a second bus bar, arranged parallel with the first bus bar, on which the second semiconductor chip is mounted so as the reverse side electrode to be connected thereto, a third bus bar that is press-connected to the front side electrode of the first semiconductor chip, a fourth bus bar that is press-connected to the front side electrode of the second semiconductor chip, and a connecting section that electrically connects the first bus bar and the fourth bus bar.