Abstract: The present disclosure provides an inorganic/organic hybrid complementary semiconductor device that can be manufactured at a lower cost, has excellent long-term stability, has a well-balanced operation between the p-type transistor and the n-type transistor, and operates at a high speed.

Abstract: The present disclosure provides a sealing material suitable for a compound having a non-stoichiometric composi263tion. The present disclosure is related to a sealing material for a compound having a non-stoichiometric composition, the sealing material including a polymer layer and an inorganic oxide insulator layer, wherein the polymer layer includes a first polymer layer containing an organic solvent soluble polymer.

Abstract: Provided is a compound capable of forming through a printing process an organic semiconductor exhibiting high charge mobility. The compound according to the present disclosure is represented by Formula (1) below. In Formula (1), X1 and X2 are the same or different and each represent —O—, —NR1—, or —PR2-. Y1 and Y2 are the same or different and each represent an oxygen atom or a sulfur atom. Z1 to Z8 are the same or different and each represent ?N— or ?CR3—. The R1, R2, and R3 are the same or different and each represent a hydrogen atom or an organic group. n represents an integer of 0 or greater.

Abstract: Provided is a conductor material having high conductivity. The conductor material according to an embodiment of the present disclosure has a configuration in which a conjugated polymeric compound having an electron donating group containing a heteroatom in a side chain is doped with a dopant containing an anion selected from a nitrogen anion, a boron anion, a phosphorus anion and an antimony anion, and a counter cation. The anion is preferably an anion represented by Formula (1) below: where R1 and R2 are identical or different, and each represent an electron withdrawing group; and R1 and R2 may be bonded to each other to form a ring with an adjacent nitrogen atom.

Abstract: Provided is a dopant with which a conductor material having high electrical conductivity can be formed. The present disclosure relates to a dopant containing a radical cation represented by Formula (1) and a counter anion. In Formula (1), R1 to R3 may be the same or different, and each denotes a monovalent aromatic group or a group represented by Formula (r). at least one of R1 to R3 is a group represented by Formula (r), and n indicates the valence of the radical cation and is equal to the quantity (n) of nitrogen atoms in the formula. In Formula (r), Ar1, Ar2, and Ar3 may be the same or different, and each denotes a divalent aromatic group, and Ar4, Ar5, Ar6, and Ar7 may be the same or different, and each denotes a monovalent aromatic group optionally having a substituent represented by Formula (sb) below. Furthermore, m and n may be the same or different, and each represents an integer of 0 or greater.

Abstract: Provided is a compound that is excellent in chemical stability, has a high solubility in a solvent, and exhibits an excellent carrier mobility. A compound represented by Formula (1): where in Formula (1), X1, X2, X3, and R1 to R10 are as defined in the specification.

Abstract: A novel dopant according to the present disclosure includes an anion represented by the following Formula (1) and a counter cation. In Formula (1), R1 and R2 may be each at least one group selected from a nitro group, a cyano group, an acyl group, a carboxyl group, an alkoxycarbonyl group, a haloalkyl group, a sulfo group, an alkylsulfonyl group, an halosulfonyl group, and a haloalkylsulfonyl group, or may be a group formed by R1 and R2 bonded to each other [—SO2-L-SO2—] (where L represents a haloalkylene group). The counter cation may be a radical cation represented by Formula (2), where R1 and R2 represent electron-withdrawing groups that may be bonded to each other to form a heterocycle, and R3 to R5 represent a hydrogen atom, a hydrocarbon group that may have a substituent, or a heterocyclic group that may have a substituent. The dopant is capable of forming an electroconductive composition that shows a high conductivity.

Abstract: There is provided a method of manufacturing a composite molded body that can increase a processing speed and a joining strength in a different direction. The method of manufacturing a composite molded body in which a metal molded body and a resin molded body are joined, includes the steps of: continuously irradiating a joint surface of the metal molded body with laser light at an irradiation speed of 2,000 mm/sec or more by using a continuous-wave laser; and arranging, within a mold, a portion of the metal molded body including the joint surface irradiated with the laser light in the preceding step and performing injection molding of a resin forming the resin molded body, or performing compression molding in a state where a portion of the metal molded body including the joint surface irradiated with the laser light in the preceding step and a resin forming the resin molded body are made to contact with each other.

Abstract: A composite molded article contains a metal molded article and a resin molded article, which are bonded to each other, in which the metal molded article has a roughened bonding surface, a surface layer portion of the metal molded article including the roughened bonding surface has: open holes containing: a stem hole that is formed in a thickness direction and has an opening on the side of the bonding surface, and a branch hole that is formed from an inner wall of the stem hole in a different direction from the stem hole, and the composite molded article is bonded in such a state that the resin permeates into the open holes formed on the bonding surface of the metal molded article.

Abstract: There is provided a method of manufacturing a composite molded body that can increase a processing speed and a joining strength in a different direction. The method of manufacturing a composite molded body in which a metal molded body and a resin molded body are joined, includes the steps of: continuously irradiating a joint surface of the metal molded body with laser light at an irradiation speed of 2,000 mm/sec or more by using a continuous-wave laser; and arranging, within a mold, a portion of the metal molded body including the joint surface irradiated with the laser light in the preceding step and performing injection molding of a resin forming the resin molded body, or performing compression molding in a state where a portion of the metal molded body including the joint surface irradiated with the laser light in the preceding step and a resin forming the resin molded body are made to contact with each other.

Abstract: There is provided a method of manufacturing a composite molded body that can increase a processing speed and a joining strength in a different direction. The method of manufacturing a composite molded body in which a metal molded body and a resin molded body are joined, includes the steps of: continuously irradiating a joint surface of the metal molded body with laser light at an irradiation speed of 2,000 mm/sec or more by using a continuous-wave laser; and arranging, within a mold, a portion of the metal molded body including the joint surface irradiated with the laser light in the preceding step and performing injection molding of a resin forming the resin molded body, or performing compression molding in a state where a portion of the metal molded body including the joint surface irradiated with the laser light in the preceding step and a resin forming the resin molded body are made to contact with each other.

Abstract: Provided are a novel organic polymer useful for forming an organic semiconductor and a use of the novel organic polymer. A compound represented by the following formula (Ia) is subjected to a coupling reaction to give an organic polymer: wherein a ring A and a ring B represent an aromatic hydrocarbon ring or an aromatic heterocyclic ring, n denotes an integer of 0 or 1 to 6, R1 to R2+n represent a substituent (such as an alkyl group), a1 to a (2+n) denote an integer of 0 to 2, a ring C represents a benzene ring ortho-fused sequentially and nonlinearly to an adjacent benzene ring depending on the number of n, X represents a hydrogen atom, a halogen atom, a lithium atom, or —MgX1 (wherein X1 represents a halogen atom).

Abstract: A composite molded article contains a metal molded article and a resin molded article, which are bonded to each other, in which the metal molded article has a roughened bonding surface, a surface layer portion of the metal molded article including the roughened bonding surface has: open holes containing: a stem hole that is formed in a thickness direction and has an opening on the side of the bonding surface, and a branch hole that is formed from an inner wall of the stem hole in a different direction from the stem hole, and the composite molded article is bonded in such a state that the resin permeates into the open holes formed on the bonding surface of the metal molded article.

Abstract: There is provided a method of manufacturing a composite molded body that can increase a processing speed and a joining strength in a different direction. The method of manufacturing a composite molded body in which a metal molded body and a resin molded body are joined, includes the steps of: continuously irradiating a joint surface of the metal molded body with laser light at an irradiation speed of 2,000 mm/sec or more by using a continuous-wave laser; and arranging, within a mold, a portion of the metal molded body including the joint surface irradiated with the laser light in the preceding step and performing injection molding of a resin forming the resin molded body, or performing compression molding in a state where a portion of the metal molded body including the joint surface irradiated with the laser light in the preceding step and a resin forming the resin molded body are made to contact with each other.