Abstract: The present disclosure provides an inorganic/organic hybrid complementary semiconductor device that can be manufactured at a lower cost, has excellent long-term stability, has a well-balanced operation between the p-type transistor and the n-type transistor, and operates at a high speed.

Abstract: The present disclosure provides a sealing material suitable for a compound having a non-stoichiometric composi263tion. The present disclosure is related to a sealing material for a compound having a non-stoichiometric composition, the sealing material including a polymer layer and an inorganic oxide insulator layer, wherein the polymer layer includes a first polymer layer containing an organic solvent soluble polymer.

Abstract: A thermoplastic resin composition comprising; a thermoplastic resin (A) selected from the group consisting of an aromatic polycarbonate resin (A1), a styrene-based resin (A2), an aromatic polyester resin (A3), a polyphenylene ether resin (A4), a methacrylic resin (A5), a polyarylene sulfide resin (A6), an olefin resin (A7), a polyamide resin (A8), and mixtures thereof; a hydrophilic copolymer (B) having a polyoxyethylene chain; and a fatty acid metal salt (C) represented by the following formula (1): M(OH)y(R—COO)x . . . (1), wherein R is an alkyl group or alkenyl group having 6 to 40 carbon atoms; M is at least one metal element selected from the group consisting of aluminum, zinc, calcium, magnesium, lithium, and barium; and x and y each independently represent an integer of 0 or more, and satisfy the relation represented by x+y=[valency of M].