Patents by Inventor Daijo CHIDA
Daijo CHIDA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240097303Abstract: According to one embodiment, an isolator includes a first coil, a second coil, a plate-shaped first magnet, and a first insulator. The second coil is aligned with the first coil along a first axis and faces the first coil. The first magnet is provided on a side of the second coil and faces the second coil, the side being opposite to a side where the first coil is located. The first magnet extends along a first plane intersecting the first axis. The first insulator seals the first coil, the second coil, and the first magnet.Type: ApplicationFiled: January 20, 2023Publication date: March 21, 2024Inventors: Jia LIU, Yusuke IMAIZUMI, Minoru TAKIZAWA, Yoshinari TAMURA, Daijo CHIDA
-
Publication number: 20240090120Abstract: According to one embodiment, an isolator includes: a first semiconductor chip; a second semiconductor chip; a first wiring board including a first surface provided thereon with the first semiconductor chip; a second wiring board including a second surface provided thereon with the second semiconductor chip, the second wiring board being spaced apart from the first wiring board; a third wiring board spaced apart from each of the first and second wiring boards; a first coil on the first surface; a second coil on the second surface; a third coil on a third surface of the third wiring board, the third surface facing the first and second surfaces, the third coil facing the first coil; a fourth coil on the third surface, facing the second coil, and electrically coupled to the third coil; and an insulator provided between the first to fourth coils.Type: ApplicationFiled: February 23, 2023Publication date: March 14, 2024Inventors: Yoshinari TAMURA, Yusuke IMAIZUMI, Jia LIU, Daijo CHIDA, Minoru TAKIZAWA
-
Publication number: 20240087802Abstract: According to one embodiment, an isolator includes: an isolator module including a first coil and a second coil that are separated with respect to a first direction and face each other; a magnetic member provided on the isolator module in such a manner that the magnetic member overlaps the first coil and the second coil when viewed in the first direction; and an insulating member covering the isolator module and the magnetic member.Type: ApplicationFiled: February 24, 2023Publication date: March 14, 2024Inventors: Jia LIU, Yusuke IMAIZUMI, Yoshinari TAMURA, Daijo CHIDA, Minoru TAKIZAWA
-
Patent number: 10204891Abstract: According to one embodiment, a semiconductor module includes a first semiconductor element, a second semiconductor element, a first light emitting element and a second light emitting element. The first semiconductor element is provided with a first light receiving circuit and a first output circuit. The second semiconductor element is provided with a second light receiving circuit and a second output circuit. The first light emitting element is electrically connected to the second output circuit and mounted on the first semiconductor element such that first light emitted from the first light emitting element is received by the first light receiving circuit. The second light emitting element is electrically connected to the first output circuit and mounted on the second semiconductor element such that second light emitted from the second light emitting element is received by the second light receiving circuit.Type: GrantFiled: March 16, 2017Date of Patent: February 12, 2019Assignee: Kabushiki Kaisha ToshibaInventors: Naohisa Okumura, Daijo Chida, Hiroaki Kishi, Isao Ogawa, Masaru Koseki
-
Publication number: 20170186738Abstract: According to one embodiment, a semiconductor module includes a first semiconductor element, a second semiconductor element, a first light emitting element and a second light emitting element. The first semiconductor element is provided with a first light receiving circuit and a first output circuit. The second semiconductor element is provided with a second light receiving circuit and a second output circuit. The first light emitting element is electrically connected to the second output circuit and mounted on the first semiconductor element such that first light emitted from the first light emitting element is received by the first light receiving circuit. The second light emitting element is electrically connected to the first output circuit and mounted on the second semiconductor element such that second light emitted from the second light emitting element is received by the second light receiving circuit.Type: ApplicationFiled: March 16, 2017Publication date: June 29, 2017Applicant: Kabushiki Kaisha ToshibaInventors: Naohisa OKUMURA, Daijo CHIDA, Hiroaki KISHI, Isao OGAWA, Masaru KOSEKI
-
Patent number: 9633984Abstract: According to one embodiment, a semiconductor module includes a first semiconductor element, a second semiconductor element, a first light emitting element and a second light emitting element. The first semiconductor element is provided with a first light receiving circuit and a first output circuit. The second semiconductor element is provided with a second light receiving circuit and a second output circuit. The first light emitting element is electrically connected to the second output circuit and mounted on the first semiconductor element such that first light emitted from the first light emitting element is received by the first light receiving circuit. The second light emitting element is electrically connected to the first output circuit and mounted on the second semiconductor element such that second light emitted from the second light emitting element is received by the second light receiving circuit.Type: GrantFiled: March 4, 2016Date of Patent: April 25, 2017Assignee: Kabushiki Kaisha ToshibaInventors: Naohisa Okumura, Daijo Chida, Hiroaki Kishi, Isao Ogawa, Masaru Koseki
-
Publication number: 20160268240Abstract: According to one embodiment, a semiconductor module includes a first semiconductor element, a second semiconductor element, a first light emitting element and a second light emitting element. The first semiconductor element is provided with a first light receiving circuit and a first output circuit. The second semiconductor element is provided with a second light receiving circuit and a second output circuit. The first light emitting element is electrically connected to the second output circuit and mounted on the first semiconductor element such that first light emitted from the first light emitting element is received by the first light receiving circuit. The second light emitting element is electrically connected to the first output circuit and mounted on the second semiconductor element such that second light emitted from the second light emitting element is received by the second light receiving circuit.Type: ApplicationFiled: March 4, 2016Publication date: September 15, 2016Applicant: Kabushiki Kaisha ToshibaInventors: Naohisa OKUMURA, Daijo CHIDA, Hiroaki KISHI, Isao OGAWA, Masaru KOSEKI