Patents by Inventor Daijyu Yoshino

Daijyu Yoshino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4846938
    Abstract: An electrically conductive layer is formed on a surface of a model, and an organic solvent layer of an organic solvent which is inactive with respect to the conductive layer is formed on a surface of the conductive layer. Particles are then placed on the organic solvent layer to allow the particles to be partly melted by the organic solvent layer, and the organic solvent layer is removed to allow the particles to be adhered to the conductive layer. A metal layer is deposited on the model in an electroforming process to form an electroformed shell thinner than the diameter of the particles. The electroformed shell is separated from the model, and the particles are dissolved away from the electroformed shell with an organic solvent to produce an electroformed object having a number of vent apertures.
    Type: Grant
    Filed: July 13, 1988
    Date of Patent: July 11, 1989
    Assignee: Honda Giken Kogyo Kabushiki Kaisha
    Inventors: Yuichi Tazaki, Osamu Ishigami, Akira Ichikawa, Daijyu Yoshino, Akira Soyama