Abstract: A substrate treating apparatus includes a process tank for storing a treatment liquid, a chamber for surrounding the process tank, a solvent vapor nozzle for supplying solvent vapor into the chamber, a cleaning liquid nozzle for supplying a cleaning liquid, and a controller. The controller causes immersion treatment, where a substrate is immersed in the treatment liquid stored in the process tank, to be performed for a preset period of time, and causes dry treatment, where the substrate processed with the treatment liquid and taken out of the process tank is dried with the solvent vapor supplied from the solvent vapor nozzle, to be performed. The controller causes the cleaning liquid nozzle to supply the cleaning liquid into the chamber and causes the process tank to be immersed in the cleaning liquid stored in the chamber, whereby the chamber cleaning treatment, where the chamber including an outer wall of the process tank is cleaned, is performed.

Abstract: A substrate processing method is provided. The substrate processing method includes: (S7) supplying a water repellent agent (SMT) to a substrate (W); (S11) supplying dilute isopropyl alcohol (dIPA) to the substrate (W) after the supplying a water repellent agent (SMT), the dilute isopropyl alcohol (dIPA) being obtained by diluting isopropyl alcohol; and (S12) drying the substrate (W) after the supplying dilute isopropyl alcohol (dIPA).

Abstract: A substrate treatment method includes a first gas treating step, a water-repellency treatment step, and a spraying step. In the first gas treating step, a first gas is supplied to the substrate inside the chamber in a state in which the inside of the chamber is decompressed. The first gas includes gas of an organic solvent. The water-repellency treatment step is executed after the first gas treating step. In the water-repellency treatment step, the inside of the chamber is in the decompressed state, and a water-repellent agent is supplied to the substrate inside the chamber. The spraying step is executed after the water-repellency treatment step. In the spraying step, the inside of the chamber is in the decompressed state, and a first liquid is sprayed over the substrate inside the chamber. The first liquid includes liquid of an organic solvent.

Abstract: The substrate treatment method includes a first decompressing step, a first pressurizing step, and a first atmospheric pressure step. In the first decompressing step, the inside of a chamber is in a decompressed state, and a first gas is supplied to a substrate inside the chamber. The first gas includes an organic solvent. The first pressurizing step is executed after the first decompressing step. In the first pressurizing step, mixed gas is supplied to the substrate inside the chamber, and the inside of the chamber is pressurized from the decompressed state to an atmospheric pressure state. The mixed gas includes an organic solvent and inert gas. The first atmospheric pressure step is executed after the first pressurizing step. In the first atmospheric pressure step, the inside of the chamber is maintained in the atmospheric pressure state, and at least any of liquid discharge treatment and substrate treatment is performed.

Abstract: A substrate treatment method includes a rinsing step of performing treatment of a substrate with a rinse liquid, an immersing step of immersing the substrate in a diluted isopropyl alcohol (dIPA) stored in a treatment tank after the rinsing step, a first isopropyl alcohol treatment step of performing treatment of the substrate with an isopropyl alcohol after the immersing step, and a water-repellent treatment step of performing water-repellent treatment of the substrate after the first isopropyl alcohol treatment step.

Abstract: As the diamond crystal, a diamond crystal in a bulk form including dislocation concentration regions is formed. An interval between each of the dislocation concentration regions is from 10 nm to 4000 nm. The crystal orientation of crystal main face at the surface of the diamond crystal is any one of (100), (111), or (110). An external shape of the diamond crystal in a surface direction is a rectangle, a circle, or a circle having an orientation flat plane. The rectangle is set to have a side length of not less than 8.0 mm. The circle is set to have a diameter of not less than 8.0 mm.

Abstract: A method for polishing a diamond crystal includes preparing a diamond crystal having a main surface having a plane orientation of (100). Mechanical polishing is performed on the main surface using a polishing wheel such that: a tangent contacts a curve extending in a rotation direction of the wheel and contacting a contact position between the diamond crystal and the wheel that is rotating; and a tangent direction of the tangent at the contact position is within a range of ±10 degrees relative to a <110> direction of the diamond crystal, thereby causing an affected region to appear such that the affected region is parallel to a direction of a plane orientation (111) of the diamond crystal and penetrates the diamond crystal onto the main surface. Chemical mechanical polishing is performed on the main surface to remove the affected region, thereby removing the affected region from the main surface.

Abstract: In a communication system, communication apparatuses provided with their respective antennas are wiredly connected in serial, and a control apparatus receives a signal based on a radio signal received by one of the communication apparatuses. In the system, one of the communication apparatuses determines whether reception quality of a radio signal received via the antenna thereof satisfies predetermined quality, and transmits, to a second communication apparatus or the control apparatus that is wiredly connected thereto, a signal based on the received radio signal if the reception quality satisfies the predetermined quality, and a signal based on a wired signal received from a first communication apparatus wiredly connected thereto if the reception quality does not satisfy the predetermined quality.

Abstract: A wireless communication device forms a second directivity response pattern having a null value in the direction of a main lobe of a first directivity response pattern, and communicates with a communication partner device by using the first directivity response pattern and the second directivity response pattern.

Abstract: In a communication system, communication apparatuses provided with their respective antennas are wiredly connected in serial, and a control apparatus receives a signal based on a radio signal received by one of the communication apparatuses. In the system, one of the communication apparatuses determines whether reception quality of a radio signal received via the antenna thereof satisfies predetermined quality, and transmits, to a second communication apparatus or the control apparatus that is wiredly connected thereto, a signal based on the received radio signal if the reception quality satisfies the predetermined quality, and a signal based on a wired signal received from a first communication apparatus wiredly connected thereto if the reception quality does not satisfy the predetermined quality.

Abstract: A wireless communication device forms a second directivity response pattern having a null value in the direction of a main lobe of a first directivity response pattern, and communicates with a communication partner device by using the first directivity response pattern and the second directivity response pattern.