Patents by Inventor Daiki Funaoka

Daiki Funaoka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240002700
    Abstract: The invention provides a thermal adhesive laminated oriented film containing a substrate layer comprising a resin composition containing 99.9 to 60% by mass of a polyamide resin or a polymethylpentene resin and 0.1 to 40% by mass of a modified polyolefin resin; and a thermal adhesive layer containing a thermal adhesive polyolefin resin and provided on each of both surfaces of the substrate layer so as to be in direct contact therewith by coextrusion. When a machine direction is defined as an X axis, a transverse direction is defined as a Y axis, and a thickness direction is defined as a Z axis, the film is stretched and oriented in at least one direction of the X axis or the Y axis, and has a thermal deformation rate at 150° C. of 4% or less in both directions of the X axis and the Y axis.
    Type: Application
    Filed: November 11, 2021
    Publication date: January 4, 2024
    Applicant: TOYOBO CO., LTD.
    Inventors: Yoshitaka TANAKA, Shigeyuki WATANABE, Nobuhiro YOSHIMURA, Ryo UMEKI, Takafumi MASUDA, Daiki FUNAOKA
  • Publication number: 20230318415
    Abstract: This method for manufacturing a rotor core includes an injection step of injecting a molten resin material into a magnet housing portion of a laminated core heated to a third temperature by a preheating step. The injection step is a step of injecting the resin material into the magnet housing portion while releasing to the outside of the magnet housing portion a volatile organic compound volatilized by heating the resin material by bringing the resin material into contact with the laminated core heated to the third temperature.
    Type: Application
    Filed: March 23, 2021
    Publication date: October 5, 2023
    Applicants: AISIN CORPORATION, TOYOBO MC Corporation
    Inventors: Toshiyuki SABURI, Naotaka HAYASHI, Masahito TANIGAWA, Daiki FUNAOKA, Tomohito OYAMA, Yuichi OZAWA, Ryo UETA, Yusaku SAKURABA
  • Publication number: 20230086148
    Abstract: A rotor core includes a thermosetting resin material disposed in a magnet housing portion to fix a permanent magnet in the magnet housing portion. The resin material has a coefficient of linear expansion that is equal to or less than the coefficient of linear expansion of electromagnetic steel sheets.
    Type: Application
    Filed: March 23, 2021
    Publication date: March 23, 2023
    Applicants: AISIN CORPORATION, TOYOBO CO., LTD.
    Inventors: Yasunari FURUTA, Toshiyuki SABURI, Masahito TANIGAWA, Daiki FUNAOKA, Tomohito OYAMA, Yuichi OZAWA, Ryo UETA, Yusaku SAKURABA
  • Publication number: 20230082542
    Abstract: An object of the present invention is to provide a crystalline radically polymerizable composition for fixing a magnet of a rotating electric machine rotor core, which is excellent in handleability around room temperature, excellent in fluidity from the injection step to the curing step, and excellent in strength of the cured product. A crystalline radical polymerizable composition for fixing a magnet of a rotating electric machine rotor core of the present invention is characterized by fixing the magnet inserted in a magnet accommodating portion provided in a rotor core of a rotating electric machine formed of a laminated steel sheet and the laminated steel sheet, wherein the crystalline radical polymerizable composition contains at least a crystalline radical polymerizable compound A, an inorganic filler B, a silane coupling agent C, and a radical polymerization initiator D, wherein the crystalline radical polymerizable compound A is solid at 23° C.
    Type: Application
    Filed: March 29, 2021
    Publication date: March 16, 2023
    Applicants: Japan U-Pica Company, Ltd., AISIN CORPORATION, TOYOBO CO., LTD.
    Inventors: Tomohito OYAMA, Yuichi OZAWA, Ryo UETA, Yusaku SAKURABA, Motoki KORI, Toshiyuki SABURI, Masahito TANIGAWA, Daiki FUNAOKA
  • Publication number: 20220347991
    Abstract: It is provided that a layered body having excellent absorption speeds of fuel and the like to the filter media. A layered body comprising a first base material and a second base material, wherein the first base material and the second base material are adhered to each other via an adhesive, the first and second base materials each contain a phenol-based resin and an aliphatic hydrocarbon detected during a retention time of 12.0 to 30.0 minutes under pyrolysis-gas chromatography mass spectrometry (PY-GC/MS), and the adhesive contains 65 mol % or more of a butylene terephthalate unit and 5 mol % or more of a butylene isophthalate unit, and has an acid value of not larger than 100 eq/ton, a glass transition temperature of ?10 to 60° C., and a specific gravity of not less than 1.20.
    Type: Application
    Filed: October 12, 2020
    Publication date: November 3, 2022
    Applicant: TOYOBO CO., LTD.
    Inventors: Ryo HAMASAKI, Junki SAITO, Daiki FUNAOKA
  • Patent number: 11014277
    Abstract: An object of the present invention is to provide a technique by which, when producing a resin molded article using an insert member having low pressure resistance, molding can be easily performed, and deformation of the insert member can be suppressed. A method for producing a resin molded article of the present invention, the method includes the steps of disposing an insert member in a cavity of a mold; performing injection of molten resin into the cavity; terminating the injection on and after the molten resin reaches an overflow portion in the cavity and before the molten resin fills the overflow portion; and separating resin in the overflow portion.
    Type: Grant
    Filed: December 25, 2017
    Date of Patent: May 25, 2021
    Assignee: TOYOBO CO., LTD.
    Inventor: Daiki Funaoka
  • Publication number: 20200086538
    Abstract: An object of the present invention is to provide a technique by which, when producing a resin molded article using an insert member having low pressure resistance, molding can be easily performed, and deformation of the insert member can be suppressed. A method for producing a resin molded article of the present invention, the method includes the steps of disposing an insert member in a cavity of a mold; performing injection of molten resin into the cavity; terminating the injection on and after the molten resin reaches an overflow portion in the cavity and before the molten resin fills the overflow portion; and separating resin in the overflow portion.
    Type: Application
    Filed: December 25, 2017
    Publication date: March 19, 2020
    Applicant: TOYOBO CO., LTD.
    Inventor: Daiki FUNAOKA
  • Patent number: 9139729
    Abstract: It is provided that a resin composition for sealing electrical electronic components which is not susceptible to gelation even when stagnant under high temperature conditions, and which are excellent in initial bond strength to an aluminum material, and which exhibits superior durability under a cooling and heating cycle load and the like. It is also provided that a sealed electrical electronic component with the resin composition for sealing electrical electronic components. A resin composition for sealing electrical electronic components, containing a crystalline polyester-based elastomer (A), a phenol-modified xylene resin (B1) and/or a phenol resin (B2), and a polyolefin resin (C), and having a melt viscosity of 5 dPa·s or more and 3000 dPa·s or less when dried to a water content of 0.1% or less, heated to 220° C., subjected to a pressure of 1 MPa, and extruded through a die with a hole diameter of 1.0 mm and a thickness of 10 mm.
    Type: Grant
    Filed: February 21, 2012
    Date of Patent: September 22, 2015
    Assignee: TOYOBO CO., LTD.
    Inventors: Daiki Funaoka, Kenji Shiga
  • Patent number: 9096782
    Abstract: The present invention provides a polyester, a polyester composition and a pressure-sensitive adhesive composition capable of obtaining a pressure-sensitive adhesive which is global-environmentally friendly and is excellent in pressure-sensitive adhesion properties, using a plant-derived raw material; and a pressure-sensitive adhesive layer and a pressure-sensitive adhesive sheet which can be obtained by using the same. A polyester of the present invention is a polyester comprising at least a lactic acid unit, a dibasic acid unit and a glycol unit, wherein the dibasic acid unit contains dimer acid, and the polyester has a glass transition temperature as measured at a temperature rising rate of 20° C./minute using a differential scanning calorimeter, of ?70 to ?20° C., a weight average molecular weight of 20,000 to 300,000 and a hydroxyl value of 1 to 100 mgKOH/g.
    Type: Grant
    Filed: August 5, 2009
    Date of Patent: August 4, 2015
    Assignees: NITTO DENKO CORPORATION, Toyo Boseki Kabushiki Kaisha
    Inventors: Hitoshi Takahira, Satomi Yoshie, Tadashi Nakajima, Daiki Funaoka, Katsuya Shimeno
  • Publication number: 20140221578
    Abstract: It is provided that a resin composition for sealing electrical and electronic parts that can provide a flame-retardant sealed electrical and electronic part having no bleed out of a flame resistor while maintaining filling properties of a sealant in the practical level and adhesion between the sealant and an electrical and electronic part. A resin composition for sealing electrical and electronic parts, comprising a copolymer polyester elastomer (X), a brominated epoxy resin (B1), a non-brominated epoxy resin (B2) and a polyolefin resin (C), and having a melt viscosity of 5 dPa·s or more and 3.0×103 dPa·s or less when dried to a water content of 0.1% or less, heated to 220° C., subjected to a pressure of 1 MPa, and then extruded from a die having a hole diameter of 1.0 mm and a thickness of 10 mm, a sealed electrical and electronic part using the resin composition for sealing electrical and electronic part, and a method for producing the sealed electrical and electronic parts.
    Type: Application
    Filed: August 22, 2012
    Publication date: August 7, 2014
    Inventors: Daiki Funaoka, Kenji Shiga
  • Publication number: 20130331521
    Abstract: It is provided that a resin composition for sealing electrical electronic components which is not susceptible to gelation even when stagnant under high temperature conditions, and which are excellent in initial bond strength to an aluminum material, and which exhibits superior durability under a cooling and heating cycle load and the like. It is also provided that a sealed electrical electronic component with the resin composition for sealing electrical electronic components. A resin composition for sealing electrical electronic components, containing a crystalline polyester-based elastomer (A), a phenol-modified xylene resin (B1) and/or a phenol resin (B2), and a polyolefin resin (C), and having a melt viscosity of 5 dPa·s or more and 3000 dPa·s or less when dried to a water content of 0.1% or less, heated to 220° C., subjected to a pressure of 1 MPa, and extruded through a die with a hole diameter of 1.0 mm and a thickness of 10 mm.
    Type: Application
    Filed: February 21, 2012
    Publication date: December 12, 2013
    Inventors: Daiki Funaoka, Kenji Shiga
  • Publication number: 20110135924
    Abstract: The present invention provides a polyester, a polyester composition and a pressure-sensitive adhesive composition capable of obtaining a pressure-sensitive adhesive which is global-environmentally friendly and is excellent in pressure-sensitive adhesion properties, using a plant-derived raw material; and a pressure-sensitive adhesive layer and a pressure-sensitive adhesive sheet which can be obtained by using the same. A polyester of the present invention is a polyester comprising at least a lactic acid unit, a dibasic acid unit and a glycol unit, wherein the dibasic acid unit contains dimer acid, and the polyester has a glass transition temperature as measured at a temperature rising rate of 20° C./minute using a differential scanning calorimeter, of ?70 to ?20° C., a weight average molecular weight of 20,000 to 300,000 and a hydroxyl value of 1 to 100 mgKOH/g.
    Type: Application
    Filed: August 5, 2009
    Publication date: June 9, 2011
    Applicants: NITTO DENKO CORPORATION, TOYO BOSEKI KABUSHIKI KAISHA
    Inventors: Hitoshi Takahira, Satomi Yoshie, Tadashi Nakajima, Daiki Funaoka, Katsuya Shimeno