Patents by Inventor Daiki FURUNO

Daiki FURUNO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230405764
    Abstract: A method for manufacturing a porous metal bonded grindstone with which it is possible to arbitrarily adjust a porosity from a low porosity to a high porosity is provided. This method is intended for manufacturing the porous metal bonded grindstone and comprises: a molding step (P1) for obtaining an unfired molded body including abrasive grains, metal powder, and a pore forming material; a solute removing step (P2) for bringing vapor of a solvent having solubility with respect to the pore forming material into contact with the unfired molded body to remove the pore forming material and to obtain an unfired molded body having pores; and a firing step (P3) for firing the unfired molded body having pores.
    Type: Application
    Filed: October 14, 2021
    Publication date: December 21, 2023
    Inventors: Masaru YAMAGUCHI, Daiki FURUNO
  • Publication number: 20220048161
    Abstract: A metal bond grindstone grinds a hard and brittle material. The metal bond grindstone includes: a metal bond; abrasive grains bound by the metal bond; and pores having a pore size of 50-200 ?m, such that a porosity in an entirety of the metal bond grindstone is 50-65 vol %. A number of the abrasive grains on a grinding surface excluding the pores may be 700-6500 grains/cm2. The abrasive grains may be diamond abrasive grains, and a grain size of the abrasive grains may be 4-20 ?m in median size. The metal bond grindstone may have a grindstone strength of 40-95 MPa.
    Type: Application
    Filed: January 24, 2020
    Publication date: February 17, 2022
    Applicant: NORITAKE CO., LIMITED
    Inventors: Daiki FURUNO, Ibuki SHINKAI, Masaru YAMAGUCHI