Patents by Inventor Daiki HOSHINO

Daiki HOSHINO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Information processing apparatus and information processing method
    Patent number: 10715433
    Abstract: An information processing apparatus includes a plurality of virtual machines each having a function of sending an address request for communication data to an outside, and sending communication data to a destination address received as a response to the address request. The apparatus further includes a communication debugger that logs first communication data between the virtual machine and another virtual machine. Upon receiving an address request from the virtual machine, the communication debugger sends an address of the communication debugger as the destination address, to the virtual machine, and logs the communication data sent from the virtual machine.
    Type: Grant
    Filed: March 31, 2017
    Date of Patent: July 14, 2020
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Daiki Hoshino, Takuya Miyamaru
  • INFORMATION PROCESSING APPARATUS AND INFORMATION PROCESSING METHOD
    Publication number: 20190363982
    Abstract: An information processing apparatus includes a plurality of virtual machines each having a function of sending an address request for communication data to an outside, and sending communication data to a destination address received as a response to the address request. The apparatus further includes a communication debugger that logs first communication data between the virtual machine and another virtual machine. Upon receiving an address request from the virtual machine, the communication debugger sends an address of the communication debugger as the destination address, to the virtual machine, and logs the communication data sent from the virtual machine.
    Type: Application
    Filed: March 31, 2017
    Publication date: November 28, 2019
    Applicant: Mitsubishi Electric Corporation
    Inventors: Daiki HOSHINO, Takuya MIYAMARU