Abstract: Performance of an electronic device is improved. A substrate for transfer includes a substrate having a surface and made of a visible light transmitting material, and an elastic deformation portion fixed on the surface of the substrate, transmitting visible light, and made of an elastically deformable material. The elastic deformation portion includes a plurality of element holding portions, and a plurality of protrusions arranged at positions not overlapping with the plurality of element holding portions, and protruding higher than the plurality of element holding portions when the surface of the substrate is a reference plane.

Abstract: Disclosed is a manufacturing method of a display device including: transferring at least one inorganic light-emitting diode formed over a base substrate onto a first carrier substrate; arranging a plurality of spacers configured to be elastically deformed over a substrate over which a pixel including a plurality of sub-pixels is arranged; and transforming the at least one inorganic light-emitting diode over the first carrier substrate onto the substrate. The manufacturing method may further include removing the plurality of spacers.

Abstract: A display device includes a substrate, a first electrode and a second electrode on the substrate, and an LED chip disposed on the first electrode and the second electrode and having an n-side pad electrode and a p-side pad electrode. The n-side pad electrode has a first protruding portion, the first protruding portion protruding toward the substrate and in contact with the first electrode, and the p-side pad electrode has a second protruding portion, the second protruding portion protruding toward the substrate and in contact with the second electrode.

Abstract: According to an aspect, a manufacturing method of a display device includes: obtaining a first reference position on a surface of a holding substrate based on positions of a plurality of first alignment marks of the holding substrate; and aligning the holding substrate with a transfer destination substrate such that the first reference position on the holding substrate and a second reference position on a surface of the transfer destination substrate coincide. The holding substrate is sectioned into a plurality of first sections and a plurality of second sections when viewed from one direction. Each of the first sections is provided in a part of a gap between the second sections when viewed from the one direction, has a light transmission rate higher than a light transmission rate of the second sections, and forms the first alignment mark through which light passes when viewed from the one direction.

Abstract: According to one embodiment, a wafer for electronic components, includes a sapphire substrate including a first surface and a second surface on an opposite side to the first surface and a plurality of electronic components located on a side of the first surface, and the sapphire substrate includes trench portions located between respective adjacent electronic components, and the trench portions extend linearly in plan view.

Abstract: According to one embodiment, a method of mounting electronic components, includes placing a workpiece comprising an insulating substrate including a first surface, a circuit board including a terminal portion and a spacer, a sapphire substrate including a second surface and a wafer including the electronic components, bringing the pressure jig into contact with a part of the sapphire substrate to apply a load on a contact part between a part of an upper surface of the spacer and the second surface, pressing the sapphire substrate toward the circuit board with the pressure jig, to bring other part of the upper surface of the spacer into contact with the second surface and flatten the sapphire substrate.

Abstract: An LED module includes a first electrode, a second electrode arranged isolated from the first electrode, a first bump on the first electrode, a second bump on the second electrode, a protrusion between the first electrode and the second electrode, and an LED chip having a first pad electrode and a second pad electrode. The protrusion has insulating properties, the first pad electrode of the LED chip is disposed opposite the first electrode, the second pad electrode is disposed opposite the second electrode, the first pad electrode is connected to the first electrode through the first bump, and the second pad electrode is connected to the second electrode through the second bump.

Abstract: An LED module has a first layer including a first plane, an LED chip arranged on the first plane, a second layer surrounding the LED chip and including a convex part on the first plane, and a third layer arranged outside the LED chip and overlapping an upper surface of the first layer, a side surface of the second layer, and a part of the upper surface of the second layer. In the LED module, a height of the convex part of the second layer is lower than a height of the upper surface of the LED chip, and the first layer, the second layer and the third layer include conductive films.

Abstract: According to one embodiment, a lighting-emitting element includes a light-emitting portion, a first terminal electrode and a second terminal electrode. The first terminal electrode includes a first cavity portion at a position overlapping a first connection electrode in planar view when the first terminal electrode is brought into contact with the first connection electrode. The second terminal electrode includes a second cavity portion at a position overlapping a second connection electrode in planar view when the second terminal electrode is brought into contact with the second connection electrode.

Abstract: An LED module includes a first electrode on an insulating surface, a second electrode adjacent to the first electrode, at least one groove arranged between the first electrode and the second electrode on the insulating surface, and an LED chip disposed over the first electrode and the second electrode. The LED chip is connected to the first electrode and the second electrode through conductive members.