Abstract: A movable device includes: a first movable part; a driver to rotate the first movable part; a second movable part facing the first movable part; and a coupler coupling the first movable part and the second movable part to each other. The coupler includes: a first pillar extending from the first movable part in a first direction; and a second pillar extending from the second movable part in a second direction opposite to the first direction and bonded to the first pillar.

Abstract: A movable device includes a movable portion; a driver connected to the movable portion, the driver to drive the movable portion; a reflector having a reflecting surface to reflect light; a connector connecting the movable portion and the reflector in a connection direction intersecting the reflecting surface; and a reinforcement. The reinforcement has at least one of: an extension portion from the reflector toward the movable portion, or another extension portion from the movable portion toward the reflector.

Abstract: An imaging module includes an imaging chip including a micro-lens guiding incident light and an imaging element in a semiconductor substrate and converting the incident light into an electric signal, and a polarizing glass chip including a polarizing filter glass having a polarizer determining a polarization direction of the incident light arranged on a transparent substrate such that the polarizer faces the micro-lens and a spacer member connected to the polarizing filter glass to adjust a gap between the polarizer and the micro-lens of the imaging chip. In the imaging module, a melt-bonding surface of the spacer member is melt-bonded to the semiconductor substrate such that the polarizer of the polarizing glass chip and the micro-lens of the imaging chip are arranged close to each other via the gap, and the imaging element and the micro-lens of the imaging chip are sealed by the polarizing glass chip.

Abstract: An imaging module includes an imaging chip including a micro-lens guiding incident light and an imaging element in a semiconductor substrate and converting the incident light into an electric signal, and a polarizing glass chip including a polarizing filter glass having a polarizer determining a polarization direction of the incident light arranged on a transparent substrate such that the polarizer faces the micro-lens and a spacer member connected to the polarizing filter glass to adjust a gap between the polarizer and the micro-lens of the imaging chip. In the imaging module, a melt-bonding surface of the spacer member is melt-bonded to the semiconductor substrate such that the polarizer of the polarizing glass chip and the micro-lens of the imaging chip are arranged close to each other via the gap, and the imaging element and the micro-lens of the imaging chip are sealed by the polarizing glass chip.

Abstract: A method of fabricating a plastic molded article is disclosed. In the method, a compound liquid, including two component liquids insoluble in each other and having different dielectric constants, is supplied between two electrodes, and an electric field is applied between the electrodes. At least one of the component liquids is an un-cured curable resin liquid. Upon application of the electric field, the higher dielectric constant component liquid is extended along the direction of the electric field, thus forming a bridge structure linking the electrodes. When the curable resin is cured after the bridge structure is formed, a plastic molded article is obtained.

Abstract: A method of fabricating a plastic molded article is disclosed. In the method, a compound liquid, including two component liquids insoluble in each other and having different dielectric constants, is supplied between two electrodes, and an electric field is applied between the electrodes. At least one of the component liquids is an un-cured curable resin liquid. Upon application of the electric field, the higher dielectric constant component liquid is extended along the direction of the electric field, thus forming a bridge structure linking the electrodes. When the curable resin is cured after the bridge structure is formed, a plastic molded article is obtained.