Abstract: An analysis device includes: a first acquisition unit that acquires data indicating a first time zone in which each product stays in each of a plurality of processes; a second acquisition unit that acquires data indicating a second time zone in which a worker stays in each of the plurality of processes; an analyzer that analyzes a work situation for each product in each of the plurality of processes; and a providing unit that provides an analysis result. The analyzer determines, on the basis of a relationship between the first time zone and the second time zone in a period for analysis of a process for analysis, whether or not a factor that decreases work efficiency has occurred in the period for analysis of the process for analysis.

Abstract: The present invention provides a thermal head having a long lifetime and a high printing quality by making the size of steps of a protective layer formed on a heating portion of a heating resistor small and a method for manufacturing the thermal heads. In the thermal head, respective lower-layer electrodes having a film thickness of approximately 2 &mgr;m are formed on outskirts portion of a bulging portion of a heat insulation layer excluding a heating portion of a heating resistor and portions in the vicinity of the heating portion. Then, respective upper-layer electrodes having a film thickness which falls in a range of 0.1 to 0.3 &mgr;m are continuously formed from portions at positions in the vicinity of the heating portion excluding the heating portion to upper surfaces of the lower-layer electrodes.

Abstract: The present invention provides a thermal head having a long lifetime and a high printing quality by making the size of steps of a protective layer formed on a heating portion of a heating resistor small and a method for manufacturing the thermal heads. In the thermal head, respective lower-layer electrodes having a film thickness of approximately 2 &mgr;m are formed on outskirts portion of a bulging portion of a heat insulation layer excluding a heating portion of a heating resistor and portions in the vicinity of the heating portion. Then, respective upper-layer electrodes having a film thickness which falls in a range of 0.1 to 0.3 &mgr;m are continuously formed from portions at positions in the vicinity of the heating portion excluding the heating portion to upper surfaces of the lower-layer electrodes.