Patents by Inventor Daiki Suzuki

Daiki Suzuki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210403320
    Abstract: A method of manufacturing a semiconductor substrate according to an embodiment includes a first step of forming a groove having a bottom surface and a side surface on which scallops are formed by performing a process including isotropic etching on a main surface of a substrate, a second step of performing at least one of a hydrophilic treatment on the side surface of the groove and a degassing treatment on the groove, and a third step of removing the scallops formed on the side surface of the groove and planarizing the side surface by performing anisotropic wet etching in a state where the bottom surface of the recess is present.
    Type: Application
    Filed: October 30, 2019
    Publication date: December 30, 2021
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Nao INOUE, Jo ITO, Go TANAKA, Atsuya IIMA, Daiki SUZUKI, Katsumi SHIBAYAMA
  • Publication number: 20210402491
    Abstract: Provided is a hole drilling machine and the method for drilling an oval hole and an inner-diameter-changing hole by means of the hole drilling machine, the machine and the method being configured so that the oval hole can be shaped with high accuracy and drilling of a complicated hole such as the inner-diameter-changing hole can be performed with high accuracy. A hole drilling machine 100 includes a spindle 101 and an auxiliary spindle 120 holding both end portions of a processing tool 102 having a cutting blade 103. The spindle 101 includes a spindle drive motor 106 configured to rotatably displace the processing tool 102 on a circular path, and a tool turnable-drive motor 105 configured to spin the processing tool 102. The auxiliary spindle 120 includes an auxiliary spindle drive motor 120b.
    Type: Application
    Filed: September 8, 2021
    Publication date: December 30, 2021
    Inventors: Munehiro MURAKAMI, Toshio SUZUKI, Taketo NAKAMURA, Kazushige MOROZUMI, Tatsunori SATO, Yuya MASUDA, Daiki ISHIZUKA
  • Publication number: 20210387852
    Abstract: The damascene wiring structure includes a base including a main surface provided with a groove, an insulating layer including a first portion provided on an inner surface of the groove and a second portion provided on the main surface, a metal layer provided on the first portion, a wiring portion embedded in the groove, and a cap layer provided to cover the second portion, an end portion of the metal layer, and the wiring portion. A surface of a boundary part between the first portion and the second portion includes an inclined surface inclined with respect to a direction perpendicular to the main surface. The end portion of the metal layer enters between the cap layer and the inclined surface, and in the end portion, a first surface along the cap layer and a second surface along the inclined surface form an acute angle.
    Type: Application
    Filed: October 30, 2019
    Publication date: December 16, 2021
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Daiki SUZUKI, Nao INOUE, Katsumi SHIBAYAMA
  • Patent number: 11199695
    Abstract: An actuator device includes: a support portion; a movable portion; a first connection portion connecting the movable portion to the support portion on a first axis so that the movable portion is swingable around the first axis; and a first wiring provided on the first connection portion. The first wiring includes a first main body formed of a metal material having a Vickers hardness of 50 HV or more. The first main body includes a first surface facing the first connection portion and a second surface other than the first surface. The second surface has a shape in which a curvature is continuous over the entire second surface in a cross-section perpendicular to an extension direction of the first wiring.
    Type: Grant
    Filed: June 18, 2018
    Date of Patent: December 14, 2021
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventors: Daiki Suzuki, Yuki Morinaga, Go Tanaka
  • Publication number: 20210327616
    Abstract: A chip varistor includes an element body exhibiting varistor characteristics, internal electrodes containing a first electrically conductive material, and an intermediate conductor containing a second electrically conductive material. The intermediate conductor is separated from the internal electrodes in a direction in which the internal electrodes oppose each other, and is disposed between the internal electrodes. At least a part of the intermediate conductor overlaps the internal electrodes in the direction in which the internal electrodes oppose each other. The element body includes a low resistance region in which the second electrically conductive material is diffused. The low resistance region is located between the first and second internal electrodes in the direction in which the first and second internal electrodes oppose each other.
    Type: Application
    Filed: April 14, 2021
    Publication date: October 21, 2021
    Applicant: TDK CORPORATION
    Inventors: Satoshi GOTO, Naoyoshi YOSHIDA, Takeshi YANATA, Takeshi OYANAGI, Daiki SUZUKI, Shin KAGAYA, Masayuki UCHIDA, Yusuke IMAI
  • Publication number: 20210309509
    Abstract: An actuator device includes a support portion; a first movable portion; a second movable portion; a first connection portion that connects the first and second movable portions such that the first movable portion is swingable around a first axis; a second connection portion that connects the second movable portion and the support portion such that the first movable portion is swingable around the first axis. Two natural angular frequencies ?1 and ?2 (where ?1<?2) for vibration of the first and second movable portions around the first axis satisfy one of the following equation (1) and equation (2) and do not satisfy the other, [ Equation ? ? 1 ] 0 < 1 - ( ? 1 ? ii ) 2 ? 0.2 ( 1 ) [ Equation ? ? 2 ] 0 < ( ? 2 ? ii ) 2 - 1 ? 0.
    Type: Application
    Filed: August 9, 2019
    Publication date: October 7, 2021
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventor: Daiki SUZUKI
  • Publication number: 20210191106
    Abstract: A method for manufacturing an optical device includes: preparing a semiconductor substrate that includes a portion corresponding to a base, a movable unit, and an elastic support portion; forming a first resist layer in a region corresponding to the base on a surface of a first semiconductor layer which is opposite to an insulating layer; forming a depression in the first semiconductor layer by etching the first semiconductor layer using the first resist layer as a mask; forming a second resist layer in a region corresponding to a rib portion on a bottom surface of the depression, a side surface of the depression, and the surface of the first semiconductor layer which is opposite to the insulating layer; and forming the rib portion by etching the first semiconductor layer until reaching the insulating layer using the second resist layer as a mask.
    Type: Application
    Filed: August 2, 2018
    Publication date: June 24, 2021
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Tatsuya SUGIMOTO, Tomofumi SUZUKI, Kyosuke KOTANI, Yutaka KURAMOTO, Daiki SUZUKI
  • Publication number: 20210032095
    Abstract: An actuator device includes a support part, a first movable part, and a second movable part. The second movable part includes a pair of first connection portions positioned on both sides of the first movable part on a first axis and connected to a pair of first connecting parts, and a pair of second connection portions positioned on both sides of the first movable part on a second axis and connected to a pair of second connecting parts. Each of the second connection portions includes a portion having a width larger than a width of a portion of the second movable part other than the first and second connection portions. An inner edge of each of the second connection portions, includes a depression recessed in a second axis direction, and an outer edge of each of the pair of second connection portions, includes a protrusion protruding in the second axis direction.
    Type: Application
    Filed: November 26, 2018
    Publication date: February 4, 2021
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Daiki SUZUKI, Takuma OSAKI, Naoto SAKURAI
  • Publication number: 20210036592
    Abstract: An actuator device includes a support part, a first movable part, a second movable part, a first connecting part connecting the first movable part to the second movable part, a second connecting part connecting the second movable part to the support part, a spiral coil provided to the second movable part a first external terminal provided to the support part, and a first wiring connected to an inner end portion of the coil and the first external terminal. The first wiring includes a lead wiring connected to the first external terminal, and a straddle wiring provided to the second movable part so as to straddle the coil and connected to the inner end of the coil and the lead wiring. The width of the straddle wiring is larger than the width of the coil, and the thickness of the straddle wiring is smaller than the thickness of the coil.
    Type: Application
    Filed: November 26, 2018
    Publication date: February 4, 2021
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Daiki SUZUKI, Takuma OSAKI, Yasuyuki SAKAKIBARA
  • Publication number: 20210033848
    Abstract: An optical device includes a support portion, a first movable portion having an optical surface, a second movable portion having a frame shape and surrounding the first movable portion, a first coupling portion coupling the first movable portion and the second movable portion to each other, a second coupling portion coupling the second movable portion and the support portion to each other, and a softening member which has a softening characteristic and to which stress is applied when the first movable portion swings around a first axis. When viewed in a direction perpendicular to the optical surface, the softening member is provided to a portion of the second movable portion, the portion extending between a drive element and the first coupling portion, and is not electrically connected to an outside.
    Type: Application
    Filed: May 10, 2019
    Publication date: February 4, 2021
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Daiki SUZUKI, Takuma OSAKI
  • Publication number: 20200278533
    Abstract: A mirror unit includes an optical scanning device, a frame member, and a window member. The frame member includes first and second wall portions facing each other in an X-axis direction. The first wall portion is higher than the second wall portion. The window member is disposed on a top surface of the first wall portion and a top surface of the second wall portion and is inclined with respect to a mirror surface of the optical scanning device. In a cross-section parallel to the X-axis direction, the first wall portion is separated from a first line passing through a first end at a side of the first wall portion in the mirror surface and a first corner portion formed at the side of the first wall portion by an outer surface opposite to the frame member and a first side surface in the window member.
    Type: Application
    Filed: January 29, 2020
    Publication date: September 3, 2020
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Daiki SUZUKI, Tomoyuki IDE, Yuki MORINAGA
  • Patent number: 10759655
    Abstract: An actuator device includes a support portion, a movable portion, a connection portion which connects the movable portion to the support portion on a second axis so that the movable portion is swingable about the second axis, a first wiring which is provided on the connection portion, and a second wiring which is provided on the support portion. The rigidity of a first metal material forming the first wiring is higher than that of a second metal material forming the second wiring. The second wiring is connected to a surface opposite to the support portion in a first connection part located on the support portion in the first connection part.
    Type: Grant
    Filed: December 22, 2016
    Date of Patent: September 1, 2020
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventors: Sadaharu Takimoto, Yuki Morinaga, Daiki Suzuki, Yoshihisa Warashina
  • Patent number: D892890
    Type: Grant
    Filed: October 31, 2018
    Date of Patent: August 11, 2020
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventor: Daiki Suzuki
  • Patent number: D893574
    Type: Grant
    Filed: October 31, 2018
    Date of Patent: August 18, 2020
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventor: Daiki Suzuki
  • Patent number: D903614
    Type: Grant
    Filed: October 31, 2018
    Date of Patent: December 1, 2020
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventor: Daiki Suzuki
  • Patent number: D907085
    Type: Grant
    Filed: October 31, 2018
    Date of Patent: January 5, 2021
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventor: Daiki Suzuki
  • Patent number: D912715
    Type: Grant
    Filed: October 31, 2018
    Date of Patent: March 9, 2021
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventor: Daiki Suzuki
  • Patent number: D934325
    Type: Grant
    Filed: June 30, 2020
    Date of Patent: October 26, 2021
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventor: Daiki Suzuki
  • Patent number: D934326
    Type: Grant
    Filed: June 30, 2020
    Date of Patent: October 26, 2021
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventor: Daiki Suzuki
  • Patent number: D934936
    Type: Grant
    Filed: October 6, 2020
    Date of Patent: November 2, 2021
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventor: Daiki Suzuki