Patents by Inventor Daiki Tomita

Daiki Tomita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11970017
    Abstract: A badge has a print layer and a substrate that is a processed layer. The print layer is printed with a subject image in which a radial center point is defined as a center point of a radial representation. The substrate has a circular brushed surface that is subjected to circular processing. At least one of the print layer and the substrate is light transmissive. The print layer is laminated on the circular brushed surface side of the substrate such that the radial center point of the subject image and a circular processing center point that is a center point of the circular processing coincide with each other.
    Type: Grant
    Filed: May 19, 2023
    Date of Patent: April 30, 2024
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Masami Ikuma, Simon Humphries, Hiroshi Tomita, Daiki Isogai
  • Publication number: 20240117229
    Abstract: Provided is a two-pack curable adhesive less likely to cause an appearance defect due to air bubbles or the dissolution of a printing layer. A two-pack curable adhesive, containing: a polyisocyanate composition (A) containing a urethane prepolymer (A1), which is a reaction product of polyester polyol (a1), polyether polyol (a2), and a polyisocyanate compound (a3); and a polyol composition (B) containing polyester polyol (B1), in which polyhydric alcohol (a1-2) used in the synthesis of the polyester polyol (a1) and polyhydric alcohol (b1-2) used in the synthesis of the polyester polyol (B1) contain 80% by mass or more of diethylene glycol, respectively, and the compound amount of the polyester polyol (a1) is 50% by mass or more and 90% by mass or less with respect to the total amount of the polyester polyol (a1) and the polyether polyol (a2).
    Type: Application
    Filed: January 27, 2022
    Publication date: April 11, 2024
    Applicant: DIC Corporation
    Inventors: Daiki Tomita, Miho Takeda, Takeshi Kuroi, Toshihiro Karimata
  • Publication number: 20240080595
    Abstract: A sound reproduction device is configured to store a head of a user and reproduce sound. The sound reproduction device includes: a headrest portion; a partition portion attached to the headrest portion so as to protrude forward relative to a front surface of the headrest portion; a speaker disposed in the partition portion; and a sound absorbing structure provided in at least a part of the inner surface of the partition portion excluding a region corresponding to an output surface of the speaker.
    Type: Application
    Filed: May 9, 2023
    Publication date: March 7, 2024
    Inventors: Ryota MIYANAKA, Hiroyuki KANO, Kota NAKAHASHI, Daiki CHO, Yuki ODORIBA, Kaname TOMITA
  • Patent number: 11739242
    Abstract: Provided are a solvent-free two-component type adhesive capable of guaranteeing a practical packaging property, with an excellent curing property and significantly shortening aging time, a laminated film using the same, and a polyol composition for an adhesive. An adhesive, characterized in comprising a polyisocyanate composition (X) containing a polyisocyanate (A), and a polyol composition (Y) containing a polyol (C) and a tertiary amine compound (B) having multiple hydroxyl groups, as necessary components.
    Type: Grant
    Filed: October 27, 2021
    Date of Patent: August 29, 2023
    Assignee: DIC Corporation
    Inventors: Makoto Nakamura, Daiki Tomita, Shigekazu Takahashi, Bingbing Liu, Feng Zhao, Zhiqiang Liu
  • Publication number: 20230212444
    Abstract: Provided are a two-component curable adhesive which can be aged at room temperature and has favorable adhesiveness to various base materials, a laminate in which the adhesiveness between a base material and an adhesive is excellent even when aged at room temperature, and a packaging material including the laminate. The two-component curable adhesive includes a polyisocyanate composition (X) including a polyisocyanate compound (A) and a polyol composition (Y) including a polyol (B), in which a viscosity of the polyol composition at 50° C. is 20 mPa·s or more and 180 mPa·s or less.
    Type: Application
    Filed: June 3, 2021
    Publication date: July 6, 2023
    Applicant: DIC Corporation
    Inventors: Daiki Tomita, Takao Honma, Koji Akita
  • Publication number: 20220049140
    Abstract: Provided are a solvent-free two-component type adhesive capable of guaranteeing a practical packaging property, with an excellent curing property and significantly shortening aging time, a laminated film using the same, and a polyol composition for an adhesive. An adhesive, characterized in comprising a polyisocyanate composition (X) containing a polyisocyanate (A), and a polyol composition (Y) containing a polyol (C) and a tertiary amine compound (B) having multiple hydroxyl groups, as necessary components.
    Type: Application
    Filed: October 27, 2021
    Publication date: February 17, 2022
    Applicant: DIC Corporation
    Inventors: Makoto Nakamura, Daiki Tomita, Shigekazu Takahashi, Bingbing Liu, Feng Zhao, Zhiqiang Liu
  • Patent number: 11180685
    Abstract: Provided are a solvent-free two-component type adhesive capable of guaranteeing a practical packaging property, with an excellent curing property and significantly shortening aging time, a laminated film using the same, and a polyol composition for an adhesive. An adhesive, characterized in comprising a polyisocyanate composition (X) containing a polyisocyanate (A), and a polyol composition (Y) containing a polyol (C) and a tertiary amine compound (B) having multiple hydroxyl groups, as necessary components.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: November 23, 2021
    Assignee: DIC Corporation
    Inventors: Makoto Nakamura, Daiki Tomita, Shigekazu Takahashi, Bingbing Liu, Feng Zhao, Zhiqiang Liu
  • Publication number: 20210332275
    Abstract: Provided is a solventless two-component adhesive having excellent processed appearance and processability while exhibiting excellent adhesive strength even with aging at room temperature (around 25° C.) and in a short period of 12 hours. Provided are a two-component curable adhesive containing a polyisocyanate composition (X) containing a polyisocyanate (A) and a resin composition (Y) containing a polyol (B) as essential components, the two-component curable adhesive satisfying (1) to (3), as well as a laminated film and a packaging body produced using the two-component curable adhesive: (1) a tensile shear adhesive strength (N1) when provided between two bases and after a lapse of 30 minutes after pressure bonding is 0.
    Type: Application
    Filed: December 19, 2019
    Publication date: October 28, 2021
    Applicant: DIC Corporation
    Inventors: Daiki Tomita, Takao Honma, Shigekazu Takahashi
  • Publication number: 20210002530
    Abstract: Provided are an adhesive including a polyisocyanate composition (X) containing a polyisocyanate (A), and a polyol composition (Y) containing a tertiary amine compound (B) having plural hydroxyl groups, a polyol (C), and an aliphatic cyclic amide compound (D), as essential components, a laminated film using the adhesive, and a method for producing a laminated film including a step of separately applying two components, which includes bringing a polyisocyanate composition (X) containing a polyisocyanate (A) that is applied onto one base material into contact with a polyol composition (Y) containing a tertiary amine compound (B) having plural hydroxyl groups, a polyol (C), and an aliphatic cyclic amide compound (D) that is applied onto the other base material, and performing pressure-bonding.
    Type: Application
    Filed: March 19, 2019
    Publication date: January 7, 2021
    Applicant: DIC Corporation
    Inventors: Tomoo Okubo, Shigekazu Takahashi, Daiki Tomita
  • Publication number: 20190284457
    Abstract: Provided are a solvent-free two-component type adhesive capable of guaranteeing a practical packaging property, with an excellent curing property and significantly shortening aging time, a laminated film using the same, and a polyol composition for an adhesive. An adhesive, characterized in comprising a polyisocyanate composition (X) containing a polyisocyanate (A), and a polyol composition (Y) containing a polyol (C) and a tertiary amine compound (B) having multiple hydroxyl groups, as necessary components.
    Type: Application
    Filed: September 29, 2017
    Publication date: September 19, 2019
    Inventors: Makoto Nakamura, Daiki Tomita, Shigekazu Takahashi, Bingbing Liu, Feng Zhao, Zhiqiang Liu
  • Patent number: 8889830
    Abstract: A novel hemoglobin-albumin complex which has high stability of the oxygenated form, has high biocompatibility, and is easily prepared (synthesized), and an artificial plasma expander and an artificial oxygen carrier containing the complex are provided. The hemoglobin-albumin complex of the invention is characterized by having hemoglobin as the core, and albumin as the shell bound via a crosslinker to the above hemoglobin. Also, the artificial oxygen carrier of the invention is characterized by containing the hemoglobin-albumin complex of the invention.
    Type: Grant
    Filed: February 20, 2012
    Date of Patent: November 18, 2014
    Assignee: Chuo University
    Inventors: Teruyuki Komatsu, Daiki Tomita
  • Publication number: 20130338342
    Abstract: A novel hemoglobin-albumin complex which has high stability of the oxygenated form, has high biocompatibility, and is easily prepared (synthesized), and an artificial plasma expander and an artificial oxygen carrier containing the complex are provided. The hemoglobin-albumin complex of the invention is characterized by having hemoglobin as the core, and albumin as the shell bound via a crosslinker to the above hemoglobin. Also, the artificial oxygen carrier of the invention is characterized by containing the hemoglobin-albumin complex of the invention.
    Type: Application
    Filed: February 20, 2012
    Publication date: December 19, 2013
    Applicant: CHUO UNIVERSITY
    Inventors: Teruyuki Komatsu, Daiki Tomita