Patents by Inventor Daiki Tomiya

Daiki Tomiya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sealant film, laminate film, and packaging material
    Patent number: 11752747
    Abstract: A sealant film is provided in which a surface resin layer (A), an adhesive resin layer (B), a release resin layer (C), and a heat seal resin layer (D) are laminated. The adhesive resin layer (B) contains a thermoplastic elastomer (b1) and a tackifier resin (b2). The release resin layer (C) contains 40% by mass or more of an ethylene ionomer (c1) with a polar group concentration exceeding 5.5 mol % in a resin component contained in the release resin layer (C). The release resin layer (C) further contains 0 to 60% by mass of an ethylene ionomer (c2) with a polar group concentration of 5.5 mol % or less in the resin component contained in the release resin layer (C). The heat seal resin layer (D) contains an ethylene resin (d1).
    Type: Grant
    Filed: December 20, 2022
    Date of Patent: September 12, 2023
    Assignee: DIC CORPORATION
    Inventors: Daiki Tomiya, Yuki Kaburagi, Takashi Moriya
  • SEALANT FILM, LAMINATE FILM, AND PACKAGING MATERIAL
    Publication number: 20230234346
    Abstract: A sealant film is provided in which a surface resin layer (A), an adhesive resin layer (B), a release resin layer (C), and a heat seal resin layer (D) are laminated. The adhesive resin layer (B) contains a thermoplastic elastomer (b1) and a tackifier resin (b2). The release resin layer (C) contains 40% by mass or more of an ethylene ionomer (c1) with a polar group concentration exceeding 5.5 mol % in a resin component contained in the release resin layer (C). The release resin layer (C) further contains 0 to 60% by mass of an ethylene ionomer (c2) with a polar group concentration of 5.5 mol % or less in the resin component contained in the release resin layer (C). The heat seal resin layer (D) contains an ethylene resin (d1).
    Type: Application
    Filed: December 20, 2022
    Publication date: July 27, 2023
    Applicant: DIC Corporation
    Inventors: Daiki Tomiya, Yuki Kaburagi, Takashi Moriya