Abstract: An information processing apparatus includes: a factual attribute determining unit that determines a factual attribute that can be confirmed to be a fact with respect to a user based on user-provided data having been provided by the user oneself or history data of the user; an inferred attribute determining unit which determines an inferred attribute having been inferred with respect to the user based on user-related data including at least the factual attribute related to the user; and a credit score inferring unit that infers a credit score to be set to the user based on an attribute data group including the factual attribute and the inferred attribute related to the user.

Abstract: A server includes a communication interface and a controller. The controller receives a reservation request for a vehicle from a first user via the communication interface, determines an importance level of the reservation request, and generates first reservation information for a vehicle to be used by the first user, the first reservation information including the importance level. In a case in which there is no vehicle to assign to the first reservation information, the controller compares the importance level of the reservation request with importance levels of other reservation information that already exists, and assigns, to the first reservation information, a vehicle that has been assigned to second reservation information which is from among the other reservation information and includes an importance level lower than the importance level of the reservation request.

Abstract: One aspect of this copper alloy for an electronic and electrical equipment contains: more than 2.0 mass % to 36.5 mass % of Zn; 0.10 mass % to 0.90 mass % of Sn; 0.15 mass % to less than 1.00 mass % of Ni; and 0.005 mass % to 0.100 mass % of P, with the balance containing Cu and inevitable impurities, wherein atomic ratios of amounts of elements satisfy 3.00<Ni/P<100.00 and 0.10<Sn/Ni<2.90, and a strength ratio TSTD/TSLD of tensile strength TSTD in a direction perpendicular to a rolling direction to tensile strength TSLD in a direction parallel to the rolling direction exceeds 1.09.

Abstract: The present invention relates to a copper alloy for electric and electronic device, a copper alloy sheet for electric and electronic device, a conductive component for electric and electronic device, and a terminal. The copper alloy for electric and electronic device includes more than 2.0 mass % to 15.0 mass % of Zn; 0.10 mass % to 0.90 mass % of Sn; 0.05 mass % to less than 1.00 mass % of Ni; 0.001 mass % to less than 0.100 mass % of Fe; 0.005 mass % to 0.100 mass % of P; and a remainder comprising Cu and unavoidable impurities, in which 0.002?Fe/Ni<1.500, 3.0<(Ni+Fe)/P<100.0, and 0.10<Sn/(Ni+Fe)<5.00 were satisfied by atomic ratio, and a yield ratio YS/TS is more than 90% which is calculated from a strength TS and a 0.2% yield strength YS when a tensile test is performed in a direction parallel to a rolling direction.

Abstract: One aspect of this copper alloy for an electronic and electrical equipment contains: more than 2.0 mass % to 36.5 mass % of Zn; 0.10 mass % to 0.90 mass % of Sn; 0.15 mass % to less than 1.00 mass % of Ni; and 0.005 mass % to 0.100 mass % of P, with the balance containing Cu and inevitable impurities, wherein atomic ratios of amounts of elements satisfy 3.00<Ni/P<100.00 and 0.10<Sn/Ni<2.90, and a strength ratio TSTD/TSLD of tensile strength TSTD in a direction perpendicular to a rolling direction to tensile strength TSLD in a direction parallel to the rolling direction exceeds 1.09.

Abstract: A copper alloy for electric and electronic devices comprises 23 mass % to 36.5 mass % of Zn; 0.1 mass % to 0.9 mass % of Sn; 0.15 mass % to less than 1.0 mass % of Ni; 0.001 mass % to less than 0.10 mass % of Fe; 0.005 mass % to 0.1 mass % of P; and a balance including Cu and unavoidable impurities, in which 0.002?Fe/Ni<0.7, 3<(Ni+Fe)/P<15, and 0.3<Sn/(Ni+Fe)<2.9, are satisfied by atomic ratio, and a fraction R{220} of the X-ray diffraction intensity from the {220} plane is 0.8 or less.

Abstract: A copper alloy for electric and electronic devices includes: Zn at 23 mass % or more and at 36.5 mass % or less; Sn at 0.1 mass % or more and 0.9 mass % or less; Ni at 0.15 mass % or more and less than 1.0 mass %; Fe at 0.001 mass % or more and less than 0.10 mass %; Co at 0.001 mass % or more and less than 0.1 mass %; P at 0.005 mass % or more and 0.1 mass % or less; and a balance including Cu and unavoidable impurities, wherein a ratio Fe/Ni satisfies 0.002?Fe/Ni<0.7 by atomic ratio, a ratio (Ni+Fe)/P satisfies 3<(Ni+Fe)/P<15 by atomic ratio, a ratio Sn/(Ni+Fe) satisfies 0.3<Sn/(Ni+Fe)<2.9, and a special grain boundary length ratio, L?/L, is 10% or more, L?/L, L? being a sum of each grain boundary length of: ?3; ?9; ?27a; and ?27b special grain boundaries.

Abstract: A copper alloy for an electric and electronic device comprises more than 2 mass % and less than 23 mass % of Zn; 0.1 mass % to 0.9 mass % of Sn; 0.05 mass % to less than 1.0 mass % of Ni; 0.001 mass % to less than 0.10 mass % of Fe; 0.005 mass % to 0.1 mass % of P; and a balance including Cu and unavoidable impurities, in which 0.002?Fe/Ni<1.5, 3<(Ni+Fe)/P<15, and 0.3<Sn/(Ni+Fe)<5, are satisfied by atomic ratio, and a fraction R{220} of the X-ray diffraction intensity from the {220} plane is 0.8 or less.

Abstract: One aspect of this copper alloy for an electronic and electrical equipment contains: more than 2.0 mass % to 36.5 mass % of Zn; 0.10 mass % to 0.90 mass % of Sn; 0.15 mass % to less than 1.00 mass % of Ni; and 0.005 mass % to 0.100 mass % of P, with the balance containing Cu and inevitable impurities, wherein atomic ratios of amounts of elements satisfy 3.0<Ni/P<100.0 and 0.10<Sn/Ni<2.90, and Vickers hardness of a surface of an ? phase containing Cu, Zn, and Sn is 100 or more.

Abstract: A copper alloy for electric and electronic devices includes: Zn from more than 2 mass % to less than 23 mass %; Sn at 0.1 mass % or more and 0.9 mass % or less; Ni at 0.05 mass % or more and less than 1.0 mass %; Fe at 0.001 mass % or more and less than 0.10 mass %; P at 0.005 mass % or more and 0.1 mass % or less; and a balance including Cu and unavoidable impurities, wherein a ratio Fe/Ni satisfies 0.002?Fe/Ni<1.5 by atomic ratio, a ratio (Ni+Fe)/P satisfies 3<(Ni+Fe)/P<15 by atomic ratio, a ratio Sn/(Ni+Fe) satisfies 0.3<Sn/(Ni+Fe)<5, and a special grain boundary length ratio, L?/L, is 10% or more, L? being a sum of each grain boundary length of: ?3; ?9; ?27a; and ?27b special grain boundaries.

Abstract: To provide a pellicle having a an adhesive, wherein adhesive residue is decreased at the time of peeling the pellicle from a mask after lithographic exposure and outgassing from the adhesive is suppressed The pellicle according to the present invention is a pellicle comprising a pellicle frame, a tensioned pellicle film placed on one end surface of the pellicle frame and an adhesive applied to the other end surface thereof, in which the adhesive contains a (meth)acrylic alkyl ester copolymer and a silane compound, and the (meth)acrylic alkyl ester copolymer is a copolymer of a (meth)acrylic alkyl ester having an alkyl group of 4 to 14 carbon atoms and a monomer having a functional group reactive to at least either one of an isocyanate group or an epoxy group.

Abstract: A copper alloy for an electric and electronic device includes more than 2.0 mass % to 36.5 mass % of Zn, 0.1 mass % to 0.9 mass % of Sn, 0.05 mass % to less than 1.0 mass % of Ni, 0.5 mass ppm to less than 10 mass ppm of Fe, 0.001 mass % to less than 0.10 mass % of Co, 0.001 mass % to 0.10 mass % of P, and a balance including Cu and unavoidable impurities, in which, ratios between the amounts of the respective elements satisfy 0.002?Fe/Ni<1.5, 3<(Ni+Fe)/P<15, and 0.3<Sn/(Ni+Fe)<5 by atomic ratio, and the copper alloy includes a precipitate containing P and at least one element selected from the group consisting of Fe, Co and Ni.

Abstract: The present invention relates to a copper alloy for electric and electronic device, a copper alloy sheet for electric and electronic device, a conductive component for electric and electronic device, and a terminal. The copper alloy for electric and electronic device comprises more than 2.0 mass % and less than 23.0 mass % of Zn; 0.10 mass % to 0.90 mass % of Sn; 0.05 mass % to less than 1.00 mass % of Ni; 0.001 mass % to less than 0.100 mass % of Fe; 0.005 mass % to 0.100 mass % of P; and a balance including Cu and unavoidable impurities, in which 0.002?Fe/Ni<1.500, 3.0<(Ni+Fe)/P<100.0, and 0.10<Sn/(Ni+Fe)<5.0, are satisfied by atomic ratio, the H content is 10 mass ppm or less, the O content is 100 mass ppm or less, the S content is 50 mass ppm or less, and the C content is 10 mass ppm or less.

Abstract: The present invention relates to a copper alloy for electric and electronic device, a copper alloy sheet for electric and electronic device, a conductive component for electric and electronic device, and a terminal. The copper alloy for electric and electronic device includes more than 2.0 mass % to 15.0 mass % of Zn; 0.10 mass % to 0.90 mass % of Sn; 0.05 mass % to less than 1.00 mass % of Ni; 0.001 mass % to less than 0.100 mass % of Fe; 0.005 mass % to 0.100 mass % of P; and a remainder comprising Cu and unavoidable impurities, in which 0.002?Fe/Ni<1.500, 3.0<(Ni+Fe)/P<100.0, and 0.10<Sn/(Ni+Fe)<5.00 were satisfied by atomic ratio, and a yield ratio YS/TS is more than 90% which is calculated from a strength TS and a 0.2% yield strength YS when a tensile test is performed in a direction parallel to a rolling direction.

Abstract: A copper alloy for an electric and electronic devices comprises 23 mass % to 36.5 mass % of Zn; 0.1 mass % to 0.9 mass % of Sn; 0.15 mass % to less than 1.0 mass % of Ni; 0.001 mass % to less than 0.10 mass % of Fe; 0.005 mass % to 0.1 mass % of P; and a balance including Cu and unavoidable impurities, in which 0.002?Fe/Ni<0.7, 3<(Ni+Fe)/P<15, and 0.3<Sn/(Ni+Fe)<2.9, are satisfied by atomic ratio, and a fraction R{220} of the X-ray diffraction intensity from the {220} plane is 0.8 or less.

Abstract: An electrophotographic toner including: a binder resin, wherein the binder resin has one glass transition temperature Tg and the glass transition temperature Tg of the binder resin is within 25° C. to 65° C. as measured in second heating with a differential scanning calorimeter at a heating rate of 5° C./min, and wherein a phase image of the binder resin obtained with an atomic force microscope (AFM) of tapping mode contains first phase difference regions and a second phase difference region such that the first phase difference regions are dispersed in the second phase difference region, where the first phase difference regions correspond to greater phase difference regions and the second phase difference region corresponds to a smaller phase difference region when an intermediate value between a maximum value and a minimum value of the phase differences is used as a threshold.

Abstract: A resin for use in toner is provided. The resin comprises an oligomer segment and a soft segment. The oligomer segment comprises a polyhydroxycarboxylic skeleton and an aromatic diol skeleton.

Abstract: A resin for toner contains a polyhydroxycarboxylic acid skeleton and a rigid skeleton.

Abstract: A recording medium including a first base; a second base; and an image recording layer provided between the first base and the second base, wherein the image recording layer contains electrophoretic particles, a dispersion medium, and a thermoreversible gelling agent, and wherein at least one type of the electrophoretic particles is electret particles is provided.

Abstract: A recording medium includes a first substrate, a second substrate, and an image recording layer with insulating properties provided between the first substrate and the second substrate, the image recording layer containing cells each encapsulating at least one of electrophoretic particles or magnetophoretic particles, a dispersion medium, and at least two kinds of thermoreversible gelling agents.