Abstract: A method for the production of a printed wiring board according to this invention includes applying a preflux represented by the following general formula (1): ##STR1## (wherein R.sub.1 stands of H or an alkyl group of one to 17 carbon atoms, R.sub.2 for H or an alkyl group of one to six carbon atoms, and n for an integer in the range between 0 and 3) or the following general formula (2): ##STR2## (wherein R.sub.3 stands for H or an alkyl group of one to six carbon atoms, R.sub.4 for H or an alkyl group of one to six carbon atoms, R.sub.5 for an alkyl group of zero to seven carbon atoms, and n for an integer in the range between 0 and 3) to a printed wiring board on which circuits have been formed and then performing an oxidizing treatment on the printed wiring board.

Abstract: A printed wiring board comprising a preflux film of a benzimidazole copper complex, wherein the benzimidazole copper complex is formed by (i) applying a preflux to the printed wiring board and (ii) performing an oxidizing treatment of the preflux coated wiring board sufficient to form a benzimidazole copper complex wherein said complex is substantially free of free imidazole groups from the benzimidazole preflux.

Abstract: Copper through-hole printed wiring boards are produced by forming an etching resist layer on the copper plating of a double sided copper clad laminate. The etching resist layer is formed after a negative resist pattern is applied to both sides of the laminate, and the laminate then dipped in a solution containing at least one salt of 2-alkylbenzimidazoles, 2-alkylalkylbenzimidazoles, 2-phenyl-benzimidazoles and 2-phenylalkylbenzimidazoles. After the resulting etching resist layer is selectively removed with an alkaline aqueous solution, in accordance with the predetermined pattern of the wiring, the exposed copper plating is etched off with an alkali etchant. According to the process of the present invention, remarkable advantages such as increased productivity, lower production costs, reduced toxic substances in waste water, and a high reliability can be obtained in the production of copper through-hole printed wiring boards.