Patents by Inventor Daisaku Ishikawa

Daisaku Ishikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8870016
    Abstract: A thermal insulating packaging film which includes: a base material; and an open-cell layer disposed on one face of the base material and made of polyolefin. The open-cell layer in the thermal insulating packaging film preferably has an average bore diameter of 150 ?m to 500 ?m.
    Type: Grant
    Filed: June 24, 2011
    Date of Patent: October 28, 2014
    Assignee: Hosokawa Yoko Co., Ltd.
    Inventors: Daisaku Ishikawa, Tomonari Shinohara, Yukio Kobayashi, Hidekazu Tanaka, Takashi Maru, Hiroshi Kohno, Masayuki Akamatsu
  • Publication number: 20140083996
    Abstract: The package bag for microwave cooking includes: a back seal portion formed by heat-sealing a pair of edges of a resin sheet which are opposed to each other; and edge seal portions formed by heat-sealing edges of the resin sheet so as to intersect with the back seal portion. The resin sheet includes a base material and a heat-seal layer provided on one surface of the base material, and the back seal portion is provided with an opening start portion used to tear the resin sheet. In the resin sheet, at least one opening auxiliary portion formed by linearly cutting the base material is provided on each of both sides of the back seal portion, and the opening auxiliary portion is disposed in a position to which a tear caused in the resin sheet when the package bag is opened from the opening start portion proceeds.
    Type: Application
    Filed: May 23, 2012
    Publication date: March 27, 2014
    Inventors: Toshikazu Kenmotsu, Daisaku Ishikawa
  • Publication number: 20130200085
    Abstract: A thermal insulating packaging film which includes: a base material; and an open-cell layer disposed on one face of the base material and made of polyolefin. The open-cell layer in the thermal insulating packaging film preferably has an average bore diameter of 150 ?m to 500 ?m.
    Type: Application
    Filed: June 24, 2011
    Publication date: August 8, 2013
    Applicant: HOSOKAWA YOKO CO., LTD.
    Inventors: Daisaku Ishikawa, Tomonari Shinohara, Yukio Kobayashi, Hidekazu Tanaka, Takashi Maru, Hiroshi Kohno, Masayuki Akamatsu