Patents by Inventor Daisaku Kugo

Daisaku Kugo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6315577
    Abstract: An electronic component includes leads which are capable of absorbing impacts during insertion into a printed circuit board and which are superior in terminal pull-out strength and torsional resistance of the terminal. In electronic components having leads, a plurality of lead terminals are joined with a piezoelectric resonator as an electronic component element, and the lead terminals include flat fitting parts provided in the vicinity of first end parts, kinks provided between the fitting parts and second end parts, and first and second flat parts provided between the fitting parts and the kinks.
    Type: Grant
    Filed: August 17, 2000
    Date of Patent: November 13, 2001
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Daisaku Kugo
  • Patent number: 6046529
    Abstract: An electronic component is constructed to prevent damage and stripping off or separation at adhered portions thereof even if the component is exposed to abrupt temperature changes to thereby provide a highly reliable component. A piezoelectric vibrating element defining a first substrate and an electronic component case including a pair of substrates which are second substrates are adhered together through an adhesive layer so as to define a closed space. The adhesive layer includes a fillet portion which is arranged to extend along lateral walls of the recess to edges of the closed space to prevent separation at adhesion interface surfaces of the substrates.
    Type: Grant
    Filed: April 24, 1998
    Date of Patent: April 4, 2000
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Ryuhei Yoshida, Daisaku Kugo, Masaya Wajima, Hiroyuki Takahashi, Satoshi Miura
  • Patent number: 5942836
    Abstract: An energy-trapping thickness-shear resonator includes a piezoelectric substrate, a first electrode extending from a first end to a central portion of a first surface of the piezoelectric substrate and a second electrode extending from a second end to the central portion of a second surface of the substrate. Thus, the resonator utilizes thickness shear vibrations generated in a portion of the piezoelectric substrate located between the first and second electrodes at the central portion of the substrate. The width W of the la substrate is set to be equal to or less than about 0.7 mm and also to satisfy both of the following expressions (1) and (3) or to satisfy both of the expressions (2) and (3):(1) 0<W<k T/(1-a)(2) k(2n-1)T/(1-a)<W<k(2n+1)T/(1-a)(3) 0 21 .alpha.<(fa-fr)/fawhere T indicates the thickness of the piezoelectric substrate; k is 1/2; f.sub.OSC equals fa (1-.alpha.); f.sub.
    Type: Grant
    Filed: December 8, 1997
    Date of Patent: August 24, 1999
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Ryuhei Yoshida, Daisaku Kugo, Jiro Inoue
  • Patent number: 5727301
    Abstract: An assembly system comprises a supply jig for holding and positioning a plurality of parts one by one, a supply center for inserting a plurality of parts into the supply jig, a plurality of assembly centers for taking out the parts from the supply jig and assembling the parts into products in parallel processing, carrier conveyor for carrying the supply jig from the supply center to the assembly centers and return conveyor for returning the supply jig from the assembly centers to the supply center. The supply jig supplies the common parts which are required in all of the assembly centers, while each of the assembly centers comprises individual supply means for supplying a non-common part. Thus, this system can cope with assembling various types of products simultaneously, and can eliminate line stoppage upon occurrence of a trouble or for periodic inspection in any one of the centers, thereby production capability is improved.
    Type: Grant
    Filed: April 30, 1996
    Date of Patent: March 17, 1998
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Daisaku Kugo
  • Patent number: 5724724
    Abstract: An assembly system comprises a supply jig for holding and positioning a plurality of parts one by one, a supply center for inserting a plurality of parts into the supply jig, a plurality of assembly centers for taking out the parts from the supply jig and assembling the parts into products in parallel processing, carrier conveyor for carrying the supply jig from the supply center to the assembly centers and return conveyor for returning the supply jig from the assembly centers to the supply center. The supply jig supplies the common parts which are required in all of the assembly centers, while each of the assembly centers comprises individual supply means for supplying a non-common part. Thus, this system can cope with assembling various types of products simultaneously, and can eliminate line stoppage upon occurrence of a trouble or for periodic inspection in any one of the centers, thereby production capability is improved.
    Type: Grant
    Filed: April 30, 1996
    Date of Patent: March 10, 1998
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Daisaku Kugo
  • Patent number: 5709024
    Abstract: An apparatus for assembling an electronic component, such as a ladder-type filter, having at least one element being held between terminal plates under pressure and stored in a case. First, the terminal plates are inserted in a cavity of a base so as to align the terminal plates along a direction of thickness thereof. Then, the element is inserted between the terminal plates in the cavity, and a spring plate is inserted in the cavity at an outside of one of the terminal plates. Thereafter, all parts inserted in the cavity are compressed by a presser along the direction of thickness so that an overall thickness of the parts is smaller than an inner size of the case. Then, the case is set on the base, and all parts are inserted from the cavity into the case simultaneously. Electrode surfaces of the element are not damaged since they are not in sliding contact with the terminal plates, and working efficiency is improved by this compressed insertion.
    Type: Grant
    Filed: September 22, 1995
    Date of Patent: January 20, 1998
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Daisaku Kugo
  • Patent number: 5575050
    Abstract: A method of assembling an electronic component, such as a ladder-type filter, having at least one element being held between terminal plates under pressure and stored in a case. First, the terminal plates are inserted in a cavity of a base so as to align the terminal plates along a direction of thickness thereof. Then, the element is inserted between the terminal plates in the cavity, and a spring plate is inserted in the cavity at an outside of one of the terminal plates. Thereafter, all parts inserted in the cavity are compressed by a presser along the direction of thickness so that an overall thickness of the parts is smaller than an inner size of the case. Then, the case is set on the base, and all parts are inserted from the cavity into the case simultaneously. Electrode surfaces of the element are not damaged since they are not in sliding contact with the terminal plates, and working efficiency is improved by this compressed insertion.
    Type: Grant
    Filed: February 24, 1994
    Date of Patent: November 19, 1996
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Daisaku Kugo
  • Patent number: 5522123
    Abstract: A method of and an apparatus for assembling an electronic component, such as a ladder-type filter, having a plurality of parts being held under pressure and stored in a case. First, the parts such as elements and terminal plates and the case are carried into a working area of a chuck unit. Next, the parts are chucked by the chuck unit and assembled in an assembly jig so as to be aligned along a direction of thicknesses thereof. Then, all parts in the assembly jig are compressed in the direction of thickness, and simultaneously inserted into the case. Thus, automatic assembly of an electronic component is realized so as to highly improve working efficiency.
    Type: Grant
    Filed: February 24, 1994
    Date of Patent: June 4, 1996
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Daisaku Kugo
  • Patent number: 5507087
    Abstract: A cover sheet assembling apparatus for an electronic component such as a ladder-type filter, which delivers a sheet member stepwisely by feed means, punches out a cover sheet from the sheet member with a punch and a die, and inserts the cover sheet in an opening of a case so that the lead portions of terminal plates pass through slits of the cover sheet. According to this apparatus, it becomes possible to automatically assemble the cover sheet in the case, thereby the working efficiency is highly improved.
    Type: Grant
    Filed: March 23, 1994
    Date of Patent: April 16, 1996
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Daisaku Kugo
  • Patent number: 5487580
    Abstract: A chuck unit for automatically inserting a workpiece in a receiving portion, which comprises a fixed pawl, first and second movable pawls and a pusher. Both major surfaces of the workpiece are chucked by a first vertical surface of the fixed pawl and the first movable pawl, and both side edges of the workpiece are chucked by a second vertical surface of the fixed pawl being perpendicular to the first vertical surface and the second movable pawl. The pusher is vertically movable between the first vertical surface and the first movable pawl for downwardly extruding the workpiece. Since two major surfaces and two side edges of the workpiece are held by the pawls, the attitude and position of the workpiece are corrected therein. Therefore, this chuck unit is suitable for assembling a plurality of workpieces which are arranged in a thickness direction thereof in an aligned manner.
    Type: Grant
    Filed: March 24, 1994
    Date of Patent: January 30, 1996
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Daisaku Kugo
  • Patent number: 5299681
    Abstract: Retainer grooves are formed widthwise at a constant pitch on the external surface of a timing belt to retain the lead terminals of an electronic component therein. A magnet is mounted to a rail for guiding the timing belt to attract the lead terminals of the electronic component to the retainer grooves. The electronic component can be prevented from falling off or being displaced due to an inertia force generated at the time of intermittent feed so as to be stably conveyed not only horizontally but also in vertical or circular arc directions.
    Type: Grant
    Filed: April 29, 1992
    Date of Patent: April 5, 1994
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Nobuaki Kadono, Daisaku Kugo, Masatoshi Kajiwara, Ryuji Yamakawa
  • Patent number: 5259911
    Abstract: An apparatus for automatically taping electronic components arranged such that when a timing belt retaining lead terminals of electronic components in its retainer grooves is engaged with a toothed pulley of a first rotary drum, the lead terminals are lifted to be transferred from the timing belt to the first rotary drum. The electronic components are transferred from the first drum to a third rotary drum via a second rotary drum being retained by their retainer teeth. A base tape is fed to the periphery of the third rotary drum and an adhesive tape is applied on the base tape, thereby fixing the lead terminals.
    Type: Grant
    Filed: April 29, 1992
    Date of Patent: November 9, 1993
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Nobuo Ohnishi, Daisaku Kugo, Nobuaki Kadono, Masatoshi Kajiwara, Ryuji Yamakawa