Abstract: A terminal frame used to manufacture electronic devices, the terminal frame having a metal strip and a plurality of stick-like metal terminals. The metal terminals are joined to the metal strip by resistance welding. A manufacturing system of such terminal frames includes a device used for resistance welding, where the device has an electrode which holds each terminal at a portion near a joint portion, and a current is supplied to the terminal through the electrode.

Abstract: A composite electronic component including a resonator element and a capacitor element fixed together by adhesive material. The capacitor element is longer than the resonator element, so that side steps are defined on both end portions of the elements. First and second lead terminals are connected by solder with first and second capacitor electrodes located on a front surface of the capacitor element and with resonator electrodes located on side surfaces of the resonator element exposed at the side steps. A third lead terminal is connected by solder with a third capacitor electrode located on a rear surface of the capacitor element. Therefore, the thin and miniature composite electronic component adapted for a Colpitts oscillation circuit is obtained at a low cost.

Abstract: In a chip-type piezoelectric-resonator, which is protected with thermosetting resin, mother sheets are bonded to cover both major surfaces of a mother substrate having a plurality of piezoelectric resonance elements which are provided on a piezoelectric substrate, in order to properly form vibrating spaces. The mother sheets are provided with concave portions for defining cavities for vibration. Then, protective resin is applied to cover the mother substrate which is bonded with the mother sheets, and thereafter the mother substrate is divided so as to obtain a plurality of chip-type piezoelectric-resonators.