Patents by Inventor Daisaku MATSUKAWA

Daisaku MATSUKAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • POLYIMIDE PRECURSOR, RESIN COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING PATTERNED CURED FILM, CURED FILM, INTERLAYER INSULATING FILM, COVER COAT LAYER, SURFACE-PROTECTIVE FILM, AND ELECTRONIC COMPONENT
    Publication number: 20240092973
    Abstract: A polyimide precursor having a structural unit represented by the following formula (1):
    Type: Application
    Filed: October 7, 2019
    Publication date: March 21, 2024
    Inventors: Naoto NAGAMI, Daisaku MATSUKAWA, Nobuyuki SAITO, Atsutaro YOSHIZAWA
  • Positive-type photosensitive resin composition
    Patent number: 11592744
    Abstract: A positive-type photosensitive resin composition comprises a (a) polybenzoxazole precursor, a (b) crosslinking agent, a (c) photosensitive agent, and a (d) solvent, wherein the (a) polybenzoxazole precursor comprises a structure represented by Formula (1) below, and the (c) photosensitive agent is a compound comprising a structure represented by Formula (2) below. In Formula (1), U is a bivalent organic group, a single bond, —O—, or —SO2—, V is a group comprising an aliphatic structure, and the carbon number in the aliphatic structure is 1 to 30.
    Type: Grant
    Filed: February 5, 2016
    Date of Patent: February 28, 2023
    Assignee: HD MICROSYSTEMS, LTD.
    Inventors: Daisaku Matsukawa, Tadamitsu Nakamura
  • Photosensitive Resin Composition, Method Of Manufacturing Pattern Cured Film, Cured Film, Interlayer Insulating Film, Cover Coat Layer, Surface Protective Film, And Electronic Component
    Publication number: 20220276555
    Abstract: A photosensitive resin composition of the invention contains (A) a polyimide precursor having a polymerizable unsaturated bond, (B) a photopolymerization initiator comprising a compound represented by the formula (11), (C) a thermal radical generator, and (D) a solvent containing ?-butyrolactone: wherein in the formula (11), R11 is a substituted or unsubstituted benzoyl group, a substituted or unsubstituted fluorenyl group, or a group comprising a substituted or unsubstituted carbazolyl group; R12 is an alkyl group including 1 to 12 carbon atoms, a group comprising a cycloalkyl group including 4 to 10 carbon atoms, a group comprising a phenyl group, or a group comprising a tolyl group; R13 is a substituted or unsubstituted aromatic hydrocarbon group including 6 to 20 carbon atoms.
    Type: Application
    Filed: August 12, 2020
    Publication date: September 1, 2022
    Inventors: Shingo Tahara, Nobuyuki Saito, Daisaku Matsukawa, Tetsuya Enomoto
  • PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING PATTERNED CURED PRODUCT, CURED PRODUCT, INTERLAYER INSULATING FILM, COVER COAT LAYER, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT
    Publication number: 20210382391
    Abstract: A photosensitive resin composition comprising (A) a polyimide precursor having a polymerizable unsaturated bond; (B) a polymerizable monomer; (C) a photopolymerization initiator; and (D) an ultraviolet absorber.
    Type: Application
    Filed: June 17, 2019
    Publication date: December 9, 2021
    Inventors: Hiroko YOTSUYANAGI, Daisaku MATSUKAWA, Noriyuki YAMAZAKI
  • Positive photosensitive resin composition, patterned cured film production method, patterned cured film, and electronic component
    Patent number: 11048167
    Abstract: A positive photosensitive resin composition comprising (a) polybenzoxazole precursor, (b) a cross-linking agent, (c) a diazonaphoquinone compound, (d) an iodonium compound and (e) a solvent.
    Type: Grant
    Filed: January 22, 2016
    Date of Patent: June 29, 2021
    Assignee: HD MICROSYSTEMS, LTD.
    Inventors: Daisaku Matsukawa, Tetsuya Enomoto
  • POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION
    Publication number: 20190049842
    Abstract: A positive-type photosensitive resin composition comprises a (a) polybenzoxazole precursor, a (b) crosslinking agent, a (c) photosensitive agent, and a (d) solvent, wherein the (a) polybenzoxazole precursor comprises a structure represented by Formula (1) below, and the (c) photosensitive agent is a compound comprising a structure represented by Formula (2) below. In Formula (1), U is a bivalent organic group, a single bond, —O—, or —SO2—, V is a group comprising an aliphatic structure, and the carbon number in the aliphatic structure is 1 to 30.
    Type: Application
    Filed: February 5, 2016
    Publication date: February 14, 2019
    Inventors: Daisaku MATSUKAWA, Tadamitsu NAKAMURA
  • POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNED CURED FILM PRODUCTION METHOD, PATTERNED CURED FILM, AND ELECTRONIC COMPONENT
    Publication number: 20180074403
    Abstract: A positive photosensitive resin composition comprising (a) polybenzoxazole precursor, (b) a cross-linking agent, (c) a diazonaphoquinone compound, (d) an iodonium compound and (e) a solvent.
    Type: Application
    Filed: January 22, 2016
    Publication date: March 15, 2018
    Inventors: Daisaku MATSUKAWA, Tetsuya ENOMOTO