Patents by Inventor Daisuke Arioka

Daisuke Arioka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230392981
    Abstract: The present invention provides an ultraviolet-sensing member in which it is easy to determine whether an irradiation amount which inactivates the novel coronavirus has been irradiated, and an ultraviolet-sensing kit. In the ultraviolet-sensing member of the present invention, in a case where, using a KrCl excimer lamp as a light source, the ultraviolet-sensing member is irradiated with light through a filter which substantially shields light having a wavelength of 230 to 300 nm until an irradiation amount of light having a wavelength of 222 nm reaches 3 mJ/cm2, and using a spectrophotometer Spectrolino (GretagMacbeth AG), optical densities of predetermined colors are measured with the ultraviolet-sensing member before the light irradiation and the ultraviolet-sensing member after the light irradiation, the optical densities show a predetermined value.
    Type: Application
    Filed: August 23, 2023
    Publication date: December 7, 2023
    Applicant: FUJIFILM Corporation
    Inventors: Kimi IKEDA, Daisuke Arioka
  • Publication number: 20230392983
    Abstract: The present invention provides an ultraviolet inspection tool having excellent color formability with respect to light having a wavelength of 222 nm even in a case where an irradiation amount of the light having a wavelength of 222 nm is small, an ultraviolet inspection kit, and an ultraviolet inspection method. The ultraviolet inspection tool of the present invention is an ultraviolet inspection tool including an ultraviolet-sensing layer containing a color-forming agent and an acid generator, in which the color-forming agent has at least one selected from the group consisting of a lactone structure, a lactam structure, a sultone structure, a sultine structure, a ring-opened structure of these structures, and an azobenzene structure, a molecular weight of the acid generator is 600 or less, and a mass ratio of a content of the acid generator to a content of the color-forming agent is 1.01 to 40.00.
    Type: Application
    Filed: August 24, 2023
    Publication date: December 7, 2023
    Applicant: FUJIFILM Corporation
    Inventors: Kimi IKEDA, Daisuke Arioka
  • Publication number: 20220203321
    Abstract: The present invention provides a microcapsule encompassing water or a water-soluble compound and having excellent leakage resistance and morphological stability. Further, the present invention provides a method for producing the microcapsule. The microcapsule of the present invention is a microcapsule encompassing at least one of water or a water-soluble compound, in which a capsule wall of the microcapsule contains a resin having a repeating unit derived from a hydrophobic monomer having a ClogP value of 0.70 or more and a repeating unit derived from a hydrophilic monomer having a ClogP value of less than 0.70, and the microcapsule satisfies a relationship of Expression (1). ? / Dm ? 0 . 4 ? 0 Expression ? ( 1 ) ? represents a number average wall thickness (?m) of the microcapsule. Dm represents a volume-based median diameter (?m) of the microcapsule.
    Type: Application
    Filed: March 17, 2022
    Publication date: June 30, 2022
    Applicant: FUJIFILM Corporation
    Inventors: Shinya HAYASHI, Daisuke ARIOKA
  • Publication number: 20210395565
    Abstract: There are provided: a microcapsule that includes a shell part containing a polymer and a core part which is encapsulated in the shell part, where the core part contains a coloring material and the polymer has an ultraviolet absorbent skeleton in the main chain thereof; and an application of the microcapsule.
    Type: Application
    Filed: September 5, 2021
    Publication date: December 23, 2021
    Applicant: FUJIFILM Corporation
    Inventors: Shinya HAYASHI, Daisuke ARIOKA
  • Patent number: 9389505
    Abstract: The present invention provides a polymerizable composition for a solder resist, including an infrared ray shielding material, a polymerization initiator, and a polymerizable compound, and a solder resist pattern forming method using the polymerizable composition for a solder resist.
    Type: Grant
    Filed: December 9, 2010
    Date of Patent: July 12, 2016
    Assignee: FUJIFILM Corporation
    Inventors: Kazuto Shimada, Kimi Ikeda, Yoshiharu Yabuki, Daisuke Arioka
  • Publication number: 20140342174
    Abstract: A mirror film including a support, a plating undercoat polymer layer containing reduced metal particles, a reflective layer containing silver, and a resin protective layer, in this order. A surface roughness Ra of a surface of the reflective layer containing silver at a resin protective layer side is 20 nm or less.
    Type: Application
    Filed: August 1, 2014
    Publication date: November 20, 2014
    Inventors: Jo TOMINAGA, Kazuma TAKENO, Daisuke ARIOKA
  • Patent number: 8735483
    Abstract: A polymerizable composition includes: a polymerization initiator; a polymerizable compound; a tungsten compound; and an alkali-soluble binder.
    Type: Grant
    Filed: November 19, 2012
    Date of Patent: May 27, 2014
    Assignee: FUJIFILM Corporation
    Inventors: Naotsugu Muro, Kimi Ikeda, Kazuto Shimada, Daisuke Arioka
  • Patent number: 8557948
    Abstract: A photosensitive composition, at least containing: a carboxyl group-containing photosensitive polyurethane resin; a phosphorus-containing flame retardant; a polymerizable compound; and a photopolymerization initiator, wherein both a resin polymer of the photosensitive polyurethane resin and the polymerizable compound do not contain a phosphorus atom, wherein the photosensitive polyurethane resin has the weight average molecular weight from 2,000 to 60,000, the acid value from 20 mg KOH/g to 120 mg KOH/g, and the ethylenically unsaturated group equivalent from 0.05 mmol/g to 3.0 mmol/g, and wherein the photosensitive polyurethane resin has, in the side chain thereof, at least one particular functional group.
    Type: Grant
    Filed: August 30, 2011
    Date of Patent: October 15, 2013
    Assignee: FUJIFILM Corporation
    Inventors: Hideki Tomizawa, Kazumori Minami, Daisuke Arioka
  • Publication number: 20130034812
    Abstract: The present invention provides a polymerizable composition for a solder resist, including an infrared ray shielding material, a polymerization initiator, and a polymerizable compound, and a solder resist pattern forming method using the polymerizable composition for a solder resist.
    Type: Application
    Filed: December 9, 2010
    Publication date: February 7, 2013
    Applicant: FUJIFILM CORPORATION
    Inventors: Kazuto Shimada, Kimi Ikeda, Yoshiharu Yabuki, Daisuke Arioka
  • Publication number: 20120282549
    Abstract: A photosensitive composition including: a photosensitive polyurethane resin; a phosphorus-containing flame retardant; a polymerizable compound; and a photopolymerization initiator, wherein the photosensitive polyurethane resin contains an ethylenically unsaturated bond group and a carboxyl group, and contains a polyurethane skeleton which contains a polyol group as a repeating unit.
    Type: Application
    Filed: January 28, 2011
    Publication date: November 8, 2012
    Applicant: FUJIFILM CORPORATION
    Inventors: Hideki Tomizawa, Kazumori Minami, Daisuke Arioka
  • Publication number: 20120183776
    Abstract: A curable composition of the present invention includes resin-coated inorganic fine particles. The resin-coated inorganic fine particles may be formed by surface-modifying inorganic fine particles with a silane coupling agent containing an organic linking chain formed of a mercapto group, a hydroxyl group, an amino group, an isocyanato group, or a glycidyl group and then coating the surface-modified inorganic fine particles with a thermoplastic resin.
    Type: Application
    Filed: September 16, 2010
    Publication date: July 19, 2012
    Applicant: FUJIFILM CORPORATION
    Inventors: Daisuke Arioka, Hiroki Sasaki, Toshiaki Hayashi
  • Publication number: 20120048594
    Abstract: A photosensitive composition, at least containing: a carboxyl group-containing photosensitive polyurethane resin; a phosphorus-containing flame retardant; a polymerizable compound; and a photopolymerization initiator, wherein both a resin polymer of the photosensitive polyurethane resin and the polymerizable compound do not contain a phosphorus atom, wherein the photosensitive polyurethane resin has the weight average molecular weight from 2,000 to 60,000, the acid value from 20 mg KOH/g to 120 mg KOH/g, and the ethylenically unsaturated group equivalent from 0.05 mmol/g to 3.0 mmol/g, and wherein the photosensitive polyurethane resin has, in the side chain thereof, at least one particular functional group.
    Type: Application
    Filed: August 30, 2011
    Publication date: March 1, 2012
    Applicant: FUJIFILM CORPORATION
    Inventors: Hideki TOMIZAWA, Kazumori MINAMI, Daisuke ARIOKA
  • Publication number: 20110160325
    Abstract: Described is a method for producing a void-containing resin molded product which enables producing a void-containing resin molded product having a high color saturation and an appearance excellent in brightness and heat insulation properties by stretching polymer-molded product containing a single crystalline polymer, and a void-containing resin molded product obtained by the production method. A first aspect of the method for producing a void-containing resin molded product is a method for producing a void-containing resin molded product, the method including: stretching a polymer-molded product containing a single crystalline polymer in at least one axial direction, wherein a yield stress (A) and a stress (L30) at an elongation of 30% in a stress-strain curve of the polymer-molded product in the stretching in the one axial direction satisfy Relationship (I): L30/A<0.
    Type: Application
    Filed: July 23, 2009
    Publication date: June 30, 2011
    Applicant: FUJIFILM CORPORATION
    Inventors: Yasutomo Goto, Hiroki Saski, Tooru Ogura, Daisuke Arioka
  • Publication number: 20100099787
    Abstract: The present invention provides a void-containing resin molded product having high heat insulation properties and a method for producing such a molded product. The present invention also provides an image-receiving film or sheet that includes the void-containing resin molded product to provide favorable printing characteristics and is intended for use in a sublimation transfer recording material or a thermal transfer recording material. The void-containing resin molded product consists of a crystalline polymer and has voids therein, wherein the resin molded product has a ratio X/Y of 0.27 or less, where X denotes a thermal conductivity (in W/mK) of the void-containing resin molded product, and Y denotes a thermal conductivity (in W/mK) of a void-free polymer molded product having the same thickness as the void-containing resin molded product and formed of the same crystalline polymer that forms the void-containing resin molded product.
    Type: Application
    Filed: November 22, 2007
    Publication date: April 22, 2010
    Applicant: FUJIFILM CORPORATION
    Inventors: Daisuke Arioka, Yasutomo Goto, Tooru Ogura, Hiroki Sasaki
  • Publication number: 20090027608
    Abstract: The invention provides: a photosensitive composition which has a high deformation restorability and may eliminate display unevenness in a liquid crystal display device, a photosensitive resin transfer film and a method for producing a photospacer using the composition or the film; and a liquid crystal display device substrate and a liquid crystal display device which may eliminate display unevenness and thus display high quality images. The photosensitive composition includes: a resin (A) including a group having a cyclic structure including two or more heteroatoms in a side chain, a group having an acidic group in a side chain, and a group having an ethylenically unsaturated group in a side chain; a polymerizable compound (B); and a photopolymerization initiator (C).
    Type: Application
    Filed: July 23, 2008
    Publication date: January 29, 2009
    Applicant: FUJIFILM Corporation
    Inventors: Hideyuki NAKAMURA, Kyohei MOCHIZUKI, Yuuichi FUKUSHIGE, Daisuke ARIOKA
  • Patent number: 6927007
    Abstract: A heat-sensitive recording material including a substrate having disposed thereon a heat-sensitive recording layer containing a diazo compound and a coupler compound capable of reacting with the diazo compound to develop color, wherein the coupler compound includes at least one of anilide derivatives represented by the following formula (1) or tautomers thereof: wherein R1 represents an alkyl group or an aryl group; R2, R3 and R4 each independently represent a hydrogen atom, a halogen atom, an alkyl group, an aryl group, an acyl group, an alkoxy group, an alkoxycarbonyl group, a hydroxycarbonyl group, an aminocarbonyl group, an acylamino group, a cyano group, a nitro group, an arylthio group or an alkylthio group; L represents a group which can leave upon coupling with the diazo compound; m represents 1 or 2; and n represents 1 or 2.
    Type: Grant
    Filed: October 27, 2003
    Date of Patent: August 9, 2005
    Assignee: Fuji Photo Film Co., Ltd.
    Inventors: Yohsuke Takeuchi, Akinori Fujita, Daisuke Arioka, Tetsunori Matsushita
  • Publication number: 20040086798
    Abstract: A heat-sensitive recording material including a substrate having disposed thereon a heat-sensitive recording layer containing a diazo compound and a coupler compound capable of reacting with the diazo compound to develop color,
    Type: Application
    Filed: October 27, 2003
    Publication date: May 6, 2004
    Applicant: FUJI PHOTO FILM CO., LTD.
    Inventors: Yohsuke Takeuchi, Akinori Fujita, Daisuke Arioka, Tetsunori Matsushita
  • Patent number: 6720421
    Abstract: Phenylurethane compounds of the following general formula (1); asymmetric urea compounds of the following general formula (10) obtained from the phenylurethane compounds; barbituric acid derivatives of general formula (18) produced from the asymmetric urea compounds, which have specific substituents and are useful in diazo thermal recording materials; and diazo thermal recording materials containing the barbituric acid derivative.
    Type: Grant
    Filed: February 19, 2002
    Date of Patent: April 13, 2004
    Assignee: Fuji Photo Film Co., Ltd.
    Inventors: Akinori Fujita, Naoto Yanagihara, Yohsuke Takeuchi, Daisuke Arioka, Kimi Ikeda, Sachiko Arai
  • Publication number: 20030166961
    Abstract: Phenylurethane compounds of the following general formula (1); asymmetric urea compounds of the following general formula (10) obtained from the phenylurethane compounds; barbituric acid derivatives of general formula (18) produced from the asymmetric urea compounds, which have specific substituents and are useful in diazo thermal recording materials; and diazo thermal recording materials containing the barbituric acid derivative.
    Type: Application
    Filed: January 27, 2003
    Publication date: September 4, 2003
    Applicant: FUJI PHOTO FILM CO., LTD.
    Inventors: Akinori Fujita, Naoto Yanagihara, Yohsuke Takeuchi, Daisuke Arioka, Kimi Ikeda, Sachiko Arai
  • Publication number: 20020161225
    Abstract: Phenylurethane compounds of the following general formula (1); asymmetric urea compounds of the following general formula (10) obtained from the phenylurethane compounds; barbituric acid derivatives of general formula (18) produced from the asymmetric urea compounds, which have specific substituents and are useful in diazo thermal recording materials; and diazo thermal recording materials containing the barbituric acid derivative.
    Type: Application
    Filed: February 19, 2002
    Publication date: October 31, 2002
    Applicant: FUJI PHOTO FILM CO., LTD.
    Inventors: Akinori Fujita, Naoto Yanagihara, Yohsuke Takeuchi, Daisuke Arioka, Kimi Ikeda, Sachiko Arai