Patents by Inventor Daisuke Atobe

Daisuke Atobe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5407610
    Abstract: In a method for molding a sheet which includes thermosetting resin materials reinforced with glass fiber or carbon fiber, the sheet includes a covering film always existing in a side which is not in contact with a mold face and, when the sheet and covering film are shaped along a mold face and the sheet is thermally cured, apparatus for dealing with an accidental breakage of the covering film is arranged on the side of the sheet which is covered by said covering film.
    Type: Grant
    Filed: July 22, 1993
    Date of Patent: April 18, 1995
    Assignees: Honda Giken Kogyo Kabushiki Kaisha, Nippon Shokubai Kagaku Kogyo Co., Ltd.
    Inventors: Katsumi Kohama, Hiromi Tanaka, Ryoichi Yugami, Tomohisa Abe, Daisuke Atobe, Hidemitsu Takizawa, Kenichi Ueda, Yuji Inagaki
  • Patent number: 5234756
    Abstract: This invention provides a sheet for molding a fiber-reinforced resin finishing the fiber-reinforced resin moldings surface under an excellently colored condition.A sheet for molding of this invention comprises a fiber-reinforced resin layer and a colored surface resin layer being laminated and has, in the fiber-reinforced resin layer, a fiber-reinforced colored resin layer adjacent to said surface resin layer and colored in a color similar to that of the surface resin layer, and a fiber-reinforced transparent resin layer arranged on a surface in a side reverse to the surface resin layer and having a curing character by ultraviolet rays.
    Type: Grant
    Filed: September 26, 1991
    Date of Patent: August 10, 1993
    Assignees: Honda Giken Kogyo Kabushiki Kaisha, Nippon Shobubai Co., Ltd.
    Inventors: Katsumi Kohama, Ryoichi Yugami, Tomohisa Abe, Kenichi Ueda, Yuji Inagaki, Daisuke Atobe
  • Patent number: 5211893
    Abstract: The method for molding a resin reinforced with fiber wherein a resin sheet reinforced with fiber is positioned juxtaposed a face of a mold, which is either one of a female mold or a male mold, and then hardened, but before molding, modifying the viscosity to different levels in different portions of the resin sheet. Thus, it is possible to surely prevent occurrence of a partial difference in thickness of the moldings or, if necessary, to partially change these thicknesses according to predetermined values.
    Type: Grant
    Filed: April 13, 1990
    Date of Patent: May 18, 1993
    Assignees: Honda Giken Kogyo Kabushiki Kaisha, Nippon Shokubai Kagaku Kogyo Co., Ltd.
    Inventors: Hiroo Ebisawa, Katsumi Kohama, Tomohisa Abe, Hidemitsu Takizawa, Daisuke Atobe, Kenichi Ueda
  • Patent number: 5082598
    Abstract: A thermosetting resin composition of highly satisfactory storage stability comprises 100 parts by weight of a thermosetting resin composition, 0.0001 to 2.0 parts by weight of a thiuram compound possessing at least one atomic group represented by the following formula: ##STR1## wherein p stands for an integer in the range of 1 to 8, and 0.00001 to 0.1 part by weight (as copper metal) of a copper-containing compound.
    Type: Grant
    Filed: May 8, 1989
    Date of Patent: January 21, 1992
    Assignee: Nippon Shokubai Kagaku Kogyo Co., Ltd.
    Inventors: Toshio Awaji, Kenichi Ueda, Daisuke Atobe
  • Patent number: 4866134
    Abstract: An electric metal foil-plated laminate sheet which is obtained by laminating a cured layer of a thermosetting resin composition with electroconductive foils, said thermosetting resin composition comprising 30-85% by weight of (A) a rubber-modified vinyl ester obtained by reacting,(a) an epoxy resin,(b) a carboxyl group containing rubbery polymer derived from a conjugated diene, and(c) at least one unsaturated monocarboxylic acid selected from the group consisting of acrylic acid and methacrylic acid to react one another in amounts such that, based on 100 parts by weight of (a) the epoxy resin, (b) the carboxyl group containing rubbery polymer accounts for a proportion in the range of 5 to 80 parts by weight and that the total number of carboxylic group contained in (b) the rubbery polymer and (c) the unsaturated monocarboxylic acid falls in the range of 1.3 to 1.5 per each of the epoxy groups contained in (a) the epoxy resin at a temperature of 90.degree. to 120.degree. C.
    Type: Grant
    Filed: April 21, 1988
    Date of Patent: September 12, 1989
    Assignees: Matsushita Electric Works, Ltd., Nippon Shokubai Kagaku Kogyo Co., Ltd.
    Inventors: Hidekazu Takano, Tetsuo Kunitomi, Shigehiro Okada, Toshio Awaji, Katsuaki Shindo, Daisuke Atobe
  • Patent number: 4837280
    Abstract: A thermosetting resin composition of highly satisfactory storage stability comprises 100 parts by weight of a thermosetting resin composition, 0.0001 to 2.0 parts by weight of a thiuram compound possessing at least one atomic group represented by the following formula: ##STR1## wherein p stands for an integer in the range of 1 to 8, and 0.00001 to 0.1 part by weight (as copper metal) of a copper-containing compound.
    Type: Grant
    Filed: September 23, 1987
    Date of Patent: June 6, 1989
    Assignee: Nippon Shokubai Kagaku Kogyo Co., Ltd.
    Inventors: Toshio Awaji, Kenichi Ueda, Daisuke Atobe
  • Patent number: 4129609
    Abstract: A method for improving storage stability of a thermosetting resin, which comprises adding a thiuram compoound to the thermosetting resin comprising a reaction product of an epoxy resin with an .alpha.,.beta.-unsaturated monocarboxylic acid dissolved in a polymerizable olefinic unsaturated compound, said thiuram compound having in one molecule thereof at least one atomic group expressed by the following general formula I: ##STR1## wherein p is an integer of 1 to 4, and being used in an amount of 0.0001 to 2.0 parts by weight per 100 parts by weight of said reaction product.
    Type: Grant
    Filed: July 11, 1977
    Date of Patent: December 12, 1978
    Assignee: Nippon Shokubai Kagaku Kogyo Co., Ltd.
    Inventors: Toshio Awaji, Daisuke Atobe