Abstract: A resin composition containing a curable prepolymer which contains a vinylbenzyl group and an indene ring and has a weight average molecular weight of 50,000 or higher. Also provided is a prepreg, a resin film, a metal-clad laminate, a printed wiring board and a semiconductor package obtained using the resin composition.

Abstract: The present invention provides a buffer sheet composition including a thermosetting compound, which buffer sheet composition is used for producing a buffer sheet to be interposed between a heating member and an electronic component, when the electronic component is heated by the heating member so as to mount the electronic component on a substrate, as well as a buffer sheet including a thermosetting composition layer obtained by forming the buffer sheet composition into the form of a sheet.

Abstract: A wiring forming member 1 includes a metal layer 20 and an adhesive layer 10 disposed on the metal layer 20, in which the adhesive layer 10 includes conductive particles 12 and a thermosetting resin, the adhesive layer has a reaction rate of 90% or less when heated at 180° C. for 5 minutes, and a ratio [Dp/T] of an average particle diameter Dp of the conductive particles to a thickness T of the adhesive layer is 0.56 to 1.2.

Abstract: Provided is a resin sheet containing a resin component (A) and an inorganic filler (B), the component (A) containing an elastomer (A1) having a number average molecular weight of 10,000 or more, having a content of the component (A1) of 30% by mass or more based on the component (A), the resin sheet having a content of the component (B) of 40 to 95% by volume based on the total amount of the resin sheet.

Abstract: A method for producing a prepreg, includes the steps of (1) an opening step of opening glass fiber bundles to form plural glass fiber filaments, and (2) a step of aligning the plural glass fiber filaments formed in the previous opening step, on a thermosetting resin composition-coated surface of a carrier material so as to make the filaments run nearly parallel to each other in one direction thereon to form a prepreg. A method for producing a laminate, includes a step of preparing two or more prepregs formed in the previous step (2), laminating them in such a manner that, in at least one pair of prepregs, the running direction of the plural glass fiber filaments in one prepreg differs from the running direction of the plural glass fiber filaments in the other prepreg, and heating and pressing them.

Abstract: A member for forming wiring includes a metal layer and an adhesive layer disposed on the metal layer. The adhesive layer contains conductive particles, a thermosetting resin, and a maleimide compound. A member for forming wiring in which an adhesive layer and a metal layer are provided separately, and the adhesive layer is adherable to the metal layer at the point of use. The adhesive layer contains conductive particles, a thermosetting resin, and a maleimide compound.

Abstract: A member 1 for forming wiring includes an adhesive layer 10 and a metal layer 20. The adhesive layer 10 is composed of an adhesive composition containing conductive particles 12 and a thermosetting component. The metal layer 20 is disposed on the adhesive layer 10. In such a member 1 for forming wiring, the adhesive layer contains an epoxy resin and a phenolic resin, as the thermosetting component.

Abstract: The present invention relates to a maleimide resin composition including (A) at least one selected from the group consisting of a maleimide compound having two or more N-substituted maleimide groups and a derivative thereof; and (B) a modified conjugated diene polymer, the component (B) being one resulting from modification of (b1) a conjugated diene polymer having a vinyl group in the side chain with (b2) a maleimide compound having two or more N-substituted maleimide groups and also to a prepreg, a laminate, a resin film, a multilayer printed wiring board, and a semiconductor package, each using the foregoing maleimide resin composition.

Abstract: Provided is a prepreg capable of attaining thermal expansion coefficient reduction and elastic modulus increase without increasing the filling ratio of an inorganic filler therein and/or without using a resin having a low thermal expansion coefficient, and thereby capable of reducing warpage thereof. Specifically, provided is a prepreg containing glass fibers and a thermosetting resin composition, and containing a layer of plural glass fiber filaments aligned to run nearly parallel to each other in one direction. Also provided are a production method for the prepreg, a laminate containing the prepreg and its production method, a printed circuit board containing the laminate, and a semiconductor package having a semiconductor device mounted on the printed circuit board.

Abstract: A wiring-forming member 1 includes an adhesive layer 10 containing conductive particles 12, and a metal layer 20 disposed on the adhesive layer 10. The adhesive layer 10 includes a first adhesive layer 15 containing the conductive particles 12 and an adhesive component, and a second adhesive layer 16 containing an adhesive component.

Abstract: A conductive member includes an adhesive layer and a metal foil layer. The adhesive layer consists of an adhesive composition containing conductive particles. The metal foil layer is disposed on the adhesive layer. The conductive member can be used to form, for example, a predetermined metal film.

Abstract: A method for evaluating the compatibility of a thermosetting resin composition containing at least two kinds of resins and an inorganic filler, the method including the following steps 1A and 2A: Step 1A: a step of obtaining a reflected electronic image of the cross section of a cured product of the thermosetting resin composition using a scanning electron microscope at an observation magnification of 50 to 250 times; and Step 2A: a step in which, in the reflected electronic image, a phase-separated resin region is referred to as a separation part and the remaining region is referred to as a non-separation part, and the image is binarized such that the separation part has one value and the non-separation part has the other value, and the area ratio of the region of the non-separation part of the resultant binarized image to the total region of the binarized image (area of the region of the non-separation part×100/area of the total region of the binarized image) is calculated as the area ratio Rw of the non-se

Abstract: An epoxy resin has a mesogenic structure and a siloxane structure. An epoxy resin composition includes the epoxy resin having the mesogenic structure and the siloxane structure, and a curing agent.

Abstract: The present invention provides a buffer sheet composition including a thermosetting compound, which buffer sheet composition is used for producing a buffer sheet to be interposed between a heating member and an electronic component, when the electronic component is heated by the heating member so as to mount the electronic component on a substrate, as well as a buffer sheet including a thermosetting composition layer obtained by forming the buffer sheet composition into the form of a sheet.

Abstract: The present invention relates to a maleimide resin composition including (A) at least one selected from the group consisting of a maleimide compound having two or more N-substituted maleimide groups and a derivative thereof; and (B) a modified conjugated diene polymer, the component (B) being one resulting from modification of (b1) a conjugated diene polymer having a vinyl group in the side chain with (b2) a maleimide compound having two or more N-substituted maleimide groups and also to a prepreg, a laminate, a resin film, a multilayer printed wiring board, and a semiconductor package, each using the foregoing maleimide resin composition.

Abstract: A refrigerant cycle system includes: a first refrigerant circuit; a second refrigerant circuit independent of the first refrigerant circuit; a heat source-side unit that includes a first heat source-side heat exchange unit and a second heat source-side heat exchange unit; a first use-side unit that includes a first use-side heat exchanger; a first liquid refrigerant connection pipe and a first gas refrigerant connection pipe that connect the first use-side unit to the heat source-side unit; a second use-side unit that includes a second use-side heat exchanger; and a second liquid refrigerant connection pipe and a second gas refrigerant connection pipe that connect the second use-side unit to the heat source-side unit.

Abstract: A resin composition having, in a cured state, a thermal conductivity of 5 W/(m·K) or more and a storage elastic modulus of 8 GPa or less.

Abstract: A method for producing a semiconductor device of the present invention includes: step (I) of disposing one or more semiconductor elements each having an active surface, on a thermosetting resin film containing a thermosetting resin composition, such that the thermosetting resin film and the active surfaces of the semiconductor elements come into contact; step (II) of encapsulating the semiconductor elements disposed on the thermosetting resin film with a member for semiconductor encapsulation; step (III) of providing openings in the thermosetting resin film or a cured product thereof after step (II), the openings extending to the active surfaces of the semiconductor elements; and step (IV) of filling the openings with a conductor or forming a conductor layer inside the openings.

Abstract: An epoxy resin has a mesogenic structure and a siloxane structure. An epoxy resin composition includes the epoxy resin having the mesogenic structure and the siloxane structure, and a curing agent.

Abstract: Provided is a prepreg capable of attaining thermal expansion coefficient reduction and elastic modulus increase without increasing the filling ratio of an inorganic filler therein and/or without using a resin having a low thermal expansion coefficient, and thereby capable of reducing warpage thereof. Specifically, provided is a prepreg containing glass fibers and a thermosetting resin composition, and containing a layer of plural glass fiber filaments aligned to run nearly parallel to each other in one direction. Also provided are a production method for the prepreg, a laminate containing the prepreg and its production method, a printed circuit board containing the laminate, and a semiconductor package having a semiconductor device mounted on the printed circuit board.