Abstract: An input interface receives a trigger signal. A processor displays a first screen or a second screen on a display device based on the trigger signal. The first screen provides first medical information for each of a plurality of subjects. The second screen provides, for at least one of the plurality of subjects, second medical information that is not included in the first medical information.

Abstract: A seat cushion is formed integrally by a body pad portion, an outer peripheral edge portion, and a connection portion. The outer peripheral edge portion protrudes toward a floor panel from the outer peripheral edge portion in a plan view and contacts a floor panel at its lower face. The connection portion is provided to protrude toward the floor panel at a portion which is separated from a front-side part of the outer peripheral edge portion and a rear-side part of the outer peripheral edge portion, respectively. The connection portion connects the floor panel and the body pad portion. A portion between the front-side part and the rear-side part of the outer peripheral edge portion in a vehicle longitudinal direction is a separation portion where a lower face of the seat cushion faces an upper face of the floor panel with a gap.

Abstract: A conductive member includes an adhesive layer and a metal foil layer. The adhesive layer consists of an adhesive composition containing conductive particles. The metal foil layer is disposed on the adhesive layer. The conductive member can be used to form, for example, a predetermined metal film.

Abstract: A method for evaluating the compatibility of a thermosetting resin composition containing at least two kinds of resins and an inorganic filler, the method including the following steps 1A and 2A: Step 1A: a step of obtaining a reflected electronic image of the cross section of a cured product of the thermosetting resin composition using a scanning electron microscope at an observation magnification of 50 to 250 times; and Step 2A: a step in which, in the reflected electronic image, a phase-separated resin region is referred to as a separation part and the remaining region is referred to as a non-separation part, and the image is binarized such that the separation part has one value and the non-separation part has the other value, and the area ratio of the region of the non-separation part of the resultant binarized image to the total region of the binarized image (area of the region of the non-separation part×100/area of the total region of the binarized image) is calculated as the area ratio Rw of the non-se

Abstract: An epoxy resin has a mesogenic structure and a siloxane structure. An epoxy resin composition includes the epoxy resin having the mesogenic structure and the siloxane structure, and a curing agent.

Abstract: The present invention provides a buffer sheet composition including a thermosetting compound, which buffer sheet composition is used for producing a buffer sheet to be interposed between a heating member and an electronic component, when the electronic component is heated by the heating member so as to mount the electronic component on a substrate, as well as a buffer sheet including a thermosetting composition layer obtained by forming the buffer sheet composition into the form of a sheet.

Abstract: The present invention relates to a maleimide resin composition including (A) at least one selected from the group consisting of a maleimide compound having two or more N-substituted maleimide groups and a derivative thereof; and (B) a modified conjugated diene polymer, the component (B) being one resulting from modification of (b1) a conjugated diene polymer having a vinyl group in the side chain with (b2) a maleimide compound having two or more N-substituted maleimide groups and also to a prepreg, a laminate, a resin film, a multilayer printed wiring board, and a semiconductor package, each using the foregoing maleimide resin composition.

Abstract: A refrigerant cycle system includes: a first refrigerant circuit; a second refrigerant circuit independent of the first refrigerant circuit; a heat source-side unit that includes a first heat source-side heat exchange unit and a second heat source-side heat exchange unit; a first use-side unit that includes a first use-side heat exchanger; a first liquid refrigerant connection pipe and a first gas refrigerant connection pipe that connect the first use-side unit to the heat source-side unit; a second use-side unit that includes a second use-side heat exchanger; and a second liquid refrigerant connection pipe and a second gas refrigerant connection pipe that connect the second use-side unit to the heat source-side unit.

Abstract: A resin composition having, in a cured state, a thermal conductivity of 5 W/(m·K) or more and a storage elastic modulus of 8 GPa or less.

Abstract: A method for producing a semiconductor device of the present invention includes: step (I) of disposing one or more semiconductor elements each having an active surface, on a thermosetting resin film containing a thermosetting resin composition, such that the thermosetting resin film and the active surfaces of the semiconductor elements come into contact; step (II) of encapsulating the semiconductor elements disposed on the thermosetting resin film with a member for semiconductor encapsulation; step (III) of providing openings in the thermosetting resin film or a cured product thereof after step (II), the openings extending to the active surfaces of the semiconductor elements; and step (IV) of filling the openings with a conductor or forming a conductor layer inside the openings.

Abstract: An epoxy resin has a mesogenic structure and a siloxane structure. An epoxy resin composition includes the epoxy resin having the mesogenic structure and the siloxane structure, and a curing agent.

Abstract: Provided is a prepreg capable of attaining thermal expansion coefficient reduction and elastic modulus increase without increasing the filling ratio of an inorganic filler therein and/or without using a resin having a low thermal expansion coefficient, and thereby capable of reducing warpage thereof. Specifically, provided is a prepreg containing glass fibers and a thermosetting resin composition, and containing a layer of plural glass fiber filaments aligned to run nearly parallel to each other in one direction. Also provided are a production method for the prepreg, a laminate containing the prepreg and its production method, a printed circuit board containing the laminate, and a semiconductor package having a semiconductor device mounted on the printed circuit board.

Abstract: Provided is an on-chip monitor circuit mounted on a semiconductor chip that is equipped with a security function module for performing a security function process on an input signal and outputting a security function signal, the on-chip monitor circuit comprising a monitor circuit for monitoring signal waveforms of the semiconductor chip, wherein the circuit is provided with a first storage means for storing data that designates a window period in which to perform a test of the semiconductor chip, and a control means for performing control to operate the circuit during the window period, when a prescribed test signal is inputted to the security function module. By using the on-chip monitor circuit in a semiconductor chip of which security is required, security attacks, e.g., a Trojan horse or the like, intended to embed a malicious circuit in the production stage of security function module-equipped semiconductors chips, can be prevented.

Abstract: A method for producing a semiconductor device of the present invention includes: step (I) of disposing one or more semiconductor elements each having an active surface, on a thermosetting resin film containing a thermosetting resin composition, such that the thermosetting resin film and the active surfaces of the semiconductor elements come into contact; step (II) of encapsulating the semiconductor elements disposed on the thermosetting resin film with a member for semiconductor encapsulation; step (III) of providing openings in the thermosetting resin film or a cured product thereof after step (II), the openings extending to the active surfaces of the semiconductor elements; and step (IV) of filling the openings with a conductor or forming a conductor layer inside the openings.

Abstract: A roof ditch molding end cap for a roof ditch of a vehicle includes a body member having a first attachment surface and a second attachment surface. The second attachment surface is disposed at an angle with respect to the first attachment surface. The first attachment surface is configured to slidably engage the roof ditch of the vehicle. The second attachment surface has a locking member configured to engage a second fastening member disposed in the roof ditch of the vehicle to substantially prevent movement of the roof ditch molding end cap.

Abstract: A roof ditch molding end cap for a roof ditch of a vehicle includes a body member having a first attachment surface and a second attachment surface. The second attachment surface is disposed at an angle with respect to the first attachment surface. The first attachment surface is configured to slidably engage the roof ditch of the vehicle. The second attachment surface has a locking member configured to engage a second fastening member disposed in the roof ditch of the vehicle to substantially prevent movement of the roof ditch molding end cap.

Abstract: The present invention provides a buffer sheet composition including a thermosetting compound, which buffer sheet composition is used for producing a buffer sheet to be interposed between a heating member and an electronic component, when the electronic component is heated by the heating member so as to mount the electronic component on a substrate, as well as a buffer sheet including a thermosetting composition layer obtained by forming the buffer sheet composition into the form of a sheet.

Abstract: A method for manufacturing a structure containing a conductor circuit according to the present invention can provide openings in various shapes by patterning a first photosensitive resin layer in a first patterning process according to shapes of openings formed in a heat-curable resin layer. Further, in the method for manufacturing a structure containing a conductor circuit, a plurality of openings can be formed at the same time and a residue of the resin around the opening can be reduced, unlike a case in which openings are formed with a laser. Therefore, it is possible to sufficiently efficiently manufacture the structure having excellent reliability even when the number of pins of a semiconductor element increases and it is necessary to provide a great number of fine openings.

Abstract: A film-like epoxy resin composition includes an epoxy resin (A); a curing agent (B); a cure accelerator (C);an inorganic filler (D); and an organic solvent (E). The film-like epoxy resin composition satisfies all the following requirements (1) to (4): (1) at least one of the epoxy resin (A) and the curing agent (B) contains a component being a liquid at 25° C. in an amount of 30% by mass or more based on the total mass of the epoxy resin (A) and the curing agent (B); (2) the content of a volatile portion that volatilizes by being heated at 180° C. for 10 minutes is 0.2% to 1.5% by mass based on the total amount of the epoxy resin composition; (3) the minimum melt viscosity in temperature rising from 40° C. to 200° C. is 800 Pa·s or less; and (4) the film thickness is 50 to 500 ?m.

Abstract: Provided is an on-chip monitor circuit mounted on a semiconductor chip that is equipped with a security function module for performing a security function process on an input signal and outputting a security function signal, the on-chip monitor circuit comprising a monitor circuit for monitoring signal waveforms of the semiconductor chip, wherein the circuit is provided with a first storage means for storing data that designates a window period in which to perform a test of the semiconductor chip, and a control means for performing control to operate the circuit during the window period, when a prescribed test signal is inputted to the security function module. By using the on-chip monitor circuit in a semiconductor chip of which security is required, security attacks, e.g., a Trojan horse or the like, intended to embed a malicious circuit in the production stage of security function module-equipped semiconductors chips, can be prevented.