Abstract: An object of the present invention is to provide a low-priced and highly reliable high-vacuum hermetic seal package. To this end, a method of manufacturing a hermetic seal package according to the present invention is a method of manufacturing a hermetic seal package by anodically bonding an opening of a cylindrical body for forming an outer frame and the outer edge of a flat glass plate to each other, characterized in that anodically bonded surfaces are 0.04 mm to 200 mm in width and not more than 0.20 ?m in surface roughness, the cylindrical body consists of a metal consisting of at least one of Fe, Ni and Co or an alloy or conductive ceramics mainly composed of this metal, the glass plate contains alkaline metal ions, and the quantity of inert gas permeation on bonded portions is 1.0×10?15 Pa.m3/s to 1.0×10?8 Pa.m3/s after anodic bonding.

Abstract: A method of producing a polyarylene oxide comprising a step of oxidative polymerization of a monomer represented by the general formula (1) in an organic solvent in the presence of a transition metal compound, wherein, Ar represents a benzene ring or a naphthalene ring, R1 represents a hydrocarbon group optionally substituted, a hydrocarbonoxy group optionally substituted, or a halogen atom; a represents an integer of 0 to 5, and when a is 2 or more, R1s may be the same or different, adjacent R1s may mutually bond to form a ring; R2 represents a single bond or an arylene group; R3 represents a hydrocarbon group optionally substituted or a trialkylsilyl group.

Abstract: A surface mounting package includes a metal base with a lower surface having a through hole, a metal lead arranged to be inserted into the through hole, an insulating material arranged at an internal space of the metal base, a cap covering the metal base as a lid, and an electronic part component arranged at a surface of the metal lead that is positioned at the internal space of the metal base. The internal space is held at an air-tight atmosphere. The metal lead forms a surface for attaching the metal base to a mounting board. An insulation distance between the metal lead and the metal base is at least 0.05 mm and at most 0.3 mm.

Abstract: A surface mounting package includes a metal base with a lower surface having a through hole, a metal lead arranged to be inserted into the through hole, an insulating material arranged at an internal space of the metal base, a cap covering the metal base as a lid, and an electronic part component arranged at a surface of the metal lead that is positioned at the internal space of the metal base. The internal space is held at an air-tight atmosphere. The metal lead forms a surface for attaching the metal base to a mounting board. An insulation distance between the metal lead and the metal base is at least 0.05 mm and at most 0.3 mm.

Abstract: A surface mounting package includes a metal base (1) with a lower surface having a through hole, a metal lead (2) arranged to be inserted into the through hole, an insulating material (3) filling in an internal space defined by the metal base (1), a cap (30) covering the metal base (1) as a lid, and an electronic part component arranged at a surface (2i) on the internal space side of the metal lead (2). The internal space is held at an air-tight atmosphere. The metal base (1) has a lower surface positioned on the same plane as a lower surface of the metal lead (2) or the insulating material (3), the same plane (P) forming a plane to be attached to a mounting board.

Abstract: There is provided a process for producing 2-bromocyclopentanone which process is characterized in that cyclopentanone is reacted with bromine in a biphasic mixture of water and an organic solvent.

Abstract: There is provided a process for producing 2-bromocyclopentanone which process is characterized in that cyclopentanone is reacted with bromine in a biphasic mixture of water and an organic solvent.