Patents by Inventor Daisuke Hayashi

Daisuke Hayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260185905
    Abstract: A fluid control apparatus 100 is provided with a second flow rate calculation unit 431 that calculates a flow rate flowing through a fluid resistor 33 based on a change over time in an upstream-side pressure P1 or a downstream-side pressure P2 in a state in which a fluid control valve 32 is closed, and with a diagnostic parameter calculation unit 432 that calculates a diagnostic parameter based on a first flow rate calculated by a first flow rate calculation unit 431, and on a second flow rate calculated by the second flow rate calculation unit 432 in a state in which the fluid control valve 32 is closed.
    Type: Application
    Filed: December 12, 2025
    Publication date: July 2, 2026
    Inventors: Kazuya TOKUNAGA, Seiji HIGUCHI, Daisuke HAYASHI, Kotaro TAKIJIRI
  • Publication number: 20260186514
    Abstract: A diagnostic mechanism includes: a valve leak difference calculation unit that calculates a valve leak difference that is a difference between a valve leak pressure change model indicating a pressure change due to a valve leak of a fluid control valve and an upstream pressure detected by an upstream pressure sensor or a downstream pressure detected by a downstream pressure sensor; a sensor shift difference calculation unit that calculates a sensor shift difference that is a difference between a sensor shift pressure change model indicating a pressure change due to a sensor shift of the upstream pressure sensor or the downstream pressure sensor and the upstream pressure or the downstream pressure; and a diagnostic unit that compares the valve leak difference with the sensor shift difference to diagnose whether the fluid control valve is abnormal or whether each of the pressure sensors is abnormal.
    Type: Application
    Filed: December 18, 2025
    Publication date: July 2, 2026
    Inventors: Daisuke HAYASHI, Seiji HIGUCHI, Kotaro TAKIJIRI, Kazuya TOKUNAGA
  • Patent number: 12605142
    Abstract: A material for an acoustic matching layer contains the following components (A), (B), and (C): (A) an epoxy resin; (B) a curing agent; and (C) surface-treated tungsten carbide particles subjected to a surface treatment with a surface treatment agent including at least one of an aminosilane compound, a mercaptosilane compound, an isocyanatosilane compound, a thiocyanatosilane compound, an aluminum alkoxide compound, a zirconium alkoxide compound, or a titanium alkoxide compound.
    Type: Grant
    Filed: September 7, 2022
    Date of Patent: April 21, 2026
    Assignee: FUJIFILM Corporation
    Inventors: Kazuhiro Hamada, Yoshihiro Nakai, Daisuke Hayashi
  • Patent number: 12565548
    Abstract: A compound represented by General Formula (1) (A1-R1—SpZS—R2—P1)q. In General Formula (1), P1 represents a polymer structure including a partial structure represented by General Formula (2) *—X2—OY1—On1X1. In General Formula (2), n is 1 or more, in a case where n1 is 1, X1 represents a monovalent organic group, X2 represents a divalent organic group, Y1 represents a branched divalent hydrocarbon group, and Y1 and X1 or X2 may form a ring, provided that the ring is a four- or more membered ring, and in a case where n1 is 2 or more, X1 represents a hydrogen atom or a monovalent organic group, X2 represents a divalent organic group, Y1 represents a divalent organic group, and one or more Y1's each represent a branched divalent organic group, and Y1 and X1 or X2 may form a ring.
    Type: Grant
    Filed: March 20, 2024
    Date of Patent: March 3, 2026
    Assignee: FUJIFILM Corporation
    Inventors: Daisuke Hayashi, Keita Takahashi
  • Publication number: 20250372417
    Abstract: In order to provide a wafer temperature control device capable of estimating a wafer temperature with sufficient accuracy and controlling the wafer temperature to a target temperature even when a cooling operation amount input to a cooler is changed, a heater that heats a wafer according to an input heating operation amount, a cooler that cools the wafer [W] according to an input cooling operation amount, a vicinity temperature measuring instrument that measures a vicinity temperature of the wafer, a temperature estimation observer that estimates the wafer temperature on a basis of the vicinity temperature measured by the vicinity temperature measuring instrument, and the cooling operation amount input to the cooler or the cooling amount output from the cooler, and a temperature controller that controls the cooling operation amount so as to reduce a temperature deviation between a set temperature and the estimated wafer temperature are provided.
    Type: Application
    Filed: August 2, 2022
    Publication date: December 4, 2025
    Inventors: Kotaro TAKIJIRI, Daisuke HAYASHI
  • Publication number: 20250347672
    Abstract: Provided is an information processing method, wherein an information processing device executes: acquiring measurement values of one or a plurality of factor items related to a biostimulant effect factor of a plant from the plant to which a material with a function of enhancing tolerance to abiotic stress has been applied; weighting each acquired measurement value of each factor item using each weight; and calculating an evaluation value of the material by inputting each measurement value weighted by each of the weights into a function related to evaluation of the material.
    Type: Application
    Filed: July 6, 2023
    Publication date: November 13, 2025
    Inventors: Daisuke HAYASHI, Yukiko OHDO
  • Patent number: 12463069
    Abstract: The present invention is a wafer temperature control device for controlling the temperature of a wafer by regulating the pressure of a heat transfer gas, the wafer temperature control device being capable of estimating the temperature of the wafer with sufficient accuracy and controlling the temperature of the wafer to a target temperature, and including: a pressure regulator configured to regulate the pressure of the heat transfer gas; a nearby temperature sensor configured to measure a nearby temperature of the wafer, a temperature estimation observer configured to estimate the temperature of the wafer based on the nearby temperature measured by the nearby temperature sensor and a manipulated pressure variable input to the pressure regulator or the pressure regulated by the pressure regulator, and a controller configured to control the manipulated pressure variable based on a temperature setting and an estimated wafer temperature estimated by the temperature estimation observer.
    Type: Grant
    Filed: October 11, 2023
    Date of Patent: November 4, 2025
    Assignee: HORIBA STEC, Co., Ltd.
    Inventors: Daisuke Hayashi, Kotaro Takijiri
  • Patent number: 12448555
    Abstract: The present invention provides a composition for forming a thermally conductive material, from which a thermally conductive material having excellent adhesiveness can be obtained. In addition, the present invention provides a thermally conductive material and a surface-modified inorganic substance. The composition for forming a thermally conductive material of the present invention is a composition for forming a thermally conductive material containing a surface-modified inorganic substance and a thermosetting compound, the surface-modified inorganic substance satisfying at least one of Requirement 1 or Requirement 2. Requirement 1: The surface-modified inorganic substance includes a surface-modified inorganic substance X containing the inorganic substance, and a surface modifier A and a surface modifier B adsorbed on a surface of the inorganic substance.
    Type: Grant
    Filed: January 13, 2022
    Date of Patent: October 21, 2025
    Assignee: FUJIFILM Corporation
    Inventors: Daisuke Hayashi, Seiichi Hitomi, Teruki Niori, Keita Takahashi
  • Patent number: 12437578
    Abstract: An image data processing device and a system capable of efficiently detecting a face from an image including a plurality of faces are provided. A processor executes at least following processes including detecting a face of a person from an image represented by image data by using a first discrimination model and discriminating an attribute of the detected face, clustering an area where the face is detected in the image represented by the image data according to a type of the attribute of the face, selecting a second discrimination model to be applied to the area based on information on the type of the attribute of the face in the clustered area, and detecting a face of a person from an image of each area by using the second discrimination model applied to the area and discriminating an attribute of the detected face.
    Type: Grant
    Filed: December 7, 2022
    Date of Patent: October 7, 2025
    Assignee: FUJIFILM Corporation
    Inventors: Daisuke Hayashi, Shunta Ego, Masahiro Terada, Kenji Makino
  • Patent number: 12421426
    Abstract: A composition contains an inorganic nitride, and a compound represented by General Formula (1).
    Type: Grant
    Filed: June 10, 2021
    Date of Patent: September 23, 2025
    Assignee: FUJIFILM Corporation
    Inventors: Daisuke Hayashi, Seiichi Hitomi, Teruki Niori, Keita Takahashi
  • Publication number: 20250291370
    Abstract: The present invention makes it possible to perform highly accurate flow rate control while also achieving a fast response. Based on a deviation between a flow rate measurement value output by a flow rate sensor and a flow rate estimation value output by a flow rate sensor model, an observer determines a model error estimation value, which is obtained by estimating a model error in the flow rate sensor model relative to the flow rate sensor, and a flow rate error estimation value, which is obtained by estimating a flow rate error caused by a change in a fluid control valve, and inputs the model error estimation value into the flow rate sensor model, and then outputs an estimation value to a feedback controller based on the flow rate error estimation value and the valve flow rate estimation value output by the valve model.
    Type: Application
    Filed: February 28, 2025
    Publication date: September 18, 2025
    Inventors: Chihiro HAMADA, Daisuke HAYASHI
  • Publication number: 20250282920
    Abstract: A polymer film including a silsesquioxane polymer, in which the polymer film has a dielectric loss tangent of 0.01 or less, and applications thereof.
    Type: Application
    Filed: May 23, 2025
    Publication date: September 11, 2025
    Applicant: FUJIFILM Corporation
    Inventors: Daisuke HAYASHI, Hiroshi INADA, Shohei YAMAZAKI
  • Patent number: 12405753
    Abstract: Mechanisms are provided for writing files to tape storage. A set of files to be written to the tape storage are identified and, for each file, metadata associated with the file indicating identifiers of users associated with the file is retrieved. For each file, a predicted frequency metric, specifying a predicted frequency of access of the file, is determined based on the identifiers of users associated with the file specified in the associated metadata. The files are sorted to generate a ranked set of files in which each file is ranked relative to the other files in the set of files based on their corresponding predicted frequency metric. The ranked set of files is written to the tape storage in descending order of predicted frequency metric such that files having relatively larger predicted frequency metrics are written relatively closer to a starting boundary of a partition of the tape storage.
    Type: Grant
    Filed: April 4, 2024
    Date of Patent: September 2, 2025
    Assignee: International Business Machines Corporation
    Inventors: Tohru Hasegawa, Takahito Tashiro, Takuya Goto, Daisuke Hayashi, Kazuki Matsumaru
  • Patent number: 12391859
    Abstract: A composition for forming a thermally conductive material contains a compound represented by General Formula (1), a phenolic compound, and an inorganic substance, in which a content of the compound represented by General Formula (1) is 30.0% by mass or greater with respect to a total organic solid content, (X—Z1—)m-A-(—Z2—Y)n??(1).
    Type: Grant
    Filed: July 26, 2021
    Date of Patent: August 19, 2025
    Assignee: FUJIFILM Corporation
    Inventors: Daisuke Hayashi, Seiichi Hitomi, Teruki Niori, Keita Takahashi
  • Publication number: 20250256484
    Abstract: A polymer film including: a layer A; and a layer B provided on at least one surface of the layer A, in which the layer A contains a polymer having a dielectric loss tangent of 0.01 or less, the layer B has a moisture permeability of less than 560 g/(m2·day) at a temperature of 80° C. and a relative humidity of 90%, and the layer B has a moisture absorption rate of 2.5% or less at a temperature of 25° C. and a relative humidity of 80%.
    Type: Application
    Filed: April 27, 2025
    Publication date: August 14, 2025
    Applicant: FUJIFILM Corporation
    Inventors: Miyoko SHIBANO, Yasuyuki SASADA, Keita TAKAHASHI, Hiroshi INADA, Daisuke HAYASHI, Naoyuki MOROOKA
  • Patent number: 12376774
    Abstract: Provided are an information processing system, an information processing method, and an information processing apparatus that can grasp an emotion transmission ability. An index of emotion of a person in a first area is measured. Map data representing the measured index in association with a position of the person in the first area is created. An emotion transmission ability of the person is estimated based on the created map data. Information on the estimated emotion transmission ability of the person is stored in a storage unit.
    Type: Grant
    Filed: March 7, 2022
    Date of Patent: August 5, 2025
    Assignee: FUJIFILM Corporation
    Inventors: Kenji Makino, Masahiro Terada, Daisuke Hayashi, Shunta Ego
  • Publication number: 20250185741
    Abstract: A button removal jig can disassemble a button into plural parts when the button attached to a fabric is removed from the fabric. The button removal jig includes: a base; a press receiving portion arranged above the base and descending from an initial position when it is pressed; a separation plate arranged below the base and ascending and descending together with the press receiving portion; and a deformation-applying portion extending downward from the press receiving portion for deforming the button. The base includes a first button placing portion for placing the button. The separation plate includes a second button placing portion, which is provided at a position corresponding to the first button placing portion.
    Type: Application
    Filed: March 11, 2022
    Publication date: June 12, 2025
    Inventors: Daisuke Hayashi, Noboru Shimizu, Masahiro Funamizu, Yoshio Takamura, Toru Shimizu
  • Publication number: 20250178313
    Abstract: Provided are: a laminate including a layer A, a layer B on at least one surface of the layer A, and a conductive pattern in contact with at least a part of the layer B, in which the laminate has a dielectric loss tangent of 0.01 or less at 28 GHz, and a value obtained by subtracting a mass residual rate at 900° C. from a mass residual rate at 440° C. of the layer B is 40% by mass or more; a film including a layer A and a layer B on at least one surface of the layer A, in which the film has a dielectric loss tangent of 0.01 or less at 28 GHz, an elastic modulus of the layer B is 0.5 MPa or less at 160° C., and the layer B contains a thermosetting resin; a thermosetting film; and a method of manufacturing a wiring board using the film and the thermosetting film.
    Type: Application
    Filed: February 13, 2025
    Publication date: June 5, 2025
    Applicant: FUJIFILM Corporation
    Inventors: Daisuke HAYASHI, Keita TAKAHASHI
  • Patent number: 12291086
    Abstract: A weather strip couples to a flange with curved parts of a sliding door of an automobile. The weather strip includes an installation base member, a hollow part, and an insert. The installation base member couples to the flange and includes an inner-cabin side wall, a first outer-cabin side wall, and a connecting wall. A part of the installation base member which couples to the curved parts is cut out, to provide a cut-out portion. The cut-out portion is subjected to die molding, to provide a die-molded part. The hollow part is integrally formed with the installation base member by extrusion molding. The insert is shaped in conformance with the curved parts and is embedded in the die-molded part with a plurality of concave shaped parts of the insert abutted with a plurality of pins of a die under the die molding.
    Type: Grant
    Filed: November 23, 2022
    Date of Patent: May 6, 2025
    Assignees: NISHIKAWA RUBBER CO., LTD., AISIN CORPORATION
    Inventors: Yoichiro Sasaki, Daisuke Hayashi, Yasutaka Shinoda, Motonari Inagaki
  • Patent number: 12276149
    Abstract: A first end of an insert fills up a space of a hollow part of a protector, and a second end includes an insulator to insulate a first wire connection part where a first leg of a resistor is piled on a first core wire from a second wire connection part where a second leg of the resistor is piled on a second core wire. Die-molding material covers the insulator, the first and second core wires, the resistor, the first and second legs, and the first and second wire connection parts. The insulator has a tabular shape, and the insulator has left and right side ends exposed from a part covered with the die-molding material. The insert includes a second protrusion on a connection part between the first and second ends of the insert. The second protrusion is closer to an inner side part than an inner surface of the insulator.
    Type: Grant
    Filed: June 29, 2022
    Date of Patent: April 15, 2025
    Assignees: NISHIKAWA RUBBER CO., LTD., AISIN CORPORATION
    Inventors: Yoichiro Sasaki, Daisuke Hayashi, Wataru Hattori