Patents by Inventor Daisuke Horikoshi

Daisuke Horikoshi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11274076
    Abstract: A process for preparing a compound represented by Formula [1], the process comprising a step of hydrolyzing a compound represented by Formula [2] under an acidic or basic condition, and a step of reacting a compound represented by Formula [3] with a metal acetate salt, and a step of halogenating a compound represented by Formula [4]; a process for preparing a compound represented by Formula [1] comprising a step of reacting a compound represented by Formula [3] with a metal acetate salt, and then, adding alcohol, water, or base to the reaction solution to perform reaction; a process for preparing a compound represented by Formula [1] comprising a step of reacting a compound represented by Formula [3] under a presence or absence of a base, an ionic liquid and a metal sulfate salt, in water or a mixed solvent of water and an organic solvent; a compound represented by Formula [2] or a salt of the same; and a compound represented by Formula [3] or a salt of the same.
    Type: Grant
    Filed: February 8, 2016
    Date of Patent: March 15, 2022
    Assignee: GOWAN COMPANY, L.L.C.
    Inventors: Tsuyoshi Kawano, Makoto Bamba, Daisuke Horikoshi
  • Publication number: 20210324915
    Abstract: An object of the present invention is to provide a sealed bearing that can reduce electromagnetic noise at all times. A sealed bearing (bearing 100) according to the present invention includes a seal 110 for covering a ball 106 from a side between an inner ring 102 and an outer ring 104. The seal 110 is formed of a conductive resin material, and when an oil film parameter of a track surface of the bearing 100 is 1.0 or more, an impedance of a circuit that passes through the inner ring 102 and the outer ring 104 via the seal 110 is smaller than an impedance of a circuit that passes through the inner ring 102 and the outer ring 104 via the ball 106.
    Type: Application
    Filed: April 17, 2020
    Publication date: October 21, 2021
    Inventor: Daisuke Horikoshi
  • Patent number: 10104891
    Abstract: The invention relates to a compound or a salt thereof of formula [1], a fungicidal composition containing the compound or a salt thereof, a method for controlling plant disease occurring from phytopathogenic microorganism including the step of applying the fungicidal composition and a production method of the compound.
    Type: Grant
    Filed: April 19, 2018
    Date of Patent: October 23, 2018
    Assignee: SDS BIOTECH K.K.
    Inventors: Hiroshi Wada, Daisuke Horikoshi, Makoto Bamba, Tsuyoshi Kawano, Takatoshi Sakaguchi
  • Publication number: 20180235225
    Abstract: The invention relates to a compound or a salt thereof of formula [1], a fungicidal composition containing the compound or a salt thereof, a method for controlling plant disease occurring from phytopathogenic microorganism including the step of applying the fungicidal composition and a production method of the compound.
    Type: Application
    Filed: April 19, 2018
    Publication date: August 23, 2018
    Inventors: Hiroshi Wada, Daisuke Horikoshi, Makoto Bamba, Tsuyoshi Kawano, Takatoshi Sakaguchi
  • Patent number: 9980487
    Abstract: The invention relates to a compound or a salt thereof of formula [1], a fungicidal composition containing the compound or a salt thereof, a method for controlling plant disease occurring from phytopathogenic microorganism including the step of applying the fungicidal composition and a production method of the compound.
    Type: Grant
    Filed: June 11, 2015
    Date of Patent: May 29, 2018
    Assignee: SDS BIOTECH K.K.
    Inventors: Hiroshi Wada, Daisuke Horikoshi, Makoto Bamba, Tsuyoshi Kawano, Takatoshi Sakaguchi
  • Publication number: 20170231226
    Abstract: The invention relates to a compound or a salt thereof of formula [1], a fungicidal composition containing the compound or a salt thereof, a method for controlling plant disease occurring from phytopathogenic microorganism including the step of applying the fungicidal composition and a production method of the compound.
    Type: Application
    Filed: June 11, 2015
    Publication date: August 17, 2017
    Applicant: SDS BIOTECH K.K.
    Inventors: Hiroshi Wada, Daisuke Horikoshi, Makoto Bamba, Tsuyoshi Kawano, Takatoshi Sakaguchi