Patents by Inventor Daisuke INOKAWA

Daisuke INOKAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9228084
    Abstract: A phenolic resin molding compound includes (A) a novolac-type phenolic resin including an alkylbenzene-modified novolac-type phenolic resin, (B) a resol-type phenolic resin, (C) hexamethylenetetramine, (D) graphite, and (E) fiber-shaped filler, wherein in regard to the content of each component on the basis of the entirety of the molding compound, a total content of the components (A) to (C) is 30 to 40% by weight, a content of the component (D) is 30 to 50% by weight, and a content of the component (E) is 5 to 20% by weight.
    Type: Grant
    Filed: November 15, 2013
    Date of Patent: January 5, 2016
    Assignee: SUMITOMO BAKELITE CO., LTD.
    Inventor: Daisuke Inokawa
  • Patent number: 9085694
    Abstract: Provided is a phenolic resin molding compound including (A) a novolac-type phenolic resin including an alkylbenzene-modified novolac-type phenolic resin, (B) a resol-type phenolic resin, (C) hexamethylenetetramine, (D) graphite, and (E) fiber-shaped filler, wherein in regard to the content of each component on the basis of the entirety of the molding compound, a total content of the components (A) to (C) is 30 to 40% by weight, a content of the component (D) is 30 to 50% by weight, and a content of the component (E) is 5 to 20% by weight.
    Type: Grant
    Filed: September 5, 2012
    Date of Patent: July 21, 2015
    Assignee: SUMITOMO BAKELITE CO., LTD.
    Inventor: Daisuke Inokawa
  • Patent number: 8901226
    Abstract: A phenolic resin molding compound, which is thermally stable in a heating cylinder, is provided. By using the phenolic resin molding compound, moldings with an excellent dimensional precision can be obtained. The phenolic resin molding compound comprises: (A) a novolac phenolic resin with an o/p ratio (ortho/para ratio) of 0.7 to 0.9; (B) a novolac phenolic resin with an o/p ratio of 1.1 to 1.3; (C) talc; and (D) a polyethylene or polyethylene/polypropylene copolymer. The amount of (D) the polyethylene or polyethylene/polypropylene copolymer relative to a total weight of the phenolic resin molding compound is 0.5 to 1.5 weight %. It is preferable that the total amount of (A) and (B) is 20 to 40 weight %, and the amount of (C) is 5 to 15 weight %.
    Type: Grant
    Filed: March 22, 2013
    Date of Patent: December 2, 2014
    Assignee: Sumitomo Bakelite Co., Ltd.
    Inventor: Daisuke Inokawa
  • Publication number: 20140073732
    Abstract: A phenolic resin molding compound includes (A) a novolac-type phenolic resin including an alkylbenzene-modified novolac-type phenolic resin, (B) a resol-type phenolic resin, (C) hexamethylenetetramine, (D) graphite, and (E) fiber-shaped filler, wherein in regard to the content of each component on the basis of the entirety of the molding compound, a total content of the components (A) to (C) is 30 to 40% by weight, a content of the component (D) is 30 to 50% by weight, and a content of the component (E) is 5 to 20% by weight.
    Type: Application
    Filed: November 15, 2013
    Publication date: March 13, 2014
    Applicant: SUMITOMO BAKELITE CO., LTD.
    Inventor: Daisuke Inokawa
  • Publication number: 20130281600
    Abstract: A phenolic resin molding compound, which is thermally stable in a heating cylinder, is provided. By using the phenolic resin molding compound, moldings with an excellent dimensional precision can be obtained. The phenolic resin molding compound comprises: (A) a novolac phenolic resin with an o/p ratio (ortho/para ratio) of 0.7 to 0.9; (B) a novolac phenolic resin with an o/p ratio of 1.1 to 1.3; (C) talc; and (D) a polyethylene or polyethylene/polypropylene copolymer. The amount of (D) the polyethylene or polyethylene/polypropylene copolymer relative to a total weight of the phenolic resin molding compound is 0.5 to 1.5 weight %. It is preferable that the total amount of (A) and (B) is 20 to 40 weight %, and the amount of (C) is 5 to 15 weight %.
    Type: Application
    Filed: March 22, 2013
    Publication date: October 24, 2013
    Applicant: SUMITOMO BAKELITE CO., LTD.
    Inventor: Daisuke Inokawa
  • Publication number: 20130059974
    Abstract: Provided is a phenolic resin molding compound including (A) a novolac-type phenolic resin including an alkylbenzene-modified novolac-type phenolic resin, (B) a resol-type phenolic resin, (C) hexamethylenetetramine, (D) graphite, and (E) fiber-shaped filler, wherein in regard to the content of each component on the basis of the entirety of the molding compound, a total content of the components (A) to (C) is 30 to 40% by weight, a content of the component (D) is 30 to 50% by weight, and a content of the component (E) is 5 to 20% by weight.
    Type: Application
    Filed: September 5, 2012
    Publication date: March 7, 2013
    Applicant: SUMITOMO BAKELITE CO., LTD.
    Inventor: Daisuke INOKAWA